EP0070104A3 - Eléments adapteur de circuits - Google Patents
Eléments adapteur de circuits Download PDFInfo
- Publication number
- EP0070104A3 EP0070104A3 EP82303126A EP82303126A EP0070104A3 EP 0070104 A3 EP0070104 A3 EP 0070104A3 EP 82303126 A EP82303126 A EP 82303126A EP 82303126 A EP82303126 A EP 82303126A EP 0070104 A3 EP0070104 A3 EP 0070104A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- line
- elements
- integrated circuits
- conducting line
- circuit matching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004642 Polyimide Substances 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/13—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body combined with thin-film or thick-film passive components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8121409 | 1981-07-10 | ||
GB8121409 | 1981-07-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0070104A2 EP0070104A2 (fr) | 1983-01-19 |
EP0070104A3 true EP0070104A3 (fr) | 1985-05-15 |
Family
ID=10523173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP82303126A Withdrawn EP0070104A3 (fr) | 1981-07-10 | 1982-06-16 | Eléments adapteur de circuits |
Country Status (3)
Country | Link |
---|---|
US (1) | US4460880A (fr) |
EP (1) | EP0070104A3 (fr) |
JP (1) | JPS5821901A (fr) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3280017D1 (en) * | 1981-08-14 | 1989-12-14 | Texas Instruments Inc | Varactor trimming for mmics |
FR2550011B1 (fr) * | 1983-07-29 | 1986-10-10 | Thomson Csf | Dispositif d'interconnexion entre les cellules d'un circuit integre hyperfrequences pre-implante |
KR900001273B1 (ko) * | 1983-12-23 | 1990-03-05 | 후지쑤 가부시끼가이샤 | 반도체 집적회로 장치 |
US4543544A (en) * | 1984-01-04 | 1985-09-24 | Motorola, Inc. | LCC co-planar lead frame semiconductor IC package |
US4600907A (en) * | 1985-03-07 | 1986-07-15 | Tektronix, Inc. | Coplanar microstrap waveguide interconnector and method of interconnection |
US5256996A (en) * | 1987-10-06 | 1993-10-26 | The Board Of Trustees Of The Leland Stanford, Junior University | Integrated coplanar strip nonlinear transmission line |
US5378939A (en) * | 1987-10-06 | 1995-01-03 | The Board Of Trustees Of The Leland Stanford Junior University | Gallium arsenide monolithically integrated sampling head using equivalent time sampling having a bandwidth greater than 100 Ghz |
US5352994A (en) * | 1987-10-06 | 1994-10-04 | The Board Of Trustees Of The Leland Stanford Junior University | Gallium arsenide monolithically integrated nonlinear transmission line impedance transformer |
US5267020A (en) * | 1987-10-06 | 1993-11-30 | Stanford University | Gallium arsenide monolithically integrated sampling head using equivalent time sampling having a bandwidth greater than 100 ghz |
US4891686A (en) * | 1988-04-08 | 1990-01-02 | Directed Energy, Inc. | Semiconductor packaging with ground plane conductor arrangement |
JPH0376402A (ja) * | 1989-08-18 | 1991-04-02 | Fujitsu Ltd | マイクロストリップ線路装置 |
US5157361A (en) * | 1991-05-10 | 1992-10-20 | Gruchalla Michael E | Nonlinear transmission line |
WO1993002485A1 (fr) * | 1991-07-19 | 1993-02-04 | Fujitsu Limited | Ligne microruban et procede de fabrication |
FR2710192B1 (fr) * | 1991-07-29 | 1996-01-26 | Gen Electric | Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement. |
US5150436A (en) * | 1991-09-06 | 1992-09-22 | The University Of British Columbia | Slow-wave electrode structure |
US5559359A (en) * | 1994-07-29 | 1996-09-24 | Reyes; Adolfo C. | Microwave integrated circuit passive element structure and method for reducing signal propagation losses |
US5777528A (en) * | 1995-05-26 | 1998-07-07 | Motorola, Inc. | Mode suppressing coplanar waveguide transition and method |
US5777531A (en) * | 1996-06-26 | 1998-07-07 | Texas Instruments Incorporated | Semiconductor coplanar waveguide phase shifter |
US5777532A (en) * | 1997-01-15 | 1998-07-07 | Tfr Technologies, Inc. | Interdigital slow wave coplanar transmission line |
US6000120A (en) * | 1998-04-16 | 1999-12-14 | Motorola, Inc. | Method of making coaxial transmission lines on a printed circuit board |
US7348666B2 (en) * | 2004-06-30 | 2008-03-25 | Endwave Corporation | Chip-to-chip trench circuit structure |
US7411279B2 (en) * | 2004-06-30 | 2008-08-12 | Endwave Corporation | Component interconnect with substrate shielding |
WO2006028669A1 (fr) * | 2004-08-17 | 2006-03-16 | Wei David T | Utilisation d'un detecteur de plasmon integre pour mesurer la rugosite d'un depot metallique sur une surface semi-conductrice |
US8575731B2 (en) * | 2008-06-17 | 2013-11-05 | Panasonic Corporation | Semiconductor device with a balun |
JP5397626B2 (ja) * | 2010-03-12 | 2014-01-22 | オムロン株式会社 | 信号線路の構造、信号線路の製造方法及び当該信号線路を用いたスイッチ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3769618A (en) * | 1971-12-27 | 1973-10-30 | Freedman J | Thin film low temperature conductors and transmission lines |
US4090155A (en) * | 1975-05-12 | 1978-05-16 | Agency Of Industrial Science & Technology | Transmission line for electromagnetic wave |
US4092664A (en) * | 1976-02-17 | 1978-05-30 | Hughes Aircraft Company | Carrier for mounting a semiconductor chip |
IT1125389B (it) * | 1979-06-28 | 1986-05-14 | Cise Spa | Struttura periodica di trasmissione di segnali ad onda lenta per elementi circuitali monolitici miniaturizzati operanti a frequenza di microonde |
-
1982
- 1982-06-16 EP EP82303126A patent/EP0070104A3/fr not_active Withdrawn
- 1982-07-06 US US06/395,312 patent/US4460880A/en not_active Expired - Fee Related
- 1982-07-08 JP JP57119153A patent/JPS5821901A/ja active Pending
Non-Patent Citations (1)
Title |
---|
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, Vol. MTT-29, no. 6, June 1981, NEW YORK (US); R.A. PUCEL: "Design considerations for monolithic microwave circuits", pages 513-534 * |
Also Published As
Publication number | Publication date |
---|---|
US4460880A (en) | 1984-07-17 |
JPS5821901A (ja) | 1983-02-09 |
EP0070104A2 (fr) | 1983-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Designated state(s): DE FR GB IT |
|
17P | Request for examination filed |
Effective date: 19830614 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Designated state(s): DE FR GB IT |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Withdrawal date: 19860627 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: TURNER, BRIAN |