CA2086138C - Laser-formed electrical component and method for making same - Google Patents

Laser-formed electrical component and method for making same

Info

Publication number
CA2086138C
CA2086138C CA002086138A CA2086138A CA2086138C CA 2086138 C CA2086138 C CA 2086138C CA 002086138 A CA002086138 A CA 002086138A CA 2086138 A CA2086138 A CA 2086138A CA 2086138 C CA2086138 C CA 2086138C
Authority
CA
Canada
Prior art keywords
layer
laser light
conductive material
pattern
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002086138A
Other languages
English (en)
French (fr)
Other versions
CA2086138A1 (en
Inventor
Herman R. Person
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Dale Electronics LLC
Original Assignee
Dale Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dale Electronics Inc filed Critical Dale Electronics Inc
Publication of CA2086138A1 publication Critical patent/CA2086138A1/en
Application granted granted Critical
Publication of CA2086138C publication Critical patent/CA2086138C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CA002086138A 1992-01-21 1992-12-23 Laser-formed electrical component and method for making same Expired - Fee Related CA2086138C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82312692A 1992-01-21 1992-01-21
US07/823,126 1992-01-21

Publications (2)

Publication Number Publication Date
CA2086138A1 CA2086138A1 (en) 1993-07-22
CA2086138C true CA2086138C (en) 1999-09-14

Family

ID=25237866

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002086138A Expired - Fee Related CA2086138C (en) 1992-01-21 1992-12-23 Laser-formed electrical component and method for making same

Country Status (5)

Country Link
JP (1) JPH07118419B2 (ja)
CA (1) CA2086138C (ja)
DE (1) DE4301570B4 (ja)
FR (1) FR2686475A1 (ja)
GB (1) GB2263582B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302932A (en) * 1992-05-12 1994-04-12 Dale Electronics, Inc. Monolythic multilayer chip inductor and method for making same
DE4401612A1 (de) * 1994-01-20 1995-07-27 Resma Gmbh Verfahren und Vorrichtung zur Erzeugung elektrisch leitender Bereiche auf Metallverbindungen enthaltenden isolierenden Keramikwerkstücken
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
DE19603971A1 (de) * 1996-01-26 1997-07-31 Emi Tec Elektronische Material Verfahren zur Herstellung einer Dateneingabevorrichtung
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils
US5922514A (en) 1997-09-17 1999-07-13 Dale Electronics, Inc. Thick film low value high frequency inductor, and method of making the same
DE19817852B4 (de) * 1998-04-22 2009-04-16 Theodor Dr. Doll Nutzenfertigung von Induktivitäten mit Mikrotechniken
GB2348321A (en) * 1999-03-23 2000-09-27 Mitel Semiconductor Ltd A laminated transformer and a method of its manufacture
JP2003534657A (ja) 2000-05-19 2003-11-18 フィリップ エイ． ハーディング スロット付きコア変圧器およびインダクタ
WO2002025797A2 (en) * 2000-09-22 2002-03-28 M-Flex Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
AU2005314077B2 (en) 2004-12-07 2010-08-05 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
DE102010052401A1 (de) 2010-11-24 2012-05-24 Giesecke & Devrient Gmbh Leiterbahnanordnung für tragbare Datenträger

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB993265A (en) * 1962-04-10 1965-05-26 Tokyo Denshi Seiki Kabushiki K Electrical coils
US3588439A (en) * 1967-05-12 1971-06-28 Rca Corp High resolution laser engraving apparatus
GB1239777A (en) * 1968-10-03 1971-07-21 Nat Res Dev Improvements in shaping workpieces
US3848210A (en) * 1972-12-11 1974-11-12 Vanguard Electronics Miniature inductor
DE2518279A1 (de) * 1975-04-24 1976-11-04 Siemens Ag Verfahren zur herstellung eines induktiven bauelements
JPS5853805A (ja) * 1981-09-25 1983-03-30 Matsushita Electric Ind Co Ltd インダクタンス調整方法およびインダクタ
DE3245272A1 (de) * 1982-12-07 1984-06-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Verfahren zur herstellung miniaturisierter dick- und duennschichtschaltungen
JPS6373606A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 厚膜インダクタの製造方法
DE3843230C1 (en) * 1988-12-22 1989-09-21 W.C. Heraeus Gmbh, 6450 Hanau, De Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks
US4909895A (en) * 1989-04-11 1990-03-20 Pacific Bell System and method for providing a conductive circuit pattern utilizing thermal oxidation
US5018164A (en) * 1989-09-12 1991-05-21 Hughes Aircraft Company Excimer laser ablation method and apparatus for microcircuit fabrication
JPH03142091A (ja) * 1989-10-26 1991-06-17 Mitsubishi Electric Corp 銅張りポリイミドフイルムなどのレーザ加工方法

Also Published As

Publication number Publication date
FR2686475B1 (ja) 1995-01-20
GB2263582B (en) 1995-11-01
FR2686475A1 (fr) 1993-07-23
GB2263582A (en) 1993-07-28
JPH0620842A (ja) 1994-01-28
DE4301570A1 (ja) 1993-07-22
CA2086138A1 (en) 1993-07-22
DE4301570B4 (de) 2004-03-25
JPH07118419B2 (ja) 1995-12-18
GB9226085D0 (en) 1993-02-10

Similar Documents

Publication Publication Date Title
CA2086138C (en) Laser-formed electrical component and method for making same
US6366192B2 (en) Structure of making a thick film low value high frequency inductor
US5639391A (en) Laser formed electrical component and method for making the same
US5091286A (en) Laser-formed electrical component and method for making same
JPH10241991A (ja) 積層コンデンサとそのトリミング方法
EP0181766B1 (en) A high-voltage, noninductive, film-type resistor, and a method of making it
JP3788074B2 (ja) チップ型コイルおよびその製造方法
WO2006127436A1 (en) Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
JPH07192921A (ja) 積層型電子部品
CN100413000C (zh) 生产薄膜芯片电阻的方法
EP0001158B1 (en) Electro-erosion print head assembly and method of manufacture thereof
JP2865903B2 (ja) 積層インダクタ素子とそのインダクタンス調整法
JP2000288765A (ja) セラミックグリーンシートの加工方法及び加工装置
JPS6373606A (ja) 厚膜インダクタの製造方法
JPS5941282B2 (ja) 抵抗素子、抵抗素子集合体およびその製造方法
JPH0555067A (ja) 積層セラミツクインダクタの製造方法
JPS5871647A (ja) リアクタンスのトリミング方法
JPH0855755A (ja) セラミック積層体の切断位置決定方法
JPH07335411A (ja) チップ型抵抗ネットワーク
JPS61222101A (ja) 調整の容易な印刷抵抗の形成方法
JPS61251109A (ja) インダクタンス素子の製造方法
JPH0684617A (ja) トリミング用抵抗器
JPS63127516A (ja) 積層セラミツクトリマコンデンサの製造方法
JPS63207104A (ja) 厚膜抵抗体の抵抗値調整方法
JPH0794309A (ja) トリミング用抵抗器の抵抗値制御方法

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed