CN100400467C - 具有高导热性的受热器、其制造方法和用途 - Google Patents
具有高导热性的受热器、其制造方法和用途 Download PDFInfo
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- CN100400467C CN100400467C CNB200480006559XA CN200480006559A CN100400467C CN 100400467 C CN100400467 C CN 100400467C CN B200480006559X A CNB200480006559X A CN B200480006559XA CN 200480006559 A CN200480006559 A CN 200480006559A CN 100400467 C CN100400467 C CN 100400467C
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/528—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from carbonaceous particles with or without other non-organic components
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/653—Processes involving a melting step
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3279—Nickel oxides, nickalates, or oxide-forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3817—Carbides
- C04B2235/3826—Silicon carbides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
- C04B2235/402—Aluminium
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
- C04B2235/407—Copper
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
- C04B2235/408—Noble metals
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/422—Carbon
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/422—Carbon
- C04B2235/427—Diamond
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/428—Silicon
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- C—CHEMISTRY; METALLURGY
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/604—Pressing at temperatures other than sintering temperatures
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/608—Green bodies or pre-forms with well-defined density
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATGM164/2003 | 2003-03-11 | ||
| AT0016403U AT7382U1 (de) | 2003-03-11 | 2003-03-11 | Wärmesenke mit hoher wärmeleitfähigkeit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1759078A CN1759078A (zh) | 2006-04-12 |
| CN100400467C true CN100400467C (zh) | 2008-07-09 |
Family
ID=32967982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200480006559XA Expired - Lifetime CN100400467C (zh) | 2003-03-11 | 2004-01-20 | 具有高导热性的受热器、其制造方法和用途 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8575051B2 (enExample) |
| EP (2) | EP1601630B1 (enExample) |
| JP (2) | JP4880447B2 (enExample) |
| CN (1) | CN100400467C (enExample) |
| AT (1) | AT7382U1 (enExample) |
| WO (2) | WO2004080914A1 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004056734A1 (de) * | 2004-11-24 | 2006-06-01 | Vatcharachai Buanatra | Diamantenformkörper |
| TW200631144A (en) | 2005-02-18 | 2006-09-01 | Mitac Technology Corp | Chip heat dissipation structure and manufacturing method thereof |
| TWI283052B (en) * | 2005-03-02 | 2007-06-21 | Mitac Technology Corp | Chip heat dissipation system and manufacturing method and structure of heat dissipation device thereof |
| TWI290012B (en) | 2005-03-03 | 2007-11-11 | Mitac Technology Corp | Printed circuit board structure and manufacturing method thereof |
| TWI268755B (en) * | 2005-03-21 | 2006-12-11 | Mitac Tech Corporation | Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof |
| US8637127B2 (en) | 2005-06-27 | 2014-01-28 | Kennametal Inc. | Composite article with coolant channels and tool fabrication method |
| US9017438B1 (en) | 2006-10-10 | 2015-04-28 | Us Synthetic Corporation | Polycrystalline diamond compact including a polycrystalline diamond table with a thermally-stable region having at least one low-carbon-solubility material and applications therefor |
| US8236074B1 (en) | 2006-10-10 | 2012-08-07 | Us Synthetic Corporation | Superabrasive elements, methods of manufacturing, and drill bits including same |
| EP2078101A2 (en) | 2006-10-25 | 2009-07-15 | TDY Industries, Inc. | Articles having improved resistance to thermal cracking |
| US8034136B2 (en) | 2006-11-20 | 2011-10-11 | Us Synthetic Corporation | Methods of fabricating superabrasive articles |
| US8080074B2 (en) | 2006-11-20 | 2011-12-20 | Us Synthetic Corporation | Polycrystalline diamond compacts, and related methods and applications |
| WO2009006163A2 (en) * | 2007-06-29 | 2009-01-08 | Itt Manufacturing Enterprises, Inc. | Thermally conductive structural composite material and method |
| SE532992C2 (sv) * | 2007-11-08 | 2010-06-08 | Alfa Laval Corp Ab | Förfarande för framställning av en diamantkomposit, grönkropp, diamantkomposit samt användning av diamantkompositen |
| EP2065734A1 (de) * | 2007-11-30 | 2009-06-03 | Plansee Se | Spiegel zur Laserbearbeitung |
| US8999025B1 (en) | 2008-03-03 | 2015-04-07 | Us Synthetic Corporation | Methods of fabricating a polycrystalline diamond body with a sintering aid/infiltrant at least saturated with non-diamond carbon and resultant products such as compacts |
| US20090236087A1 (en) * | 2008-03-19 | 2009-09-24 | Yamaha Corporation | Heat exchange device |
| US8790439B2 (en) | 2008-06-02 | 2014-07-29 | Kennametal Inc. | Composite sintered powder metal articles |
| US8297382B2 (en) | 2008-10-03 | 2012-10-30 | Us Synthetic Corporation | Polycrystalline diamond compacts, method of fabricating same, and various applications |
| US9315881B2 (en) | 2008-10-03 | 2016-04-19 | Us Synthetic Corporation | Polycrystalline diamond, polycrystalline diamond compacts, methods of making same, and applications |
| US7866418B2 (en) | 2008-10-03 | 2011-01-11 | Us Synthetic Corporation | Rotary drill bit including polycrystalline diamond cutting elements |
| JP2010109081A (ja) * | 2008-10-29 | 2010-05-13 | Denki Kagaku Kogyo Kk | Led発光素子用金属基複合材料基板及びそれを用いたled発光素子 |
| JP5484111B2 (ja) * | 2010-02-08 | 2014-05-07 | 株式会社アライドマテリアル | 半導体素子搭載部材とその製造方法ならびに半導体装置 |
| CN102030556B (zh) * | 2010-11-11 | 2012-10-31 | 北京科技大学 | 一种金刚石/碳化硅陶瓷基复合材料的制备方法 |
| US10309158B2 (en) | 2010-12-07 | 2019-06-04 | Us Synthetic Corporation | Method of partially infiltrating an at least partially leached polycrystalline diamond table and resultant polycrystalline diamond compacts |
| US9027675B1 (en) | 2011-02-15 | 2015-05-12 | Us Synthetic Corporation | Polycrystalline diamond compact including a polycrystalline diamond table containing aluminum carbide therein and applications therefor |
| US9016406B2 (en) | 2011-09-22 | 2015-04-28 | Kennametal Inc. | Cutting inserts for earth-boring bits |
| US20130291445A1 (en) * | 2012-05-01 | 2013-11-07 | Sigma Innovation Technology Inc. | Diamond abrasive grain and electroplated tool having the same |
| JP5350553B1 (ja) | 2013-04-26 | 2013-11-27 | 冨士ダイス株式会社 | 耐熱性の優れたCu−ダイヤモンド基固相焼結体を用いた放熱板、その放熱板を用いたエレクトロニクス用デバイス、および耐熱性の優れたCu−ダイヤモンド基固相焼結体を用いた放熱板の製造方法 |
| CN103496215B (zh) * | 2013-09-25 | 2015-07-29 | 华南理工大学 | 一种嵌入式组合热沉及其制备方法 |
| US9992917B2 (en) | 2014-03-10 | 2018-06-05 | Vulcan GMS | 3-D printing method for producing tungsten-based shielding parts |
| JP5807935B1 (ja) * | 2014-10-09 | 2015-11-10 | 株式会社半導体熱研究所 | 放熱基板と、それを使用した半導体用モジュール |
| CN104370546B (zh) * | 2014-10-28 | 2016-02-17 | 倪娟形 | 一种散热器连接件用高导热性陶瓷及其制备方法 |
| US10074589B2 (en) | 2016-04-14 | 2018-09-11 | Hamilton Sundstrand Corporation | Embedding diamond and other ceramic media into metal substrates to form thermal interface materials |
| RU2712999C1 (ru) * | 2016-09-06 | 2020-02-03 | АйЭйчАй КОРПОРЕЙШН | Способ получения композиционного материала с керамической матрицей |
| CN107034377A (zh) * | 2017-03-14 | 2017-08-11 | 刘金财 | 一种镍金包覆的镶嵌金刚石铜的高密度密度板及其制备方法 |
| DE102018205893B3 (de) * | 2018-04-18 | 2019-10-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Werkstoff bestehend aus einem dreidimensionalen Gerüst, das mit SiC oder SiC und Si3N4 gebildet ist und einer Edelmetalllegierung, in der Silicium enthalten ist, sowie ein Verfahren zu seiner Herstellung |
| CN111170317B (zh) * | 2018-11-12 | 2022-02-22 | 有研工程技术研究院有限公司 | 一种石墨烯改性金刚石/铜复合材料的制备方法 |
| JP7233991B2 (ja) * | 2019-03-18 | 2023-03-07 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
| EP3950991A4 (en) * | 2019-03-29 | 2022-05-18 | Sumitomo Electric Industries, Ltd. | COMPOSITE |
| CN114585691A (zh) | 2019-10-24 | 2022-06-03 | 积水化学工业株式会社 | 树脂组合物及散热构件 |
| CN111304481A (zh) * | 2020-02-11 | 2020-06-19 | 中南大学 | 一种金刚石-金属复合材料的熔渗制备工艺及金刚石-金属复合材料 |
| WO2021205782A1 (ja) * | 2020-04-09 | 2021-10-14 | 住友電気工業株式会社 | 複合材料、ヒートシンク及び半導体装置 |
| CN112195384A (zh) * | 2020-10-26 | 2021-01-08 | 河南飞孟金刚石工业有限公司 | 一种低成本金刚石高导热材料及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6171691B1 (en) * | 1997-02-06 | 2001-01-09 | Sumitomo Electric Industries, Ltd. | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
| US6179886B1 (en) * | 1997-09-05 | 2001-01-30 | Ambler Technologies, Inc. | Method for producing abrasive grains and the composite abrasive grains produced by same |
| WO2002042240A2 (en) * | 2000-11-21 | 2002-05-30 | Skeleton Technologies Ag | A heat conductive material |
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| DE2543820C2 (de) * | 1975-10-01 | 1984-10-31 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung von Flachdruckformen mittels Laserstrahlen |
| IE47393B1 (en) * | 1977-09-12 | 1984-03-07 | De Beers Ind Diamond | Abrasive materials |
| JPS5946050A (ja) * | 1982-09-09 | 1984-03-15 | Narumi China Corp | 半導体用セラミツクパツケ−ジ |
| DE3535659C1 (de) | 1985-10-04 | 1987-04-02 | Swarovski & Co | Verwendung einer Bronzelegierung fuer Sinterschleifkoerper |
| ZA894689B (en) * | 1988-11-30 | 1990-09-26 | Gen Electric | Silicon infiltrated porous polycrystalline diamond compacts and their fabrications |
| US5045972A (en) | 1990-08-27 | 1991-09-03 | The Standard Oil Company | High thermal conductivity metal matrix composite |
| US6003221A (en) * | 1991-04-08 | 1999-12-21 | Aluminum Company Of America | Metal matrix composites containing electrical insulators |
| EP0619378B1 (en) | 1993-04-06 | 1997-07-23 | Sumitomo Electric Industries, Limited | Method of preparing a diamond reinforced composite material |
| US5505750A (en) * | 1994-06-22 | 1996-04-09 | Norton Company | Infiltrant for metal bonded abrasive articles |
| US5706999A (en) * | 1995-11-28 | 1998-01-13 | Hughes Electronics | Preparation of a coated metal-matrix composite material |
| US6039641A (en) * | 1997-04-04 | 2000-03-21 | Sung; Chien-Min | Brazed diamond tools by infiltration |
| JP3893681B2 (ja) * | 1997-08-19 | 2007-03-14 | 住友電気工業株式会社 | 半導体用ヒートシンクおよびその製造方法 |
| DE19843309A1 (de) * | 1998-09-22 | 2000-03-23 | Asea Brown Boveri | Kurzschlussfestes IGBT Modul |
| AU759804B2 (en) | 1998-09-28 | 2003-05-01 | Skeleton Technologies Ag | Method of manufacturing a diamond composite and a composite produced by same |
| KR100460585B1 (ko) * | 1999-12-24 | 2004-12-09 | 니뽄 가이시 가부시키가이샤 | 히트 싱크재 및 그 제조 방법 |
| JP2001339022A (ja) | 1999-12-24 | 2001-12-07 | Ngk Insulators Ltd | ヒートシンク材及びその製造方法 |
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- 2004-01-20 JP JP2006503938A patent/JP4880447B2/ja not_active Expired - Lifetime
- 2004-01-20 US US10/548,725 patent/US8575051B2/en active Active
- 2004-01-20 JP JP2006503937A patent/JP4995565B2/ja not_active Expired - Lifetime
- 2004-01-20 CN CNB200480006559XA patent/CN100400467C/zh not_active Expired - Lifetime
- 2004-01-20 EP EP04703308.9A patent/EP1601630B1/de not_active Expired - Lifetime
- 2004-01-20 WO PCT/AT2004/000018 patent/WO2004080914A1/de not_active Ceased
- 2004-01-20 EP EP04703310A patent/EP1601631A1/de not_active Withdrawn
- 2004-01-20 US US10/548,723 patent/US20060157884A1/en not_active Abandoned
- 2004-01-20 WO PCT/AT2004/000017 patent/WO2004080913A1/de not_active Ceased
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| US6171691B1 (en) * | 1997-02-06 | 2001-01-09 | Sumitomo Electric Industries, Ltd. | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
| US6179886B1 (en) * | 1997-09-05 | 2001-01-30 | Ambler Technologies, Inc. | Method for producing abrasive grains and the composite abrasive grains produced by same |
| WO2002042240A2 (en) * | 2000-11-21 | 2002-05-30 | Skeleton Technologies Ag | A heat conductive material |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2004080913A1 (de) | 2004-09-23 |
| EP1601631A1 (de) | 2005-12-07 |
| EP1601630A1 (de) | 2005-12-07 |
| WO2004080914A1 (de) | 2004-09-23 |
| EP1601630B1 (de) | 2017-12-27 |
| JP4995565B2 (ja) | 2012-08-08 |
| CN1759078A (zh) | 2006-04-12 |
| JP2006519928A (ja) | 2006-08-31 |
| JP2006524173A (ja) | 2006-10-26 |
| AT7382U1 (de) | 2005-02-25 |
| US20060130998A1 (en) | 2006-06-22 |
| US20060157884A1 (en) | 2006-07-20 |
| US8575051B2 (en) | 2013-11-05 |
| JP4880447B2 (ja) | 2012-02-22 |
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