CA2061093A1 - Filler for heat-conductive thermosetting resins - Google Patents

Filler for heat-conductive thermosetting resins

Info

Publication number
CA2061093A1
CA2061093A1 CA002061093A CA2061093A CA2061093A1 CA 2061093 A1 CA2061093 A1 CA 2061093A1 CA 002061093 A CA002061093 A CA 002061093A CA 2061093 A CA2061093 A CA 2061093A CA 2061093 A1 CA2061093 A1 CA 2061093A1
Authority
CA
Canada
Prior art keywords
volume
weight
component
mixture
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002061093A
Other languages
English (en)
French (fr)
Inventor
Patrice Bujard
Werner Sieber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2061093A1 publication Critical patent/CA2061093A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C01P2004/53—Particles with a specific particle size distribution bimodal size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
CA002061093A 1991-02-14 1992-02-12 Filler for heat-conductive thermosetting resins Abandoned CA2061093A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH45491 1991-02-14
CH454/91-9 1991-02-14

Publications (1)

Publication Number Publication Date
CA2061093A1 true CA2061093A1 (en) 1992-08-15

Family

ID=4187395

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002061093A Abandoned CA2061093A1 (en) 1991-02-14 1992-02-12 Filler for heat-conductive thermosetting resins

Country Status (6)

Country Link
EP (1) EP0499585B1 (en:Method)
JP (1) JP3176416B2 (en:Method)
KR (1) KR100210184B1 (en:Method)
CA (1) CA2061093A1 (en:Method)
DE (1) DE59203064D1 (en:Method)
TW (1) TW197458B (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794030B1 (en) 1999-11-30 2004-09-21 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet
US7595358B2 (en) 2003-06-04 2009-09-29 Showa Denko K.K. Corundum for filling in resin and resin composition
US20100163783A1 (en) * 2008-12-29 2010-07-01 Nan Ya Plastics Corporation High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof
EP2740765A4 (en) * 2011-08-04 2015-05-06 Hitachi Ltd EPOXY RESIN COMPOSITION FOR MOLDING AND ELECTRICAL DEVICE THEREWITH
WO2019133482A1 (en) * 2017-12-27 2019-07-04 3M Innovative Properties Company Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
WO1998016585A1 (en) * 1996-10-16 1998-04-23 Kureha Kagaku Kogyo K.K. Resin composition
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
JP2001168246A (ja) * 1999-11-30 2001-06-22 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
US6500891B1 (en) 2000-05-19 2002-12-31 Loctite Corporation Low viscosity thermally conductive compositions containing spherical thermally conductive particles
US7109288B2 (en) * 2001-05-18 2006-09-19 Hitachi, Ltd. Cured thermosetting resin product
JP2002348115A (ja) * 2001-05-30 2002-12-04 Showa Denko Kk アルミナ粒子及びその製造方法
US7053018B2 (en) 2001-05-30 2006-05-30 Showa Denko K.K. Spherical alumina particles and production process thereof
JP4920141B2 (ja) * 2001-05-30 2012-04-18 昭和電工株式会社 アルミナ粒子及びその製造方法
US6887811B2 (en) 2001-05-30 2005-05-03 Showa Denko K.K. Spherical alumina particles and production process thereof
JP3807995B2 (ja) * 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
DE10260098A1 (de) * 2002-12-19 2004-07-01 Basf Ag Elektrisch isolierende und wärmeleitfähige Polyesterformmassen
KR100709548B1 (ko) * 2003-06-04 2007-04-20 쇼와 덴코 가부시키가이샤 수지 충진용 커런덤 및 수지 조성물
JP4526064B2 (ja) * 2003-06-04 2010-08-18 昭和電工株式会社 樹脂充填用コランダム及び樹脂組成物
JP4631272B2 (ja) * 2003-11-14 2011-02-16 東レ株式会社 フィラー高充填樹脂組成物およびそれから得られる成形品
WO2005066252A2 (en) * 2004-01-08 2005-07-21 Showa Denko K.K. Inorganic powder, resin composition filled with the powder and use thereof
EP1833924B1 (en) 2004-12-06 2009-08-19 Showa Denko Kabushiki Kaisha Surface modified corundum and resin composition
JP4890063B2 (ja) * 2006-03-20 2012-03-07 新日鐵化学株式会社 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
JP5089908B2 (ja) * 2006-04-06 2012-12-05 株式会社マイクロン 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物
JP2008013759A (ja) * 2006-06-07 2008-01-24 Sumitomo Chemical Co Ltd エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP5345340B2 (ja) * 2008-05-16 2013-11-20 新日鉄住金マテリアルズ株式会社 アルミナ配合粒子および樹脂成形体
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
JP5558161B2 (ja) 2010-03-29 2014-07-23 アロン化成株式会社 発熱体と、冷却部品との間のスペーサーとして使用される熱伝導性エラストマー組成物
JP6123277B2 (ja) * 2011-12-28 2017-05-10 日立化成株式会社 樹脂組成物、樹脂組成物シート及び樹脂組成物シートの製造方法、金属箔付樹脂組成物シート、ｂステージシート、半硬化の金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、ｌｅｄ光源部材、並びにパワー半導体装置
ITMI20121202A1 (it) * 2012-07-10 2014-01-11 Francesco Pio Salvatore Calabrese Formulazione per materiali compositi, materiali compositi e procedimento per la loro produzione
US10968111B2 (en) 2016-05-16 2021-04-06 Martinswerk Gmbh Alumina products and uses thereof in polymer compositions with high thermal conductivity
CN110191925A (zh) 2017-01-19 2019-08-30 国立大学法人福井大学 高导热性材料及其制造方法
WO2020206626A1 (en) 2019-04-10 2020-10-15 Henkel Ag & Co. Kgaa Thermally conductive silicone potting composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1462141A (fr) * 1965-01-05 1966-12-09 Lockheed Aircraft Corp Compositions céramo-plastiques moulables et résistant aux températures élevées

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794030B1 (en) 1999-11-30 2004-09-21 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet
US7595358B2 (en) 2003-06-04 2009-09-29 Showa Denko K.K. Corundum for filling in resin and resin composition
US20100163783A1 (en) * 2008-12-29 2010-07-01 Nan Ya Plastics Corporation High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof
US8198347B2 (en) * 2008-12-29 2012-06-12 Nan Ya Plastics Corporation High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof
EP2740765A4 (en) * 2011-08-04 2015-05-06 Hitachi Ltd EPOXY RESIN COMPOSITION FOR MOLDING AND ELECTRICAL DEVICE THEREWITH
WO2019133482A1 (en) * 2017-12-27 2019-07-04 3M Innovative Properties Company Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
CN111557128A (zh) * 2017-12-27 2020-08-18 3M创新有限公司 适用于电子器件外罩的固化环氧树脂组合物、制品和方法
CN116162325A (zh) * 2017-12-27 2023-05-26 3M创新有限公司 适用于电子器件外罩的固化环氧树脂组合物、制品和方法
US11773254B2 (en) 2017-12-27 2023-10-03 3M Innovative Properties Company Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
US12404386B2 (en) 2017-12-27 2025-09-02 3M Innovative Properties Company Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

Also Published As

Publication number Publication date
TW197458B (en:Method) 1993-01-01
JPH05132576A (ja) 1993-05-28
KR920016518A (ko) 1992-09-25
EP0499585A1 (de) 1992-08-19
KR100210184B1 (ko) 1999-07-15
DE59203064D1 (de) 1995-09-07
JP3176416B2 (ja) 2001-06-18
EP0499585B1 (de) 1995-08-02

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued