FR2710192B1 - Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement. - Google Patents

Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement.

Info

Publication number
FR2710192B1
FR2710192B1 FR9109605A FR9109605A FR2710192B1 FR 2710192 B1 FR2710192 B1 FR 2710192B1 FR 9109605 A FR9109605 A FR 9109605A FR 9109605 A FR9109605 A FR 9109605A FR 2710192 B1 FR2710192 B1 FR 2710192B1
Authority
FR
France
Prior art keywords
adjustment method
functional characteristics
microwave component
adjusted functional
adjusted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9109605A
Other languages
English (en)
Other versions
FR2710192A1 (fr
Inventor
Kornrumpf William Paul
Bates David Allen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to FR9109605A priority Critical patent/FR2710192B1/fr
Publication of FR2710192A1 publication Critical patent/FR2710192A1/fr
Application granted granted Critical
Publication of FR2710192B1 publication Critical patent/FR2710192B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR9109605A 1991-07-29 1991-07-29 Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement. Expired - Fee Related FR2710192B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9109605A FR2710192B1 (fr) 1991-07-29 1991-07-29 Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9109605A FR2710192B1 (fr) 1991-07-29 1991-07-29 Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement.

Publications (2)

Publication Number Publication Date
FR2710192A1 FR2710192A1 (fr) 1995-03-24
FR2710192B1 true FR2710192B1 (fr) 1996-01-26

Family

ID=9415670

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9109605A Expired - Fee Related FR2710192B1 (fr) 1991-07-29 1991-07-29 Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement.

Country Status (1)

Country Link
FR (1) FR2710192B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI19992361A (fi) * 1999-11-01 2001-05-02 Nokia Mobile Phones Ltd Integroitujen piirien valmistusmenetelmä
FR2806529B1 (fr) * 2000-03-14 2005-03-04 St Microelectronics Sa Procede d'ajustage d'un parametre electrique sur un composant electronique integre

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2507017A1 (fr) * 1981-05-27 1982-12-03 Radiotechnique Compelec Microassemblage utilisable en hyperfrequences
EP0070104A3 (fr) * 1981-07-10 1985-05-15 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Eléments adapteur de circuits
FR2550011B1 (fr) * 1983-07-29 1986-10-10 Thomson Csf Dispositif d'interconnexion entre les cellules d'un circuit integre hyperfrequences pre-implante
JPS6122656A (ja) * 1984-07-10 1986-01-31 Nec Corp 発振用トランジスタ素子
JPS63275224A (ja) * 1987-05-06 1988-11-11 Nec Corp 超高周波分周器用移相器
DE3934224A1 (de) * 1989-07-04 1991-01-10 Licentia Gmbh Anordnung zur mikrowellen-integration

Also Published As

Publication number Publication date
FR2710192A1 (fr) 1995-03-24

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Legal Events

Date Code Title Description
ST Notification of lapse
ST Notification of lapse