CA2093924C - Acid bath for copper plating - Google Patents

Acid bath for copper plating Download PDF

Info

Publication number
CA2093924C
CA2093924C CA002093924A CA2093924A CA2093924C CA 2093924 C CA2093924 C CA 2093924C CA 002093924 A CA002093924 A CA 002093924A CA 2093924 A CA2093924 A CA 2093924A CA 2093924 C CA2093924 C CA 2093924C
Authority
CA
Canada
Prior art keywords
bath
beta
bath according
phenazonium
naphthol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA002093924A
Other languages
English (en)
French (fr)
Other versions
CA2093924A1 (en
Inventor
Wolfgang Dahms
Horst Westphal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CA2093924A1 publication Critical patent/CA2093924A1/en
Application granted granted Critical
Publication of CA2093924C publication Critical patent/CA2093924C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
CA002093924A 1990-10-13 1991-10-11 Acid bath for copper plating Expired - Lifetime CA2093924C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4032864A DE4032864A1 (de) 1990-10-13 1990-10-13 Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DEP4032864.3 1990-10-13
PCT/DE1991/000811 WO1992007116A1 (de) 1990-10-13 1991-10-11 Saures bad zur galvanischen abscheidung von kupferüberzügen und verfahren unter verwendung dieser kombination

Publications (2)

Publication Number Publication Date
CA2093924A1 CA2093924A1 (en) 1992-04-14
CA2093924C true CA2093924C (en) 2002-02-05

Family

ID=6416407

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002093924A Expired - Lifetime CA2093924C (en) 1990-10-13 1991-10-11 Acid bath for copper plating

Country Status (7)

Country Link
EP (1) EP0554275B1 (de)
JP (1) JPH06501986A (de)
AT (1) ATE115651T1 (de)
CA (1) CA2093924C (de)
DE (2) DE4032864A1 (de)
ES (1) ES2066477T3 (de)
WO (1) WO1992007116A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
DE102004041701A1 (de) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Verfahren zur elektrolytischen Abscheidung von Metallen
US7282602B2 (en) * 2004-09-21 2007-10-16 Bionumerik Pharmaceuticals, Inc. Medicinal disulfide salts
KR101362062B1 (ko) * 2006-01-27 2014-02-11 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 함인동을 애노드로 하는 전해 동도금액용 첨가제, 전해동도금액 및 전해 동도금 방법
DE102014208733A1 (de) 2014-05-09 2015-11-12 Dr. Hesse Gmbh & Cie Kg Verfahren zum elektrolytischen Abscheiden von Kupfer aus Wasser basierenden Elektrolyten
JP7064115B2 (ja) 2016-08-15 2022-05-10 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 電解銅めっきのための酸性水性組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (de) * 1962-04-16
DE1246347B (de) * 1966-03-08 1967-08-03 Schering Ag Saures galvanisches Kupferbad
DE2039831C3 (de) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
IT1046971B (it) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Begno per l elettrodeposizione di rame e metodo per prepararlo
DE2721985A1 (de) * 1977-05-14 1978-11-16 Bayer Ag Verfahren zur herstellung von urethan- und/oder harnstoffgruppen aufweisenden polyisocyanat polyadditionsprodukten
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (fr) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
JPS59501829A (ja) * 1982-09-30 1984-11-01 リ−ロ−ナル　インコ−ポレ−テツド 電気銅メッキ液
DE3402999A1 (de) * 1984-01-28 1985-08-01 Skw Trostberg Ag, 8223 Trostberg Duengerloesungen
DE3721985A1 (de) * 1987-06-30 1989-01-12 Schering Ag Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege

Also Published As

Publication number Publication date
DE59103933D1 (de) 1995-01-26
JPH06501986A (ja) 1994-03-03
EP0554275A1 (de) 1993-08-11
DE4032864C2 (de) 1993-01-07
ATE115651T1 (de) 1994-12-15
CA2093924A1 (en) 1992-04-14
DE4032864A1 (de) 1992-04-16
WO1992007116A1 (de) 1992-04-30
ES2066477T3 (es) 1995-03-01
EP0554275B1 (de) 1994-12-14

Similar Documents

Publication Publication Date Title
US7857961B2 (en) Copper plating bath formulation
JP2859326B2 (ja) 光沢があり、亀裂を有さない銅被膜を電気的に析出させる酸性水浴及び印刷回路の導電路補強法
JP3121346B2 (ja) 銅の電解析出のための酸性めっき浴及び当該浴の使用法
US4555315A (en) High speed copper electroplating process and bath therefor
US4336114A (en) Electrodeposition of bright copper
US20030159938A1 (en) Electroplating solution containing organic acid complexing agent
EP1754805B1 (de) Zinn galvanisches Bad und Zinn galvanisches Abscheidungsverfahren
US5849171A (en) Acid bath for copper plating and process with the use of this combination
US20060272950A1 (en) High purity electrolytic sulfonic acid solutions
CN101243210A (zh) 具有最小化锡晶须生长性能或特性的锡电沉积物
JPS62196391A (ja) スズ―鉛電気メッキ溶液およびそれを用いた高速電気メッキ方法
US20060113195A1 (en) Near neutral pH tin electroplating solution
US4515663A (en) Acid zinc and zinc alloy electroplating solution and process
US20040149587A1 (en) Electroplating solution containing organic acid complexing agent
EP1574599B1 (de) Kupferelektrolyselösung und damit hergestellte elektrolytkupferfolie
CA2093924C (en) Acid bath for copper plating
JPH01283400A (ja) 亜鉛−ニッケル合金電気めっき液
JP3263750B2 (ja) 酸性銅めっき浴及びこれを使用するめっき方法
US4036710A (en) Electrodeposition of copper
US3926749A (en) Tin-lead alloy plating
US6342148B1 (en) Tin electroplating bath
KR102339866B1 (ko) 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
GB2141140A (en) Electrodeposition of copper
JP2667323B2 (ja) 酸化防止剤、めっき浴用助剤およびこれを用いためっき浴
KR102173164B1 (ko) 징케이트 도금액용 혼합 광택제 및 이를 포함하는 징케이트 도금액

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKEC Expiry (correction)

Effective date: 20121202