CA1238720A - Transistor devices for microwave oscillator elements - Google Patents
Transistor devices for microwave oscillator elementsInfo
- Publication number
- CA1238720A CA1238720A CA000486502A CA486502A CA1238720A CA 1238720 A CA1238720 A CA 1238720A CA 000486502 A CA000486502 A CA 000486502A CA 486502 A CA486502 A CA 486502A CA 1238720 A CA1238720 A CA 1238720A
- Authority
- CA
- Canada
- Prior art keywords
- package
- transistor
- transistor device
- chip
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59141375A JPS6122656A (ja) | 1984-07-10 | 1984-07-10 | 発振用トランジスタ素子 |
| JP141375/1984 | 1984-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1238720A true CA1238720A (en) | 1988-06-28 |
Family
ID=15290531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000486502A Expired CA1238720A (en) | 1984-07-10 | 1985-07-09 | Transistor devices for microwave oscillator elements |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4841353A (https=) |
| EP (1) | EP0174457B1 (https=) |
| JP (1) | JPS6122656A (https=) |
| AU (1) | AU570808B2 (https=) |
| CA (1) | CA1238720A (https=) |
| DE (1) | DE3570950D1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63132505A (ja) * | 1986-11-24 | 1988-06-04 | Mitsubishi Electric Corp | 半導体装置 |
| FR2608318B1 (fr) * | 1986-12-16 | 1989-06-16 | Thomson Semiconducteurs | Dispositif semi-conducteur a faible bruit en hyperfrequence, monte dans un boitier |
| GB2220113B (en) * | 1988-06-22 | 1992-02-12 | Philips Electronic Associated | Microwave oscillator devices |
| GB2223896A (en) * | 1988-10-12 | 1990-04-18 | Philips Electronic Associated | Radio receivers |
| US5126827A (en) * | 1991-01-17 | 1992-06-30 | Avantek, Inc. | Semiconductor chip header having particular surface metallization |
| FR2710192B1 (fr) * | 1991-07-29 | 1996-01-26 | Gen Electric | Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement. |
| DE4134753A1 (de) * | 1991-10-22 | 1993-04-29 | Aeg Mobile Communication | Breitbandige hochfrequenz-schaltungsanordnung |
| US5235300A (en) * | 1992-03-16 | 1993-08-10 | Trw Inc. | Millimeter module package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3969752A (en) * | 1973-12-03 | 1976-07-13 | Power Hybrids, Inc. | Hybrid transistor |
| JPS55102292A (en) * | 1979-01-29 | 1980-08-05 | Nippon Electric Co | High frequency high output transistor amplifier |
| JPS55151372A (en) * | 1979-05-16 | 1980-11-25 | Nec Corp | Ultrahigh frequency semiconductor device |
| JPS56155575A (en) * | 1980-04-30 | 1981-12-01 | Mitsubishi Electric Corp | Internal matching semiconductor element |
| JPS6035843B2 (ja) * | 1980-07-21 | 1985-08-16 | 富士通株式会社 | キヤパシタ |
| JPS57115852A (en) * | 1981-01-10 | 1982-07-19 | Mitsubishi Electric Corp | Microwave transistor mount |
| JPS58124304A (ja) * | 1982-01-20 | 1983-07-23 | Toshiba Corp | マイクロ波発振器 |
-
1984
- 1984-07-10 JP JP59141375A patent/JPS6122656A/ja active Granted
-
1985
- 1985-07-09 DE DE8585108542T patent/DE3570950D1/de not_active Expired
- 1985-07-09 CA CA000486502A patent/CA1238720A/en not_active Expired
- 1985-07-09 EP EP85108542A patent/EP0174457B1/en not_active Expired
- 1985-07-10 AU AU44750/85A patent/AU570808B2/en not_active Ceased
-
1987
- 1987-11-24 US US07/129,390 patent/US4841353A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US4841353A (en) | 1989-06-20 |
| JPH0347761B2 (https=) | 1991-07-22 |
| JPS6122656A (ja) | 1986-01-31 |
| AU4475085A (en) | 1986-01-16 |
| EP0174457A1 (en) | 1986-03-19 |
| DE3570950D1 (en) | 1989-07-13 |
| AU570808B2 (en) | 1988-03-24 |
| EP0174457B1 (en) | 1989-06-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |