CH647264A5 - Verfahren und bad zum stromlosen abscheiden eines kupferueberzugs auf einem werkstueck. - Google Patents
Verfahren und bad zum stromlosen abscheiden eines kupferueberzugs auf einem werkstueck. Download PDFInfo
- Publication number
- CH647264A5 CH647264A5 CH4786/79A CH478679A CH647264A5 CH 647264 A5 CH647264 A5 CH 647264A5 CH 4786/79 A CH4786/79 A CH 4786/79A CH 478679 A CH478679 A CH 478679A CH 647264 A5 CH647264 A5 CH 647264A5
- Authority
- CH
- Switzerland
- Prior art keywords
- copper
- bath
- solution
- deposition
- formaldehyde
- Prior art date
Links
- 239000010949 copper Substances 0.000 title claims description 137
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 130
- 229910052802 copper Inorganic materials 0.000 title claims description 129
- 238000000151 deposition Methods 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 20
- 238000000576 coating method Methods 0.000 claims description 84
- 239000000243 solution Substances 0.000 claims description 71
- 239000011248 coating agent Substances 0.000 claims description 66
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 62
- 239000003638 chemical reducing agent Substances 0.000 claims description 49
- 239000008139 complexing agent Substances 0.000 claims description 46
- 230000008021 deposition Effects 0.000 claims description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 33
- 238000007747 plating Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 11
- 230000002829 reductive effect Effects 0.000 claims description 11
- 229940095064 tartrate Drugs 0.000 claims description 11
- 239000003513 alkali Substances 0.000 claims description 10
- 230000009467 reduction Effects 0.000 claims description 10
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- -1 formaldehyde, formates Chemical class 0.000 claims description 4
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 4
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 4
- 239000005749 Copper compound Substances 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 150000001880 copper compounds Chemical class 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000006722 reduction reaction Methods 0.000 claims 11
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 8
- 229910001431 copper ion Inorganic materials 0.000 claims 8
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 3
- 230000001105 regulatory effect Effects 0.000 claims 3
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims 2
- 238000000454 electroless metal deposition Methods 0.000 claims 2
- 239000008098 formaldehyde solution Substances 0.000 claims 2
- 238000009472 formulation Methods 0.000 claims 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims 2
- 239000007921 spray Substances 0.000 claims 2
- FDAYLTPAFBGXAB-UHFFFAOYSA-N 2-chloro-n,n-bis(2-chloroethyl)ethanamine Chemical compound ClCCN(CCCl)CCCl FDAYLTPAFBGXAB-UHFFFAOYSA-N 0.000 claims 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 claims 1
- 238000005705 Cannizzaro reaction Methods 0.000 claims 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims 1
- 239000003929 acidic solution Substances 0.000 claims 1
- 230000001464 adherent effect Effects 0.000 claims 1
- 239000012670 alkaline solution Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 235000019270 ammonium chloride Nutrition 0.000 claims 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims 1
- 235000011130 ammonium sulphate Nutrition 0.000 claims 1
- 150000001540 azides Chemical class 0.000 claims 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims 1
- 229910000085 borane Inorganic materials 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 claims 1
- 239000003153 chemical reaction reagent Substances 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical class OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims 1
- GRWZHXKQBITJKP-UHFFFAOYSA-N dithionous acid Chemical class OS(=O)S(O)=O GRWZHXKQBITJKP-UHFFFAOYSA-N 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 239000012493 hydrazine sulfate Substances 0.000 claims 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000011835 investigation Methods 0.000 claims 1
- NKAAEMMYHLFEFN-UHFFFAOYSA-M monosodium tartrate Chemical compound [Na+].OC(=O)C(O)C(O)C([O-])=O NKAAEMMYHLFEFN-UHFFFAOYSA-M 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 239000002574 poison Substances 0.000 claims 1
- 231100000614 poison Toxicity 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- PODWXQQNRWNDGD-UHFFFAOYSA-L sodium thiosulfate pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[O-]S([S-])(=O)=O PODWXQQNRWNDGD-UHFFFAOYSA-L 0.000 claims 1
- 235000019345 sodium thiosulphate Nutrition 0.000 claims 1
- 230000002269 spontaneous effect Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000013589 supplement Substances 0.000 claims 1
- 150000003892 tartrate salts Chemical class 0.000 claims 1
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 claims 1
- 231100000331 toxic Toxicity 0.000 claims 1
- 230000002588 toxic effect Effects 0.000 claims 1
- 239000003039 volatile agent Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 7
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000000080 wetting agent Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 210000003608 fece Anatomy 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910001453 nickel ion Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000001476 sodium potassium tartrate Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000005844 autocatalytic reaction Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004727 Noryl Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- QEXQYHCJWRCKRM-UHFFFAOYSA-K O.C(C)(=O)[O-].C(C)(=O)[O-].C(C)(=O)[O-].OCCNCCN.[Na+].[Na+].[Na+] Chemical compound O.C(C)(=O)[O-].C(C)(=O)[O-].C(C)(=O)[O-].OCCNCCN.[Na+].[Na+].[Na+] QEXQYHCJWRCKRM-UHFFFAOYSA-K 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 241001635574 Sabatia angularis Species 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- 239000013504 Triton X-100 Substances 0.000 description 1
- 229920004890 Triton X-100 Polymers 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- ICKJJQMINSDAOV-UHFFFAOYSA-L copper dioxidophosphanium Chemical compound [Cu++].[O-][PH2]=O.[O-][PH2]=O ICKJJQMINSDAOV-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003337 fertilizer Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 1
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 description 1
- 229940005631 hypophosphite ion Drugs 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- 229940087646 methanolamine Drugs 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- ZMLDXWLZKKZVSS-UHFFFAOYSA-N palladium tin Chemical compound [Pd].[Sn] ZMLDXWLZKKZVSS-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011272 standard treatment Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000005494 tarnishing Methods 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/909,209 US4209331A (en) | 1978-05-25 | 1978-05-25 | Electroless copper composition solution using a hypophosphite reducing agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH647264A5 true CH647264A5 (de) | 1985-01-15 |
Family
ID=25426815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH4786/79A CH647264A5 (de) | 1978-05-25 | 1979-05-22 | Verfahren und bad zum stromlosen abscheiden eines kupferueberzugs auf einem werkstueck. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4209331A (en, 2012) |
| JP (1) | JPS54153737A (en, 2012) |
| AU (1) | AU536632B2 (en, 2012) |
| CA (1) | CA1130952A (en, 2012) |
| CH (1) | CH647264A5 (en, 2012) |
| DE (1) | DE2920766A1 (en, 2012) |
| FR (1) | FR2426742B1 (en, 2012) |
| GB (1) | GB2021648B (en, 2012) |
| NL (1) | NL189362C (en, 2012) |
| SE (1) | SE7903341L (en, 2012) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| SU921124A1 (ru) * | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
| US4325990A (en) * | 1980-05-12 | 1982-04-20 | Macdermid Incorporated | Electroless copper deposition solutions with hypophosphite reducing agent |
| EP0057232B1 (en) * | 1980-08-12 | 1987-03-25 | Macdermid, Incorporated | Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential |
| US4459184A (en) * | 1980-08-12 | 1984-07-10 | Macdermid, Inc. | Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential |
| JPS57501786A (en, 2012) * | 1980-09-15 | 1982-10-07 | ||
| US4617205A (en) * | 1984-12-21 | 1986-10-14 | Omi International Corporation | Formaldehyde-free autocatalytic electroless copper plating |
| US4671968A (en) * | 1985-04-01 | 1987-06-09 | Macdermid, Incorporated | Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces |
| US4759986A (en) * | 1986-10-23 | 1988-07-26 | Hoechst Celanese Corporation | Electrically conductive polybenzimidazole fibrous material |
| US4814197A (en) * | 1986-10-31 | 1989-03-21 | Kollmorgen Corporation | Control of electroless plating baths |
| US4948707A (en) * | 1988-02-16 | 1990-08-14 | International Business Machines Corporation | Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
| US4938853A (en) * | 1989-05-10 | 1990-07-03 | Macdermid, Incorporated | Electrolytic method for the dissolution of copper particles formed during electroless copper deposition |
| US5077099B1 (en) * | 1990-03-14 | 1997-12-02 | Macdermid Inc | Electroless copper plating process and apparatus |
| US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
| JPH0544075A (ja) * | 1991-08-15 | 1993-02-23 | Nippon Riironaale Kk | 無電解銅めつき代替銅ストライクめつき方法 |
| US5328561A (en) * | 1992-07-10 | 1994-07-12 | Macdermid Incorporated | Microetchant for copper surfaces and processes for using same |
| US6042889A (en) * | 1994-02-28 | 2000-03-28 | International Business Machines Corporation | Method for electrolessly depositing a metal onto a substrate using mediator ions |
| US6054173A (en) * | 1997-08-22 | 2000-04-25 | Micron Technology, Inc. | Copper electroless deposition on a titanium-containing surface |
| RU2141931C1 (ru) * | 1998-03-10 | 1999-11-27 | Институт химии твердого тела и механохимии СО РАН РФ | Способ нанесения металлического покрытия на керамические подложки |
| EP1020543A1 (en) * | 1999-01-15 | 2000-07-19 | Interuniversitair Micro-Elektronica Centrum Vzw | Deposition of copper on an activated surface of a substrate |
| DE19918833C2 (de) * | 1999-04-22 | 2002-10-31 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens |
| US6632343B1 (en) * | 2000-08-30 | 2003-10-14 | Micron Technology, Inc. | Method and apparatus for electrolytic plating of surface metals |
| JP4595237B2 (ja) * | 2001-04-27 | 2010-12-08 | 日立金属株式会社 | 銅めっき液および銅めっき方法 |
| US7169215B2 (en) * | 2004-01-02 | 2007-01-30 | Ramot At Tel Aviv University Ltd. | Copper molybdenum electroless deposition process and materials |
| US20090238979A1 (en) * | 2008-03-21 | 2009-09-24 | William Decesare | Method of Applying Catalytic Solution for Use in Electroless Deposition |
| DE102010012204B4 (de) * | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
| WO2012040550A1 (en) | 2010-09-26 | 2012-03-29 | Da Yu Enterprises, L.L.C. | Method of recombinant macromolecular production |
| EP2784181B1 (en) | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
| KR101487890B1 (ko) * | 2013-07-16 | 2015-02-03 | 한국생산기술연구원 | 무전해 니켈 도금액, 이를 이용한 무전해 니켈 도금 방법, 및 이를 이용하여 제조된 연성 니켈 도금층 |
| US20170175272A9 (en) * | 2013-09-04 | 2017-06-22 | Rohm And Haas Electronic Materials Llc | Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts |
| CN113861614B (zh) * | 2021-09-29 | 2023-10-31 | 上海金发科技发展有限公司 | 一种高电镀结合力的abs改性材料及其制备方法与应用 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3046159A (en) * | 1957-12-17 | 1962-07-24 | Hughes Aircraft Co | Method of copper plating by chemical reduction |
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
| US3716462A (en) * | 1970-10-05 | 1973-02-13 | D Jensen | Copper plating on zinc and its alloys |
| US3650777A (en) * | 1971-02-11 | 1972-03-21 | Kollmorgen Corp | Electroless copper plating |
| US3959531A (en) * | 1971-04-23 | 1976-05-25 | Photocircuits Corporation | Improvements in electroless metal plating |
| NL7304650A (en, 2012) * | 1973-04-04 | 1974-10-08 | ||
| US3870526A (en) * | 1973-09-20 | 1975-03-11 | Us Army | Electroless deposition of copper and copper-tin alloys |
| JPS5147535A (ja) * | 1974-10-22 | 1976-04-23 | Toko Inc | Domudenkaimetsukyoku |
| JPS5234571A (en) * | 1975-09-10 | 1977-03-16 | Hitachi Zosen Corp | Thermal cracking device for combustible refuse |
| US4138267A (en) * | 1976-12-28 | 1979-02-06 | Okuno Chemical Industry Company, Limited | Compositions for chemical copper plating |
-
1978
- 1978-05-25 US US05/909,209 patent/US4209331A/en not_active Expired - Lifetime
-
1979
- 1979-04-12 CA CA325,487A patent/CA1130952A/en not_active Expired
- 1979-04-17 SE SE7903341A patent/SE7903341L/ unknown
- 1979-04-24 AU AU46417/79A patent/AU536632B2/en not_active Ceased
- 1979-05-09 NL NLAANVRAGE7903647,A patent/NL189362C/xx not_active IP Right Cessation
- 1979-05-22 GB GB7917684A patent/GB2021648B/en not_active Expired
- 1979-05-22 CH CH4786/79A patent/CH647264A5/de not_active IP Right Cessation
- 1979-05-22 DE DE2920766A patent/DE2920766A1/de active Granted
- 1979-05-23 JP JP6375879A patent/JPS54153737A/ja active Granted
- 1979-05-23 FR FR7913221A patent/FR2426742B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4209331A (en) | 1980-06-24 |
| GB2021648B (en) | 1983-03-30 |
| GB2021648A (en) | 1979-12-05 |
| CA1130952A (en) | 1982-09-07 |
| NL189362B (nl) | 1992-10-16 |
| NL189362C (nl) | 1993-03-16 |
| DE2920766C2 (en, 2012) | 1988-01-07 |
| DE2920766A1 (de) | 1979-11-29 |
| JPS54153737A (en) | 1979-12-04 |
| FR2426742A1 (fr) | 1979-12-21 |
| NL7903647A (nl) | 1979-11-27 |
| AU4641779A (en) | 1979-11-29 |
| SE7903341L (sv) | 1979-11-26 |
| FR2426742B1 (fr) | 1985-06-28 |
| JPH029110B2 (en, 2012) | 1990-02-28 |
| AU536632B2 (en) | 1984-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |