DE3570950D1 - Transistor devices for microwave oscillator elements - Google Patents

Transistor devices for microwave oscillator elements

Info

Publication number
DE3570950D1
DE3570950D1 DE8585108542T DE3570950T DE3570950D1 DE 3570950 D1 DE3570950 D1 DE 3570950D1 DE 8585108542 T DE8585108542 T DE 8585108542T DE 3570950 T DE3570950 T DE 3570950T DE 3570950 D1 DE3570950 D1 DE 3570950D1
Authority
DE
Germany
Prior art keywords
transistor devices
microwave oscillator
oscillator elements
elements
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585108542T
Other languages
German (de)
English (en)
Inventor
Kenzo C O Nec Corporation Wada
Eiji C O Nec Corporatio Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3570950D1 publication Critical patent/DE3570950D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
DE8585108542T 1984-07-10 1985-07-09 Transistor devices for microwave oscillator elements Expired DE3570950D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59141375A JPS6122656A (ja) 1984-07-10 1984-07-10 発振用トランジスタ素子

Publications (1)

Publication Number Publication Date
DE3570950D1 true DE3570950D1 (en) 1989-07-13

Family

ID=15290531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585108542T Expired DE3570950D1 (en) 1984-07-10 1985-07-09 Transistor devices for microwave oscillator elements

Country Status (6)

Country Link
US (1) US4841353A (https=)
EP (1) EP0174457B1 (https=)
JP (1) JPS6122656A (https=)
AU (1) AU570808B2 (https=)
CA (1) CA1238720A (https=)
DE (1) DE3570950D1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132505A (ja) * 1986-11-24 1988-06-04 Mitsubishi Electric Corp 半導体装置
FR2608318B1 (fr) * 1986-12-16 1989-06-16 Thomson Semiconducteurs Dispositif semi-conducteur a faible bruit en hyperfrequence, monte dans un boitier
GB2220113B (en) * 1988-06-22 1992-02-12 Philips Electronic Associated Microwave oscillator devices
GB2223896A (en) * 1988-10-12 1990-04-18 Philips Electronic Associated Radio receivers
US5126827A (en) * 1991-01-17 1992-06-30 Avantek, Inc. Semiconductor chip header having particular surface metallization
FR2710192B1 (fr) * 1991-07-29 1996-01-26 Gen Electric Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement.
DE4134753A1 (de) * 1991-10-22 1993-04-29 Aeg Mobile Communication Breitbandige hochfrequenz-schaltungsanordnung
US5235300A (en) * 1992-03-16 1993-08-10 Trw Inc. Millimeter module package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969752A (en) * 1973-12-03 1976-07-13 Power Hybrids, Inc. Hybrid transistor
JPS55102292A (en) * 1979-01-29 1980-08-05 Nippon Electric Co High frequency high output transistor amplifier
JPS55151372A (en) * 1979-05-16 1980-11-25 Nec Corp Ultrahigh frequency semiconductor device
JPS56155575A (en) * 1980-04-30 1981-12-01 Mitsubishi Electric Corp Internal matching semiconductor element
JPS6035843B2 (ja) * 1980-07-21 1985-08-16 富士通株式会社 キヤパシタ
JPS57115852A (en) * 1981-01-10 1982-07-19 Mitsubishi Electric Corp Microwave transistor mount
JPS58124304A (ja) * 1982-01-20 1983-07-23 Toshiba Corp マイクロ波発振器

Also Published As

Publication number Publication date
US4841353A (en) 1989-06-20
JPH0347761B2 (https=) 1991-07-22
JPS6122656A (ja) 1986-01-31
AU4475085A (en) 1986-01-16
EP0174457A1 (en) 1986-03-19
CA1238720A (en) 1988-06-28
AU570808B2 (en) 1988-03-24
EP0174457B1 (en) 1989-06-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee