CH652758A5 - Apparecchiatura e procedimento per l'elettroplaccatura di pezzi piani discreti. - Google Patents

Apparecchiatura e procedimento per l'elettroplaccatura di pezzi piani discreti. Download PDF

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Publication number
CH652758A5
CH652758A5 CH5819/82A CH581982A CH652758A5 CH 652758 A5 CH652758 A5 CH 652758A5 CH 5819/82 A CH5819/82 A CH 5819/82A CH 581982 A CH581982 A CH 581982A CH 652758 A5 CH652758 A5 CH 652758A5
Authority
CH
Switzerland
Prior art keywords
pieces
wheels
electrolyte
liquid contact
along
Prior art date
Application number
CH5819/82A
Other languages
English (en)
Italian (it)
Inventor
Joseph M Brady
Franz R Cordes
Daniel L Goffredo
Conrad D Shakley
Klaus H Gedrat
Walter Meyer
Original Assignee
Chemcut Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemcut Corp filed Critical Chemcut Corp
Publication of CH652758A5 publication Critical patent/CH652758A5/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH5819/82A 1981-10-07 1982-10-04 Apparecchiatura e procedimento per l'elettroplaccatura di pezzi piani discreti. CH652758A5 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/309,180 US4385967A (en) 1981-10-07 1981-10-07 Electroplating apparatus and method

Publications (1)

Publication Number Publication Date
CH652758A5 true CH652758A5 (it) 1985-11-29

Family

ID=23197043

Family Applications (1)

Application Number Title Priority Date Filing Date
CH5819/82A CH652758A5 (it) 1981-10-07 1982-10-04 Apparecchiatura e procedimento per l'elettroplaccatura di pezzi piani discreti.

Country Status (13)

Country Link
US (1) US4385967A (US07709020-20100504-C00041.png)
JP (1) JPS58136797A (US07709020-20100504-C00041.png)
AT (1) AT378009B (US07709020-20100504-C00041.png)
CA (1) CA1190888A (US07709020-20100504-C00041.png)
CH (1) CH652758A5 (US07709020-20100504-C00041.png)
DE (1) DE3236545A1 (US07709020-20100504-C00041.png)
ES (1) ES516287A0 (US07709020-20100504-C00041.png)
FR (1) FR2514037B1 (US07709020-20100504-C00041.png)
GB (1) GB2107357B (US07709020-20100504-C00041.png)
IE (1) IE54263B1 (US07709020-20100504-C00041.png)
IT (1) IT1196672B (US07709020-20100504-C00041.png)
NL (1) NL8203845A (US07709020-20100504-C00041.png)
SE (1) SE8205713L (US07709020-20100504-C00041.png)

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US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
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DE3638630A1 (de) * 1986-11-11 1988-05-26 Schering Ag Verfahren zur entfernung von harzverschmutzungen in bohrloechern von leiterplatten
EP0276725B1 (de) * 1987-01-26 1991-09-04 Siemens Aktiengesellschaft Galvanisierungseinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
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DE58904414D1 (de) * 1988-09-01 1993-06-24 Siemens Nixdorf Inf Syst Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.
DE58904418D1 (de) * 1988-09-01 1993-06-24 Siemens Nixdorf Inf Syst Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.
EP0361029B1 (de) * 1988-09-01 1993-05-19 Siemens Nixdorf Informationssysteme Aktiengesellschaft Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
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CN102121126B (zh) * 2011-01-19 2014-12-31 俊杰机械(深圳)有限公司 一种带导轮架的pcb电镀装置
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Also Published As

Publication number Publication date
IT8268174A0 (it) 1982-10-06
GB2107357A (en) 1983-04-27
AT378009B (de) 1985-06-10
JPS58136797A (ja) 1983-08-13
IE822387L (en) 1983-04-07
ATA367882A (de) 1984-10-15
SE8205713L (sv) 1983-04-08
ES8402370A1 (es) 1984-01-16
GB2107357B (en) 1984-12-12
IT1196672B (it) 1988-11-25
FR2514037B1 (fr) 1986-12-26
US4385967A (en) 1983-05-31
NL8203845A (nl) 1983-05-02
DE3236545A1 (de) 1983-05-05
SE8205713D0 (sv) 1982-10-06
JPH0222159B2 (US07709020-20100504-C00041.png) 1990-05-17
CA1190888A (en) 1985-07-23
ES516287A0 (es) 1984-01-16
IE54263B1 (en) 1989-08-02
FR2514037A1 (fr) 1983-04-08
DE3236545C2 (US07709020-20100504-C00041.png) 1991-12-12

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Owner name: SCHERING AKTIENGESELLSCHAFT, BERLIN & BERGKAMEN

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