CA2455078C - Solid sheet material especially useful for circuit boards - Google Patents

Solid sheet material especially useful for circuit boards Download PDF

Info

Publication number
CA2455078C
CA2455078C CA 2455078 CA2455078A CA2455078C CA 2455078 C CA2455078 C CA 2455078C CA 2455078 CA2455078 CA 2455078 CA 2455078 A CA2455078 A CA 2455078A CA 2455078 C CA2455078 C CA 2455078C
Authority
CA
Canada
Prior art keywords
sheet
tensile modulus
fibers
recited
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA 2455078
Other languages
English (en)
French (fr)
Other versions
CA2455078A1 (en
Inventor
Michael R. Samuels
Subhotosh Kahn
Mikhail R. Levit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CA2455078A1 publication Critical patent/CA2455078A1/en
Application granted granted Critical
Publication of CA2455078C publication Critical patent/CA2455078C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Paper (AREA)
  • Reinforced Plastic Materials (AREA)
  • Nonwoven Fabrics (AREA)
CA 2455078 2001-08-30 2002-08-29 Solid sheet material especially useful for circuit boards Expired - Fee Related CA2455078C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31589001P 2001-08-30 2001-08-30
US60/315,890 2001-08-30
PCT/US2002/027545 WO2003020511A1 (en) 2001-08-30 2002-08-29 Solid sheet material especially useful for circuit boards

Publications (2)

Publication Number Publication Date
CA2455078A1 CA2455078A1 (en) 2003-03-13
CA2455078C true CA2455078C (en) 2011-07-12

Family

ID=23226507

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2455078 Expired - Fee Related CA2455078C (en) 2001-08-30 2002-08-29 Solid sheet material especially useful for circuit boards

Country Status (10)

Country Link
US (1) US20030082974A1 (enExample)
EP (1) EP1420949B1 (enExample)
JP (1) JP4263603B2 (enExample)
KR (1) KR20040029100A (enExample)
CN (1) CN100421925C (enExample)
BR (1) BR0212704A (enExample)
CA (1) CA2455078C (enExample)
MX (1) MXPA04001901A (enExample)
TW (1) TWI299696B (enExample)
WO (1) WO2003020511A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020142689A1 (en) * 2001-01-23 2002-10-03 Levit Mikhail R. Non-woven sheet of aramid floc
JP4827460B2 (ja) * 2005-08-24 2011-11-30 三井・デュポンフロロケミカル株式会社 含フッ素樹脂積層体
JP4224486B2 (ja) * 2005-10-31 2009-02-12 日本ピラー工業株式会社 プリント基板をミリメートル波帯域通信に使用する方法
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
US20080286522A1 (en) * 2006-12-15 2008-11-20 Subhotosh Khan Honeycomb having a low coefficient of thermal expansion and articles made from same
US7815993B2 (en) * 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
US20080145602A1 (en) 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7785520B2 (en) * 2006-12-15 2010-08-31 E.I. Du Pont De Nemours And Company Processes for making shaped honeycomb and honeycombs made thereby
US7771809B2 (en) * 2006-12-15 2010-08-10 E. I. Du Pont De Nemours And Company Shaped honeycomb
US8025949B2 (en) 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
US7771811B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US8118975B2 (en) * 2007-12-21 2012-02-21 E. I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US8114251B2 (en) * 2007-12-21 2012-02-14 E.I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US7803247B2 (en) * 2007-12-21 2010-09-28 E.I. Du Pont De Nemours And Company Papers containing floc derived from diamino diphenyl sulfone
US20110281063A1 (en) * 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Honeycomb core based on carbon fiber paper and articles made from same
JP2011190382A (ja) * 2010-03-16 2011-09-29 Sumitomo Chemical Co Ltd 液晶ポリエステル含浸繊維シートの製造方法
WO2014188830A1 (ja) * 2013-05-22 2014-11-27 株式会社村田製作所 フィブリル化液晶ポリマーパウダー、フィブリル化液晶ポリマーパウダーの製造方法、ペースト、樹脂多層基板、および、樹脂多層基板の製造方法
CN108396581B (zh) * 2018-02-06 2020-01-14 深圳市新纶科技股份有限公司 一种纤维浆粕的制备方法及其制备的纤维浆粕
CN110154464A (zh) * 2019-06-14 2019-08-23 赣州龙邦材料科技有限公司 芳纶纸基挠性覆铜板及其制造方法
CN114261167A (zh) * 2021-04-20 2022-04-01 惠生(中国)投资有限公司 一种含液晶聚合物的复合材料及其加工成型方法和用途
JP2023111314A (ja) * 2022-01-31 2023-08-10 富士フイルム株式会社 フィルム及び積層体

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620903A (en) 1962-07-06 1971-11-16 Du Pont Lightweight nonpatterned nonwoven fabric
US3756908A (en) 1971-02-26 1973-09-04 Du Pont Synthetic paper structures of aromatic polyamides
PH15509A (en) 1974-05-10 1983-02-03 Du Pont Improvements in an relating to synthetic polyesters
BE849812A (fr) * 1976-12-23 1977-06-23 Materiau isolant planiforme
FR2507123A1 (fr) * 1981-06-04 1982-12-10 Arjomari Prioux Semi-produit composite en feuille constitue d'un composant thermoplastique et d'un renfort en polyaramide, son procede de preparation, et les produits finis correspondants obtenus a chaud
EP0167682A1 (en) * 1984-05-02 1986-01-15 Celanese Corporation High performance papers comprised of fibrils of thermotropic liquid crystal polymers
US4886578A (en) 1987-09-24 1989-12-12 E. I. Du Pont De Nemours And Company High heat resistant oil-impregnatable electrical insulating board
IT1223401B (it) 1987-12-02 1990-09-19 Montedison Spa Poliesteri aromatici liquido cristallini termotropici
US4895752A (en) * 1987-12-18 1990-01-23 E. I. Du Pont De Nemours And Company Low dielectric constant laminate of fluoropolymer and polyaramid
CA1298770C (en) * 1987-12-18 1992-04-14 Craig S. Mcewen Low dielectric constant laminate of fluoropolymer and polyaramid
IT1215682B (it) 1988-01-12 1990-02-22 Montedison Spa Poliesteri aromatici liquido cristallini termotropici.
US5025082A (en) 1988-08-24 1991-06-18 Mitsubishi Kasei Corporation Aromatic polyester, aromatic polyester-amide and processes for producing the same
DE3914048A1 (de) 1988-09-13 1990-03-22 Bayer Ag Leichtfliessende polyamid-formmassen und -legierungen
JPH02196819A (ja) 1989-01-25 1990-08-03 Nippon Oil Co Ltd 全芳香族ポリエステル
JP3086231B2 (ja) 1989-11-01 2000-09-11 ポリプラスチックス株式会社 溶融時に異方性を示すポリエステル樹脂及び樹脂組成物
DE4006404A1 (de) 1990-03-01 1991-09-05 Bayer Ag Leichtfliessende polyamid-formmassen
US5015722A (en) 1990-04-04 1991-05-14 Hoechst Celanese Corporation Melt-processable polyester capable of forming an anisotropic melt which exhibits a highly attractive balance between its molding and heat deflection temperatures
US5196259A (en) * 1990-12-07 1993-03-23 The Dow Chemical Company Matrix composites in which the matrix contains polybenzoxazole or polybenzothiazole
US5110896A (en) 1990-12-10 1992-05-05 E. I. Du Pont De Nemours And Company Thermotropic liquid crystalline polyester compositions
ES2091954T3 (es) * 1991-01-22 1996-11-16 Hoechst Ag Material de velo consolidado por un aglutinante termofusible.
EP0510927A3 (en) * 1991-04-23 1993-03-17 Teijin Limited Fiber-reinforced thermoplastic sheet and process for the production thereof
US5194484A (en) * 1991-09-25 1993-03-16 E. I. Du Pont De Nemours And Company Process for making fluoropolymer composites
US5710237A (en) 1994-09-06 1998-01-20 E. I. Du Pont De Nemours And Company Liquid crystalline polyester resin
EP0842214B1 (en) * 1995-08-03 2001-02-28 Akzo Nobel N.V. Fluororesin sheet, process for producing the same, and the use of same
EP0768334B1 (en) * 1995-10-16 2004-02-18 Sumitomo Chemical Company Limited Prepreg, process for producing the same and printed circuit substrate using the same
US6319605B1 (en) * 1997-06-10 2001-11-20 Teijin Limited Heat-resistant fiber paper
US5998309A (en) 1997-07-17 1999-12-07 E. I. Du Pont De Nemours And Company Molded aramid sheets
JP3869559B2 (ja) * 1998-09-28 2007-01-17 新神戸電機株式会社 電気絶縁用不織布ならびにプリプレグ及び積層板

Also Published As

Publication number Publication date
CA2455078A1 (en) 2003-03-13
US20030082974A1 (en) 2003-05-01
EP1420949A1 (en) 2004-05-26
MXPA04001901A (es) 2004-06-15
CN100421925C (zh) 2008-10-01
WO2003020511A1 (en) 2003-03-13
TWI299696B (en) 2008-08-11
EP1420949B1 (en) 2012-04-04
JP4263603B2 (ja) 2009-05-13
CN1551828A (zh) 2004-12-01
KR20040029100A (ko) 2004-04-03
BR0212704A (pt) 2004-08-03
JP2005501933A (ja) 2005-01-20

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EEER Examination request
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Effective date: 20140829