CA2350422A1 - Procede de metallisation d'une surface en plastique - Google Patents
Procede de metallisation d'une surface en plastique Download PDFInfo
- Publication number
- CA2350422A1 CA2350422A1 CA002350422A CA2350422A CA2350422A1 CA 2350422 A1 CA2350422 A1 CA 2350422A1 CA 002350422 A CA002350422 A CA 002350422A CA 2350422 A CA2350422 A CA 2350422A CA 2350422 A1 CA2350422 A1 CA 2350422A1
- Authority
- CA
- Canada
- Prior art keywords
- solution
- accordance
- plastic surface
- etching
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
L'invention porte sur un procédé de métallisation d'une surface en plastique et comprend les étapes suivantes: la surface en plastique est d'abord soumise à un traitement d'attaque chimique dans des conditions d'attaque chimique douces. Puis, la surface en plastique est traitée avec une solution de sel métallique contenant au moins un sel du groupe suivant: <=sel de cobalt, sel d'argent, sel d'étain, sel de plomb >=. La surface en plastique est traitée avec une solution sulfurée. Enfin, la surface en plastique est métallisée dans un bain de métallisation.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LT98-161A LT4713B (lt) | 1998-11-13 | 1998-11-13 | Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas |
LT98-161 | 1998-11-13 | ||
DE19904665.4 | 1999-02-04 | ||
DE1999104665 DE19904665A1 (de) | 1999-02-04 | 1999-02-04 | Verfahren zur Metallisierung einer Kunststoffoberfläche |
EP99115967.4 | 1999-08-13 | ||
EP99115967A EP1001052B1 (fr) | 1998-11-13 | 1999-08-13 | Procédé pour metalliser une surface de plastique |
PCT/US1999/026066 WO2000029646A1 (fr) | 1998-11-13 | 1999-11-05 | Procede de metallisation d'une surface en plastique |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2350422A1 true CA2350422A1 (fr) | 2000-05-25 |
Family
ID=27218955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002350422A Abandoned CA2350422A1 (fr) | 1998-11-13 | 1999-11-05 | Procede de metallisation d'une surface en plastique |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP2002530529A (fr) |
CN (1) | CN1184361C (fr) |
AU (1) | AU1243300A (fr) |
BR (1) | BR9915280A (fr) |
CA (1) | CA2350422A1 (fr) |
MX (1) | MXPA01004811A (fr) |
TW (1) | TWI221163B (fr) |
WO (1) | WO2000029646A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7354870B2 (en) | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LT2000074A (lt) * | 2000-07-20 | 2002-01-25 | Mykolas Baranauskas | Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas |
GB0118870D0 (en) * | 2001-08-02 | 2001-09-26 | Shipley Co Llc | A combined adhesion promotion and direct metallization process |
DE10138446A1 (de) * | 2001-08-04 | 2003-02-13 | Enthone Omi Deutschland Gmbh | Verfahren zur Metallisierung von Kunststoffoberflächen |
US7163835B2 (en) * | 2003-09-26 | 2007-01-16 | E. I. Du Pont De Nemours And Company | Method for producing thin semiconductor films by deposition from solution |
DE102004026489B3 (de) * | 2004-05-27 | 2005-09-29 | Enthone Inc., West Haven | Verfahren zur Metallisierung von Kunststoffoberflächen |
JP4494309B2 (ja) * | 2005-08-05 | 2010-06-30 | 柿原工業株式会社 | 銅フリーのニッケル−クロム樹脂めっきの耐食性向上方法 |
JP4494310B2 (ja) * | 2005-08-05 | 2010-06-30 | 柿原工業株式会社 | 銅フリー樹脂めっきの成膜方法 |
DE102005051632B4 (de) | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
CN102102197B (zh) * | 2005-12-06 | 2014-04-16 | 荏原优莱特科技股份有限公司 | 钯配合物以及使用该配合物的催化剂赋予处理液 |
WO2007116493A1 (fr) * | 2006-03-31 | 2007-10-18 | Ebara-Udylite Co., Ltd. | Liquide de modification de surface pour plastique et procédé de métallisation de surface en plastique au moyen de ce liquide |
US8394289B2 (en) | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
KR20100014699A (ko) * | 2007-04-18 | 2010-02-10 | 에바라 유지라이토 가부시키가이샤 | 에칭액 및 이를 이용한 플라스틱 표면의 금속화 방법 |
JP4849420B2 (ja) * | 2007-06-20 | 2012-01-11 | 奥野製薬工業株式会社 | エッチング液の電解処理方法 |
PL2025708T3 (pl) | 2007-08-10 | 2010-03-31 | Enthone | Roztwór trawiący do powierzchni tworzyw sztucznych nie zawierający chromu |
JP5339023B2 (ja) * | 2007-10-09 | 2013-11-13 | 奥野製薬工業株式会社 | スミア除去用組成物 |
CN102668044A (zh) * | 2009-11-18 | 2012-09-12 | 3M创新有限公司 | 用于ii-vi族半导体的新型湿蚀刻剂及方法 |
DE102011111294B4 (de) * | 2011-08-26 | 2018-12-20 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung |
EP2639333A1 (fr) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Procédé de métallisation de surfaces en matière synthétique non conductrices |
EP2639334A1 (fr) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Procédé de métallisation de surfaces en matière synthétique non conductrices |
EP2639332A1 (fr) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Procédé de métallisation de surfaces en matière synthétique non conductrices |
LT6070B (lt) * | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
EP2767614A1 (fr) * | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Procédé pour déposer une première couche métallique sur des polymères non conducteurs |
EP2937446B1 (fr) * | 2013-10-22 | 2018-06-13 | Okuno Chemical Industries Co., Ltd. | Composition pour le traitement par gravure d'un matériau résineux |
CN104975276B (zh) * | 2014-04-11 | 2019-07-12 | 深圳市泛友科技有限公司 | 在塑料表面形成选择性金属线路的方法及塑料部件 |
WO2015183304A1 (fr) * | 2014-05-30 | 2015-12-03 | Uab Rekin International | Pré-traitement d'adhérence sans chrome pour des matières plastiques |
CN105369227B (zh) * | 2015-12-08 | 2017-08-25 | 丽水学院 | 用于酸性高锰酸钾溶液的稳定剂 |
JP6750293B2 (ja) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | プラスチック表面の処理方法 |
CN106086838B (zh) * | 2016-06-21 | 2019-04-02 | 太仓碧奇新材料研发有限公司 | 钕锌钴合金/聚丙烯支架材料的制备方法 |
CN106011801A (zh) * | 2016-06-27 | 2016-10-12 | 镇江阿尔法特种镀膜科技有限公司 | 一种特种工程塑料用粗化溶液 |
JP6288213B1 (ja) * | 2016-11-01 | 2018-03-07 | 栗田工業株式会社 | プラスチック表面の処理方法 |
WO2018115338A1 (fr) * | 2016-12-21 | 2018-06-28 | Hso Herbert Schmidt Gmbh & Co. Kg | Solution de décapage de matières plastiques |
EP3825441A1 (fr) * | 2019-11-21 | 2021-05-26 | COVENTYA S.p.A. | Dispositif de traitement électrolytique pour préparer des pièces en plastique à métalliser et procédé de gravure de pièces en plastique |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4810333A (en) * | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
US4917761A (en) * | 1989-08-14 | 1990-04-17 | Eastman Kodak Company | Method of rendering polymeric materials hydrophilic for etching |
US5110633A (en) * | 1989-09-01 | 1992-05-05 | Ciba-Geigy Corporation | Process for coating plastics articles |
US4919768A (en) * | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
US5192590A (en) * | 1989-11-03 | 1993-03-09 | Raychem Corporation | Coating metal on poly(aryl ether ketone) surfaces |
US5238550A (en) * | 1991-11-27 | 1993-08-24 | Shipley Company Inc. | Electroplating process |
-
1999
- 1999-11-05 CA CA002350422A patent/CA2350422A1/fr not_active Abandoned
- 1999-11-05 AU AU12433/00A patent/AU1243300A/en not_active Abandoned
- 1999-11-05 JP JP2000582621A patent/JP2002530529A/ja active Pending
- 1999-11-05 CN CNB998154938A patent/CN1184361C/zh not_active Expired - Fee Related
- 1999-11-05 MX MXPA01004811A patent/MXPA01004811A/es not_active Application Discontinuation
- 1999-11-05 WO PCT/US1999/026066 patent/WO2000029646A1/fr not_active Application Discontinuation
- 1999-11-05 BR BR9915280-0A patent/BR9915280A/pt not_active IP Right Cessation
- 1999-11-11 TW TW088119793A patent/TWI221163B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7354870B2 (en) | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
Also Published As
Publication number | Publication date |
---|---|
WO2000029646A1 (fr) | 2000-05-25 |
MXPA01004811A (es) | 2002-09-18 |
AU1243300A (en) | 2000-06-05 |
JP2002530529A (ja) | 2002-09-17 |
CN1184361C (zh) | 2005-01-12 |
TWI221163B (en) | 2004-09-21 |
CN1333843A (zh) | 2002-01-30 |
BR9915280A (pt) | 2001-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
FZDE | Dead |