GB2263582B - Laser-formed electrical component and method for making same - Google Patents
Laser-formed electrical component and method for making sameInfo
- Publication number
- GB2263582B GB2263582B GB9226085A GB9226085A GB2263582B GB 2263582 B GB2263582 B GB 2263582B GB 9226085 A GB9226085 A GB 9226085A GB 9226085 A GB9226085 A GB 9226085A GB 2263582 B GB2263582 B GB 2263582B
- Authority
- GB
- United Kingdom
- Prior art keywords
- laser
- electrical component
- making same
- formed electrical
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Laser Beam Processing (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82312692A | 1992-01-21 | 1992-01-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9226085D0 GB9226085D0 (en) | 1993-02-10 |
GB2263582A GB2263582A (en) | 1993-07-28 |
GB2263582B true GB2263582B (en) | 1995-11-01 |
Family
ID=25237866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9226085A Expired - Fee Related GB2263582B (en) | 1992-01-21 | 1992-12-15 | Laser-formed electrical component and method for making same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH07118419B2 (ja) |
CA (1) | CA2086138C (ja) |
DE (1) | DE4301570B4 (ja) |
FR (1) | FR2686475A1 (ja) |
GB (1) | GB2263582B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5302932A (en) * | 1992-05-12 | 1994-04-12 | Dale Electronics, Inc. | Monolythic multilayer chip inductor and method for making same |
DE4401612A1 (de) * | 1994-01-20 | 1995-07-27 | Resma Gmbh | Verfahren und Vorrichtung zur Erzeugung elektrisch leitender Bereiche auf Metallverbindungen enthaltenden isolierenden Keramikwerkstücken |
GB2290171B (en) * | 1994-06-03 | 1998-01-21 | Plessey Semiconductors Ltd | Inductor chip device |
DE19603971A1 (de) * | 1996-01-26 | 1997-07-31 | Emi Tec Elektronische Material | Verfahren zur Herstellung einer Dateneingabevorrichtung |
DE19731969A1 (de) * | 1997-07-24 | 1998-08-27 | Siemens Ag | Verfahren zum Herstellen eines elektrischen Bauteils |
US5922514A (en) | 1997-09-17 | 1999-07-13 | Dale Electronics, Inc. | Thick film low value high frequency inductor, and method of making the same |
DE19817852B4 (de) * | 1998-04-22 | 2009-04-16 | Theodor Dr. Doll | Nutzenfertigung von Induktivitäten mit Mikrotechniken |
GB2348321A (en) * | 1999-03-23 | 2000-09-27 | Mitel Semiconductor Ltd | A laminated transformer and a method of its manufacture |
JP2003534657A (ja) | 2000-05-19 | 2003-11-18 | フィリップ エイ. ハーディング | スロット付きコア変圧器およびインダクタ |
WO2002025797A2 (en) * | 2000-09-22 | 2002-03-28 | M-Flex Multi-Fineline Electronix, Inc. | Electronic transformer/inductor devices and methods for making same |
US7135952B2 (en) | 2002-09-16 | 2006-11-14 | Multi-Fineline Electronix, Inc. | Electronic transformer/inductor devices and methods for making same |
US7436282B2 (en) | 2004-12-07 | 2008-10-14 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
AU2005314077B2 (en) | 2004-12-07 | 2010-08-05 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
US7645941B2 (en) | 2006-05-02 | 2010-01-12 | Multi-Fineline Electronix, Inc. | Shielded flexible circuits and methods for manufacturing same |
DE102010052401A1 (de) | 2010-11-24 | 2012-05-24 | Giesecke & Devrient Gmbh | Leiterbahnanordnung für tragbare Datenträger |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB993265A (en) * | 1962-04-10 | 1965-05-26 | Tokyo Denshi Seiki Kabushiki K | Electrical coils |
GB1239777A (en) * | 1968-10-03 | 1971-07-21 | Nat Res Dev | Improvements in shaping workpieces |
US3848210A (en) * | 1972-12-11 | 1974-11-12 | Vanguard Electronics | Miniature inductor |
US4909895A (en) * | 1989-04-11 | 1990-03-20 | Pacific Bell | System and method for providing a conductive circuit pattern utilizing thermal oxidation |
US5018164A (en) * | 1989-09-12 | 1991-05-21 | Hughes Aircraft Company | Excimer laser ablation method and apparatus for microcircuit fabrication |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3588439A (en) * | 1967-05-12 | 1971-06-28 | Rca Corp | High resolution laser engraving apparatus |
DE2518279A1 (de) * | 1975-04-24 | 1976-11-04 | Siemens Ag | Verfahren zur herstellung eines induktiven bauelements |
JPS5853805A (ja) * | 1981-09-25 | 1983-03-30 | Matsushita Electric Ind Co Ltd | インダクタンス調整方法およびインダクタ |
DE3245272A1 (de) * | 1982-12-07 | 1984-06-07 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Verfahren zur herstellung miniaturisierter dick- und duennschichtschaltungen |
JPS6373606A (ja) * | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | 厚膜インダクタの製造方法 |
DE3843230C1 (en) * | 1988-12-22 | 1989-09-21 | W.C. Heraeus Gmbh, 6450 Hanau, De | Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks |
JPH03142091A (ja) * | 1989-10-26 | 1991-06-17 | Mitsubishi Electric Corp | 銅張りポリイミドフイルムなどのレーザ加工方法 |
-
1992
- 1992-12-15 GB GB9226085A patent/GB2263582B/en not_active Expired - Fee Related
- 1992-12-23 CA CA002086138A patent/CA2086138C/en not_active Expired - Fee Related
-
1993
- 1993-01-06 JP JP5016754A patent/JPH07118419B2/ja not_active Expired - Fee Related
- 1993-01-21 DE DE4301570A patent/DE4301570B4/de not_active Expired - Fee Related
- 1993-01-21 FR FR9300609A patent/FR2686475A1/fr active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB993265A (en) * | 1962-04-10 | 1965-05-26 | Tokyo Denshi Seiki Kabushiki K | Electrical coils |
GB1239777A (en) * | 1968-10-03 | 1971-07-21 | Nat Res Dev | Improvements in shaping workpieces |
US3848210A (en) * | 1972-12-11 | 1974-11-12 | Vanguard Electronics | Miniature inductor |
US4909895A (en) * | 1989-04-11 | 1990-03-20 | Pacific Bell | System and method for providing a conductive circuit pattern utilizing thermal oxidation |
US5018164A (en) * | 1989-09-12 | 1991-05-21 | Hughes Aircraft Company | Excimer laser ablation method and apparatus for microcircuit fabrication |
Also Published As
Publication number | Publication date |
---|---|
FR2686475B1 (ja) | 1995-01-20 |
FR2686475A1 (fr) | 1993-07-23 |
GB2263582A (en) | 1993-07-28 |
JPH0620842A (ja) | 1994-01-28 |
DE4301570A1 (ja) | 1993-07-22 |
CA2086138A1 (en) | 1993-07-22 |
DE4301570B4 (de) | 2004-03-25 |
CA2086138C (en) | 1999-09-14 |
JPH07118419B2 (ja) | 1995-12-18 |
GB9226085D0 (en) | 1993-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960015761B1 (en) | Charaster gerenating method and apparatus | |
AU4985993A (en) | Toothbrush and method for making such toothbrush | |
GB2263582B (en) | Laser-formed electrical component and method for making same | |
HK60196A (en) | Method and apparatus for electrical discharge machining | |
GB2293342B (en) | Solder paste and method for producing | |
EP0494463A3 (en) | Connection method and connection device for electrical connection of small portions | |
GB9325993D0 (en) | Method and apparatus for connection | |
GB9226594D0 (en) | Autolevelling method and apparatus | |
SG59992A1 (en) | Solder-coating method and solder paste suitable for use therein | |
GB9502275D0 (en) | Soldering flux and process for soldering with same | |
GB2270771B (en) | Weigh-filling method and apparatus | |
EP0592071A3 (en) | An oxide removal method | |
SG73956A1 (en) | Tubelar connection method for making same and tool therefor | |
SG47770A1 (en) | Connector device and method for manufacturing the same | |
HK97093A (en) | Cable terminal and method for its manufacture | |
GB2265101B (en) | Soldering apparatus and method | |
AU4838890A (en) | Method and arrangement for controlling electrical devices | |
GB2270590B (en) | Semiconductor device and method for its manufacture | |
HU9300927D0 (en) | Method for hetero-annulation | |
EP0378369A3 (en) | Soldering method and soldering apparatus | |
EP0592070A3 (en) | An oxide removal method | |
HUT75422A (en) | Gypsbonded forms and method for making thereof | |
EP0589602A3 (en) | Potted electrical components and methods of making the same | |
GB9204525D0 (en) | Soldering apparatus | |
GB2289640B (en) | Method for soldering electronic component and apparatus therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20081215 |