CA1175158A - Planar thin film transistors, transistor arrays, and a method of making the same - Google Patents
Planar thin film transistors, transistor arrays, and a method of making the sameInfo
- Publication number
- CA1175158A CA1175158A CA000375559A CA375559A CA1175158A CA 1175158 A CA1175158 A CA 1175158A CA 000375559 A CA000375559 A CA 000375559A CA 375559 A CA375559 A CA 375559A CA 1175158 A CA1175158 A CA 1175158A
- Authority
- CA
- Canada
- Prior art keywords
- layer
- source
- substrate
- depositing
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000003491 array Methods 0.000 title description 5
- 239000011810 insulating material Substances 0.000 claims abstract description 69
- 238000000151 deposition Methods 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000000463 material Substances 0.000 claims description 81
- 239000000758 substrate Substances 0.000 claims description 74
- 229920002120 photoresistant polymer Polymers 0.000 claims description 56
- 239000004065 semiconductor Substances 0.000 claims description 42
- 230000008569 process Effects 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 17
- 230000005669 field effect Effects 0.000 claims description 11
- 238000004090 dissolution Methods 0.000 claims description 4
- 239000007772 electrode material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims 164
- 230000000694 effects Effects 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RWNKSTSCBHKHTB-UHFFFAOYSA-N Hexachloro-1,3-butadiene Chemical compound ClC(Cl)=C(Cl)C(Cl)=C(Cl)Cl RWNKSTSCBHKHTB-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- 241001207849 Canis anthus Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DUBSDGFVYOMMLR-UHFFFAOYSA-N [Cr].[In].[Au] Chemical compound [Cr].[In].[Au] DUBSDGFVYOMMLR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000005362 aryl sulfone group Chemical group 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US155,335 | 1980-06-02 | ||
| US06/155,335 US4389481A (en) | 1980-06-02 | 1980-06-02 | Method of making planar thin film transistors, transistor arrays |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1175158A true CA1175158A (en) | 1984-09-25 |
Family
ID=22555022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000375559A Expired CA1175158A (en) | 1980-06-02 | 1981-04-15 | Planar thin film transistors, transistor arrays, and a method of making the same |
Country Status (5)
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57176746A (en) * | 1981-04-21 | 1982-10-30 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit and manufacture thereof |
| FR2518810A1 (fr) * | 1981-12-23 | 1983-06-24 | Morin Francois | Procede de fabrication de transistors en couches minces en silicium sur substrat isolant |
| JPS58169977A (ja) * | 1982-03-30 | 1983-10-06 | Canon Inc | 薄膜トランジスタの製造方法 |
| US4497683A (en) * | 1982-05-03 | 1985-02-05 | At&T Bell Laboratories | Process for producing dielectrically isolated silicon devices |
| US4461071A (en) * | 1982-08-23 | 1984-07-24 | Xerox Corporation | Photolithographic process for fabricating thin film transistors |
| US5111260A (en) * | 1983-06-17 | 1992-05-05 | Texax Instruments Incorporated | Polysilicon FETs |
| JPS6042855A (ja) * | 1983-08-19 | 1985-03-07 | Hitachi Ltd | 半導体装置 |
| JPS60103677A (ja) * | 1983-11-11 | 1985-06-07 | Seiko Instr & Electronics Ltd | 薄膜トランジスタの製造方法 |
| US4654295A (en) * | 1983-12-05 | 1987-03-31 | Energy Conversion Devices, Inc. | Method of making short channel thin film field effect transistor |
| JPS60160173A (ja) * | 1984-01-30 | 1985-08-21 | Sharp Corp | 薄膜トランジスタ |
| JPS6146975A (ja) * | 1984-08-13 | 1986-03-07 | 日本電信電話株式会社 | アクテイブマトリツクス基板およびその製造方法 |
| JPS6184065A (ja) * | 1984-10-01 | 1986-04-28 | Oki Electric Ind Co Ltd | 薄膜トランジスタの製造方法 |
| JPS6184066A (ja) * | 1984-10-01 | 1986-04-28 | Oki Electric Ind Co Ltd | 薄膜トランジスタの製造方法 |
| JPS61181165A (ja) * | 1985-02-07 | 1986-08-13 | Yokogawa Electric Corp | 半導体装置 |
| JPS6281065A (ja) * | 1985-10-04 | 1987-04-14 | Hosiden Electronics Co Ltd | 薄膜トランジスタ |
| JPS6292472A (ja) * | 1985-10-18 | 1987-04-27 | Sanyo Electric Co Ltd | 薄膜トランジスタの製造方法 |
| JPS62216372A (ja) * | 1986-03-18 | 1987-09-22 | Fujitsu Ltd | ａ−Ｓｉ薄膜トランジスタ |
| US4918504A (en) * | 1987-07-31 | 1990-04-17 | Nippon Telegraph And Telephone Corporation | Active matrix cell |
| GB8729652D0 (en) * | 1987-12-19 | 1988-02-03 | Plessey Co Plc | Semi-conductive devices fabricated on soi wafers |
| JP2751237B2 (ja) * | 1988-09-07 | 1998-05-18 | ソニー株式会社 | 集積回路装置及び集積回路装置の製造方法 |
| FR2638880B1 (fr) * | 1988-11-08 | 1990-12-14 | France Etat | Procede de fabrication d'un ecran d'affichage a matrice de transistors pourvus d'un masque optique |
| US5770892A (en) * | 1989-01-18 | 1998-06-23 | Sgs-Thomson Microelectronics, Inc. | Field effect device with polycrystalline silicon channel |
| US5801396A (en) * | 1989-01-18 | 1998-09-01 | Stmicroelectronics, Inc. | Inverted field-effect device with polycrystalline silicon/germanium channel |
| JP2508851B2 (ja) * | 1989-08-23 | 1996-06-19 | 日本電気株式会社 | 液晶表示素子用アクティブマトリクス基板とその製造方法 |
| FR2651371B1 (fr) * | 1989-08-29 | 1991-10-18 | France Etat | Procede de realisation d'un ecran d'affichage a matrice active et a structure inversee. |
| JPH0734467B2 (ja) * | 1989-11-16 | 1995-04-12 | 富士ゼロックス株式会社 | イメージセンサ製造方法 |
| JPH04171767A (ja) * | 1990-11-02 | 1992-06-18 | Sharp Corp | 薄膜トランジスタ及びその製造方法 |
| JPH06163585A (ja) * | 1992-11-18 | 1994-06-10 | Nippon Sheet Glass Co Ltd | 薄膜トランジスタアレイの製造方法 |
| KR100305877B1 (ko) * | 1993-08-19 | 2001-12-15 | 김영환 | 반도체박막트랜지스터(tft)제조방법 |
| US5366911A (en) * | 1994-05-11 | 1994-11-22 | United Microelectronics Corporation | VLSI process with global planarization |
| US6140684A (en) * | 1997-06-24 | 2000-10-31 | Stmicroelectronic, Inc. | SRAM cell structure with dielectric sidewall spacers and drain and channel regions defined along sidewall spacers |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| US6072223A (en) * | 1998-09-02 | 2000-06-06 | Micron Technology, Inc. | Circuit and method for a memory cell using reverse base current effect |
| US7474002B2 (en) * | 2001-10-30 | 2009-01-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having dielectric film having aperture portion |
| US6879038B2 (en) * | 2003-03-12 | 2005-04-12 | Optical Communication Products, Inc. | Method and apparatus for hermetic sealing of assembled die |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US20070178710A1 (en) * | 2003-08-18 | 2007-08-02 | 3M Innovative Properties Company | Method for sealing thin film transistors |
| US8742421B2 (en) * | 2003-12-02 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same, and television apparatus |
| JP4569207B2 (ja) * | 2004-07-28 | 2010-10-27 | ソニー株式会社 | 電界効果型トランジスタの製造方法 |
| KR100647695B1 (ko) * | 2005-05-27 | 2006-11-23 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 및 그의 제조방법과 이를 구비한평판표시장치 |
| US9645457B2 (en) * | 2006-11-22 | 2017-05-09 | Mitsubishi Electric Corporation | Array substrate, display device, and method for manufacturing the array substrate |
| US8765252B2 (en) * | 2007-11-30 | 2014-07-01 | Hewlett-Packard Development Company, L.P. | Thin film device with minimized spatial variation of local mean height |
| JP5567886B2 (ja) * | 2010-04-09 | 2014-08-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3669661A (en) * | 1970-03-06 | 1972-06-13 | Westinghouse Electric Corp | Method of producing thin film transistors |
| US4055885A (en) * | 1973-02-28 | 1977-11-01 | Hitachi, Ltd. | Charge transfer semiconductor device with electrodes separated by oxide region therebetween and method for fabricating the same |
| JPS52404B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-05-10 | 1977-01-07 | ||
| US4040854A (en) * | 1975-02-27 | 1977-08-09 | Calgon Corporation | Methods of using cementing compositions having improved flow properties, containing phosphonobutane tricarboxylic acid |
| US4040073A (en) * | 1975-08-29 | 1977-08-02 | Westinghouse Electric Corporation | Thin film transistor and display panel using the transistor |
| US4042854A (en) * | 1975-11-21 | 1977-08-16 | Westinghouse Electric Corporation | Flat panel display device with integral thin film transistor control system |
| US4035276A (en) * | 1976-04-29 | 1977-07-12 | Ibm Corporation | Making coplanar layers of thin films |
| JPS54141581A (en) * | 1978-04-26 | 1979-11-02 | Matsushita Electric Ind Co Ltd | Thin film transistor |
| JPS5568665A (en) * | 1978-11-17 | 1980-05-23 | Hitachi Ltd | Method of fabricating semiconductor device |
| US4181755A (en) * | 1978-11-21 | 1980-01-01 | Rca Corporation | Thin film pattern generation by an inverse self-lifting technique |
-
1980
- 1980-06-02 US US06/155,335 patent/US4389481A/en not_active Expired - Lifetime
-
1981
- 1981-04-15 CA CA000375559A patent/CA1175158A/en not_active Expired
- 1981-05-06 DE DE19813117950 patent/DE3117950A1/de active Granted
- 1981-05-26 JP JP7879281A patent/JPS5721867A/ja active Granted
- 1981-06-02 GB GB8116849A patent/GB2077039B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2077039A (en) | 1981-12-09 |
| JPH0568855B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-29 |
| DE3117950C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-01 |
| DE3117950A1 (de) | 1982-01-28 |
| US4389481A (en) | 1983-06-21 |
| GB2077039B (en) | 1984-10-31 |
| JPS5721867A (en) | 1982-02-04 |
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