CA987794A - Method and apparatus for cleaning the surface of a semiconductor slice - Google Patents

Method and apparatus for cleaning the surface of a semiconductor slice

Info

Publication number
CA987794A
CA987794A CA187,090A CA187090A CA987794A CA 987794 A CA987794 A CA 987794A CA 187090 A CA187090 A CA 187090A CA 987794 A CA987794 A CA 987794A
Authority
CA
Canada
Prior art keywords
cleaning
semiconductor slice
slice
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA187,090A
Other languages
English (en)
Other versions
CA187090S (en
Inventor
Samuel R. Shortes
Edwin G. Millis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of CA987794A publication Critical patent/CA987794A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CA187,090A 1973-01-02 1973-11-30 Method and apparatus for cleaning the surface of a semiconductor slice Expired CA987794A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/320,400 US4027686A (en) 1973-01-02 1973-01-02 Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water

Publications (1)

Publication Number Publication Date
CA987794A true CA987794A (en) 1976-04-20

Family

ID=23246249

Family Applications (1)

Application Number Title Priority Date Filing Date
CA187,090A Expired CA987794A (en) 1973-01-02 1973-11-30 Method and apparatus for cleaning the surface of a semiconductor slice

Country Status (7)

Country Link
US (1) US4027686A (de)
JP (1) JPS4999480A (de)
CA (1) CA987794A (de)
DE (1) DE2364135A1 (de)
FR (1) FR2212770A5 (de)
GB (1) GB1445008A (de)
NL (1) NL7317476A (de)

Families Citing this family (157)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2511008C3 (de) * 1975-03-13 1985-05-15 Pscholka, Vaclav, 8900 Augsburg Skibremse
JPS5275976A (en) * 1975-12-22 1977-06-25 Fujitsu Ltd Wafer cleaning device
DE2735311C2 (de) * 1977-08-05 1989-08-10 Schubert & Salzer Maschinenfabrik Ag, 8070 Ingolstadt Vorrichtung zur Reinigung von Spinnrotoren in Offenend-Spinnvorrichtungen
US4178188A (en) * 1977-09-14 1979-12-11 Branson Ultrasonics Corporation Method for cleaning workpieces by ultrasonic energy
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4197000A (en) * 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
JPS551114A (en) * 1978-06-19 1980-01-07 Hitachi Ltd Method and device for washing wafer
US4365383A (en) * 1979-06-25 1982-12-28 Elan Pressure Clean Limited Cleaning apparatus for components
US4286541A (en) * 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS56115538A (en) * 1980-02-19 1981-09-10 Toshiba Corp Treating method for semiconductor patterning wafer
JPS587831A (ja) * 1981-07-07 1983-01-17 Sumitomo Shoji Kk 高圧水によるウェハの洗浄方法及び装置
JPS57100229U (de) * 1981-11-12 1982-06-19
US4439243A (en) * 1982-08-03 1984-03-27 Texas Instruments Incorporated Apparatus and method of material removal with fluid flow within a slot
US4838289A (en) * 1982-08-03 1989-06-13 Texas Instruments Incorporated Apparatus and method for edge cleaning
US4439244A (en) * 1982-08-03 1984-03-27 Texas Instruments Incorporated Apparatus and method of material removal having a fluid filled slot
US4685975A (en) * 1982-08-03 1987-08-11 Texas Instruments Incorporated Method for edge cleaning
US4458704A (en) * 1982-10-29 1984-07-10 Xertronix, Inc. Apparatus for processing semiconductor wafers
US4489740A (en) * 1982-12-27 1984-12-25 General Signal Corporation Disc cleaning machine
JPS6014244A (ja) * 1983-07-06 1985-01-24 Fujitsu Ltd マスク洗浄装置
JPS6064436A (ja) * 1983-09-19 1985-04-13 Fujitsu Ltd スピンドライヤ
US4520834A (en) * 1983-11-08 1985-06-04 Dicicco Paolo S Apparatus for processing articles in a series of process solution containers
GB2154434A (en) * 1984-02-22 1985-09-11 Stohrer Doduco Gmbh & Co Machine for washing circuit boards
US4519846A (en) * 1984-03-08 1985-05-28 Seiichiro Aigo Process for washing and drying a semiconductor element
US4801335A (en) * 1984-07-02 1989-01-31 Fsi Corporation Rinsing in acid processing of substrates
US4682615A (en) * 1984-07-02 1987-07-28 Fsi Corporation Rinsing in acid processing of substrates
JPH0528758Y2 (de) * 1985-02-28 1993-07-23
JPS61251135A (ja) * 1985-04-30 1986-11-08 Toshiba Corp 自動現像装置
US4665462A (en) * 1985-06-17 1987-05-12 The Simco Company, Inc. Ionizing gas gun for balanced static elimination
WO1987006057A1 (en) * 1986-04-03 1987-10-08 Semax Prozess-Technik Gmbh INSTALLATION AND METHOD FOR PROCESSING SEMI-CONDUCTOR WAFERS (Si or GaAs WAFERS) FOR INTEGRATED CIRCUITS
US4749640A (en) * 1986-09-02 1988-06-07 Monsanto Company Integrated circuit manufacturing process
US5022419A (en) * 1987-04-27 1991-06-11 Semitool, Inc. Rinser dryer system
US5221360A (en) * 1987-04-27 1993-06-22 Semitool, Inc. Semiconductor processor methods
US4777804A (en) * 1987-08-26 1988-10-18 Texas Instruments Incorporated Method and apparatus for easing surface particle removal by size increase
AT389019B (de) * 1987-12-09 1989-10-10 Thallner Erich Vorrichtung zum reinigen von flachen, praktisch ebenen kleinteilen, insbesondere von flachen halbleitersubstraten
JP2504549B2 (ja) * 1988-12-15 1996-06-05 パイオニア株式会社 流体供給処理装置
JPH03136232A (ja) * 1989-08-31 1991-06-11 Dainippon Screen Mfg Co Ltd 基板の表面処理装置
US4989345A (en) * 1989-12-18 1991-02-05 Gill Jr Gerald L Centrifugal spin dryer for semiconductor wafer
US6375741B2 (en) 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5156174A (en) * 1990-05-18 1992-10-20 Semitool, Inc. Single wafer processor with a bowl
US5279704A (en) * 1991-04-23 1994-01-18 Honda Giken Kogyo Kabushiki Kaisha Method of fabricating semiconductor device
US5183512A (en) * 1991-08-29 1993-02-02 Aquotech, Inc. Method of cleaning semiconductor wafer and computer disks by purified water treated with electric AC signal
GB2273884B (en) * 1992-12-29 1995-09-06 Hop Kwen Toys Manufactory Co L Toy dishwasher
JP3277404B2 (ja) * 1993-03-31 2002-04-22 ソニー株式会社 基板洗浄方法及び基板洗浄装置
US5456758A (en) * 1993-04-26 1995-10-10 Sematech, Inc. Submicron particle removal using liquid nitrogen
US5364474A (en) * 1993-07-23 1994-11-15 Williford Jr John F Method for removing particulate matter
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5551986A (en) * 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal
DE19549628B4 (de) * 1995-05-26 2006-08-17 Ryoden Semiconductor System Engineering Corp., Itami Waschverfahren eines Halbleitersubstrats
JP3504023B2 (ja) * 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
US5865902A (en) * 1996-05-09 1999-02-02 Church & Dwight Co., Inc. Method for cleaning electronic hardware components
US6039059A (en) 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
TW357406B (en) * 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
US5937469A (en) * 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
US5942037A (en) * 1996-12-23 1999-08-24 Fsi International, Inc. Rotatable and translatable spray nozzle
US5868857A (en) 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
US5901399A (en) * 1996-12-30 1999-05-11 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
US5989355A (en) * 1997-02-26 1999-11-23 Eco-Snow Systems, Inc. Apparatus for cleaning and testing precision components of hard drives and the like
US5961732A (en) * 1997-06-11 1999-10-05 Fsi International, Inc Treating substrates by producing and controlling a cryogenic aerosol
US6036786A (en) * 1997-06-11 2000-03-14 Fsi International Inc. Eliminating stiction with the use of cryogenic aerosol
US6276072B1 (en) * 1997-07-10 2001-08-21 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
US6261377B1 (en) 1997-09-24 2001-07-17 Interuniversitair Microelektronica Centrum (Imec) Method of removing particles and a liquid from a surface of substrate
US6334902B1 (en) * 1997-09-24 2002-01-01 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for removing a liquid from a surface
EP0905746A1 (de) * 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
ATE311665T1 (de) * 1997-09-24 2005-12-15 Imec Inter Uni Micro Electr Verfahren und vorrichtung zum entfernen von einer flüssigkeit von der oberfläche eines rotierenden substrats
JP4017680B2 (ja) * 1997-09-24 2007-12-05 アンテルユニヴェルシテール・ミクロ―エレクトロニカ・サントリュム・ヴェー・ゼッド・ドゥブルヴェ 表面から液体を除去する方法及び装置
US6491764B2 (en) 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
US5849103A (en) * 1997-12-22 1998-12-15 Seh America, Inc. Method of monitoring fluid contamination
WO1999040615A1 (en) * 1998-02-04 1999-08-12 Semitool, Inc. Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6125551A (en) * 1998-03-17 2000-10-03 Verteq, Inc. Gas seal and support for rotating semiconductor processor
US6416647B1 (en) 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
EP0991795B1 (de) 1998-04-21 2006-02-22 Applied Materials, Inc. Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
US6994776B2 (en) * 1998-06-01 2006-02-07 Semitool Inc. Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
US6432214B2 (en) * 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US7527698B2 (en) * 1998-09-23 2009-05-05 Interuniversitair Microelektronica Centrum (Imec, Vzw) Method and apparatus for removing a liquid from a surface of a substrate
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6228233B1 (en) 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6254760B1 (en) 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6267853B1 (en) 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US6290865B1 (en) 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US7192494B2 (en) * 1999-03-05 2007-03-20 Applied Materials, Inc. Method and apparatus for annealing copper films
US6523553B1 (en) 1999-03-30 2003-02-25 Applied Materials, Inc. Wafer edge cleaning method and apparatus
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6585876B2 (en) 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6551488B1 (en) * 1999-04-08 2003-04-22 Applied Materials, Inc. Segmenting of processing system into wet and dry areas
US6557237B1 (en) 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US6582578B1 (en) 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6662673B1 (en) 1999-04-08 2003-12-16 Applied Materials, Inc. Linear motion apparatus and associated method
US6837978B1 (en) 1999-04-08 2005-01-04 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6405399B1 (en) 1999-06-25 2002-06-18 Lam Research Corporation Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
JP4007766B2 (ja) 2000-02-29 2007-11-14 東京エレクトロン株式会社 液処理装置および液処理方法
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US20030062069A1 (en) * 2000-09-08 2003-04-03 Semitool, Inc Apparatus and methods for removing metallic contamination from wafer containers
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6691719B2 (en) * 2001-01-12 2004-02-17 Applied Materials Inc. Adjustable nozzle for wafer bevel cleaning
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
WO2002063067A1 (fr) * 2001-02-07 2002-08-15 Tokyo Electron Limited Procede et appareil de depot autocatalytique
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
US7614411B2 (en) * 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US7311810B2 (en) * 2003-04-18 2007-12-25 Applied Materials, Inc. Two position anneal chamber
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20040206373A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Spin rinse dry cell
US7867565B2 (en) 2003-06-30 2011-01-11 Imec Method for coating substrates
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US7611589B2 (en) * 2005-03-04 2009-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. Methods of spin-on wafer cleaning
US7199062B2 (en) * 2005-04-04 2007-04-03 Infineon Technologies Ag Method for forming a resist film on a substrate having non-uniform topography
WO2006111363A1 (fr) * 2005-04-19 2006-10-26 Special Coating Laboratory International Buse de pulverisation d ' un liquide a haute pression pour une machine de nettoyage de verres ophtalmiques ou autres substrats
US7470503B1 (en) 2005-04-29 2008-12-30 Infineon Technologies Ag Method for reducing lithography pattern defects
US7662436B1 (en) 2005-05-27 2010-02-16 Infineon Technologies Ag Method of spin coating a film of non-uniform thickness
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
GB2434767A (en) * 2006-02-02 2007-08-08 Xsil Technology Ltd Laser machining
US20070234951A1 (en) * 2006-03-24 2007-10-11 Wei Lu Methods and apparatus for cleaning a substrate
JP5261077B2 (ja) * 2008-08-29 2013-08-14 大日本スクリーン製造株式会社 基板洗浄方法および基板洗浄装置
US8950414B2 (en) * 2009-07-31 2015-02-10 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and storage medium
DE102010028883A1 (de) * 2010-05-11 2011-11-17 Dürr Ecoclean GmbH Prozessbehälter
US9765289B2 (en) * 2012-04-18 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning methods and compositions
KR101272785B1 (ko) * 2012-12-18 2013-06-11 포항공과대학교 산학협력단 고속 입자 빔을 이용한 액막 제거 방법
US20150047674A1 (en) * 2013-08-16 2015-02-19 Tel Nexx, Inc. Method and apparatus for removal of photoresist using improved chemistry
CN111589752B (zh) * 2014-04-01 2023-02-03 株式会社荏原制作所 清洗装置
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
GB201502379D0 (en) * 2015-02-13 2015-04-01 Rolls Royce Plc An apparatus and a method of machining a shape through a component
TWI622111B (zh) * 2017-04-28 2018-04-21 Main Science Machinery Company Ltd Coating machine double liquid level detecting device
EP3833490B1 (de) * 2018-08-09 2022-10-05 Alfred Kärcher SE & Co. KG Flächenreinigungskopf

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL239732A (de) * 1958-06-18
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
US2948642A (en) * 1959-05-08 1960-08-09 Bell Telephone Labor Inc Surface treatment of silicon devices
US3062227A (en) * 1960-03-14 1962-11-06 D K Mfg Company Devices for cleaning convoluted tubing
US3489608A (en) * 1965-10-26 1970-01-13 Kulicke & Soffa Ind Inc Method and apparatus for treating semiconductor wafers
US3479222A (en) * 1966-06-22 1969-11-18 Disc Pack Corp Apparatus for and method of cleaning memory discs
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US3776800A (en) * 1971-12-06 1973-12-04 Chemut Corp Etching apparatus
US3760822A (en) * 1972-03-22 1973-09-25 A Evans Machine for cleaning semiconductive wafers

Also Published As

Publication number Publication date
NL7317476A (de) 1974-07-04
JPS4999480A (de) 1974-09-19
US4027686A (en) 1977-06-07
DE2364135A1 (de) 1974-07-11
FR2212770A5 (de) 1974-07-26
GB1445008A (en) 1976-08-04

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