JPS4999480A - - Google Patents

Info

Publication number
JPS4999480A
JPS4999480A JP48135668A JP13566873A JPS4999480A JP S4999480 A JPS4999480 A JP S4999480A JP 48135668 A JP48135668 A JP 48135668A JP 13566873 A JP13566873 A JP 13566873A JP S4999480 A JPS4999480 A JP S4999480A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48135668A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4999480A publication Critical patent/JPS4999480A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
JP48135668A 1973-01-02 1973-12-03 Pending JPS4999480A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/320,400 US4027686A (en) 1973-01-02 1973-01-02 Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water

Publications (1)

Publication Number Publication Date
JPS4999480A true JPS4999480A (ja) 1974-09-19

Family

ID=23246249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48135668A Pending JPS4999480A (ja) 1973-01-02 1973-12-03

Country Status (7)

Country Link
US (1) US4027686A (ja)
JP (1) JPS4999480A (ja)
CA (1) CA987794A (ja)
DE (1) DE2364135A1 (ja)
FR (1) FR2212770A5 (ja)
GB (1) GB1445008A (ja)
NL (1) NL7317476A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
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JPS5275976A (en) * 1975-12-22 1977-06-25 Fujitsu Ltd Wafer cleaning device
JPS551114A (en) * 1978-06-19 1980-01-07 Hitachi Ltd Method and device for washing wafer
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS56115538A (en) * 1980-02-19 1981-09-10 Toshiba Corp Treating method for semiconductor patterning wafer
JPS57100229U (ja) * 1981-11-12 1982-06-19
JPS587831A (ja) * 1981-07-07 1983-01-17 Sumitomo Shoji Kk 高圧水によるウェハの洗浄方法及び装置
JPS61144636U (ja) * 1985-02-28 1986-09-06
JP2003503845A (ja) * 1999-06-25 2003-01-28 ラム リサーチ コーポレーション 化学機械研磨またはプラズマ処理の後にウエハを洗浄するための方法およびシステム

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275976A (en) * 1975-12-22 1977-06-25 Fujitsu Ltd Wafer cleaning device
JPS551114A (en) * 1978-06-19 1980-01-07 Hitachi Ltd Method and device for washing wafer
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS56115538A (en) * 1980-02-19 1981-09-10 Toshiba Corp Treating method for semiconductor patterning wafer
JPS587831A (ja) * 1981-07-07 1983-01-17 Sumitomo Shoji Kk 高圧水によるウェハの洗浄方法及び装置
JPS57100229U (ja) * 1981-11-12 1982-06-19
JPS61144636U (ja) * 1985-02-28 1986-09-06
JPH0528758Y2 (ja) * 1985-02-28 1993-07-23
JP2003503845A (ja) * 1999-06-25 2003-01-28 ラム リサーチ コーポレーション 化学機械研磨またはプラズマ処理の後にウエハを洗浄するための方法およびシステム
JP4667687B2 (ja) * 1999-06-25 2011-04-13 ラム リサーチ コーポレーション 化学機械研磨またはプラズマ処理の後にウエハを洗浄するための方法およびシステム

Also Published As

Publication number Publication date
CA987794A (en) 1976-04-20
US4027686A (en) 1977-06-07
GB1445008A (en) 1976-08-04
NL7317476A (ja) 1974-07-04
FR2212770A5 (ja) 1974-07-26
DE2364135A1 (de) 1974-07-11

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