BR9801843A - Dispositivo eletrónico - Google Patents

Dispositivo eletrónico

Info

Publication number
BR9801843A
BR9801843A BR9801843-4A BR9801843A BR9801843A BR 9801843 A BR9801843 A BR 9801843A BR 9801843 A BR9801843 A BR 9801843A BR 9801843 A BR9801843 A BR 9801843A
Authority
BR
Brazil
Prior art keywords
heating tube
heat
plug
chassis
electronic device
Prior art date
Application number
BR9801843-4A
Other languages
English (en)
Inventor
Takashi Oyamada
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of BR9801843A publication Critical patent/BR9801843A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

"DISPOSITIVO ELETRÈNICO", compreendendo uma estrutura de queda de calor para o dito dispositivo eletrónico, do tipo que tem um chassi e uma unidade de plugagem que provê eficiente dissipação de calor para um componente gerador de calor em uma placa de circuito impresso na unidade. Em uma configuração preferida, um primeiro tubo de aquecimento é firmemente preso a uma placa dissipadora de calor para o componente gerador de calor. Na extremidade oposta, o primeiro tubo de aquecimento é preso por um plugue conector preso à unidade. Em uma extremidade, um segundo tubo de aquecimento é preso por uma sede recebedora de plugue que é firmemente presa a um painel traseiro do chassi. Na extremidade oposta, o segundo tubo de aquecimento é firmemente preso à porção dissipadora de calor no chassi. O primeiro tubo de aquecimento, o plugue, a sede recebedora de plugue e o segundo tubo de aquecimento transferem calor do componente gerador de calor para a porção dissipadora de calor.
BR9801843-4A 1997-03-27 1998-03-26 Dispositivo eletrónico BR9801843A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9075227A JP2874684B2 (ja) 1997-03-27 1997-03-27 プラグインユニットの放熱構造

Publications (1)

Publication Number Publication Date
BR9801843A true BR9801843A (pt) 1999-10-19

Family

ID=13570139

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9801843-4A BR9801843A (pt) 1997-03-27 1998-03-26 Dispositivo eletrónico

Country Status (4)

Country Link
US (1) US5946191A (pt)
JP (1) JP2874684B2 (pt)
CN (1) CN1101643C (pt)
BR (1) BR9801843A (pt)

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US6229704B1 (en) * 1999-10-19 2001-05-08 Dell Usa, L.P. Thermal connection system for modular computer system components
US6657859B1 (en) * 2000-06-30 2003-12-02 Intel Corporation Device bay heat exchanger for a portable computing device
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US6564859B2 (en) * 2001-06-27 2003-05-20 Intel Corporation Efficient heat pumping from mobile platforms using on platform assembled heat pipe
TW510532U (en) * 2001-07-25 2002-11-11 Wen-Chen Wei Flexible heat tube structure
US6674643B2 (en) 2001-08-09 2004-01-06 International Business Machines Corporation Thermal connector for transferring heat between removable printed circuit boards
US6828675B2 (en) 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
FR2840151B1 (fr) * 2002-05-27 2006-09-01 Valeo Vision Dispositif support de diode electroluminescente pour systeme de signalisation automobile, et procede de fabrication d'un tel dispositif
CA2523040C (en) * 2003-05-23 2012-01-17 Bio-Rad Laboratories, Inc. Localized temperature control for spatial arrays of reaction media
JP4311538B2 (ja) * 2003-06-27 2009-08-12 株式会社日立製作所 ディスク記憶装置の冷却構造
JP4371210B2 (ja) 2003-12-05 2009-11-25 日本電気株式会社 電子ユニットおよびその放熱構造
US7457118B1 (en) * 2003-12-19 2008-11-25 Emc Corporation Method and apparatus for dispersing heat from high-power electronic devices
US6973801B1 (en) * 2004-12-09 2005-12-13 International Business Machines Corporation Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
JP2006215882A (ja) * 2005-02-04 2006-08-17 Hitachi Ltd ディスクアレイ装置及びその液冷装置
TWI265775B (en) 2005-04-15 2006-11-01 High Tech Comp Corp Portable electronic device and heat dissipation method and cradle thereof
CN100461993C (zh) * 2005-04-26 2009-02-11 宏达国际电子股份有限公司 可携式电子装置及其散热方法以及充电座
JP2007088282A (ja) * 2005-09-22 2007-04-05 Mitsubishi Electric Corp 周辺機器及び電子機器
US7539020B2 (en) * 2006-02-16 2009-05-26 Cooligy Inc. Liquid cooling loops for server applications
US7369412B2 (en) * 2006-05-02 2008-05-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
DE202006007275U1 (de) * 2006-05-06 2006-09-07 Schroff Gmbh Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen
US7701714B2 (en) * 2006-05-26 2010-04-20 Flextronics Ap, Llc Liquid-air hybrid cooling in electronics equipment
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components
DE502007001183D1 (de) * 2007-01-23 2009-09-10 Schroff Gmbh Schaltschrank zur Aufnahme elektronischer Steckbaugruppen mit einem Wärmetauscher
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
FR2920946B1 (fr) * 2007-09-11 2014-03-28 Thales Sa Dispositif permettant d'evacuer la chaleur produite par des composants fixes sur des cartes enfichables disposees dans un boitier
JP4859823B2 (ja) * 2007-12-14 2012-01-25 株式会社日立製作所 冷却装置およびそれを用いた電子機器
JP4812138B2 (ja) * 2008-09-24 2011-11-09 株式会社日立製作所 冷却装置及びそれを備えた電子機器
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US7957149B2 (en) * 2009-08-19 2011-06-07 International Business Machines Corporation Top actuated, force limiting heatsink retention system
US20110085296A1 (en) * 2009-10-14 2011-04-14 Brandon Rubenstein Cooling System For A Computer Blade
JP2013509638A (ja) * 2009-10-30 2013-03-14 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． ブレード・エンクロージャ用の熱バスバー
US8957316B2 (en) 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
TWI419641B (zh) * 2010-10-29 2013-12-11 Ind Tech Res Inst 電子裝置之散熱結構
US20120279683A1 (en) * 2011-05-05 2012-11-08 Alcatel-Lucent Usa Inc. Cooling apparatus for communications platforms
US8542489B2 (en) * 2011-05-05 2013-09-24 Alcatel Lucent Mechanically-reattachable liquid-cooled cooling apparatus
US9185828B2 (en) * 2011-11-17 2015-11-10 Cray Inc. Rack mounted electronics having connectors with heat cooling fingers
US20130294025A1 (en) * 2012-05-07 2013-11-07 Niall Thomas Davidson Expansion Circuit Board Cooling
US20130291368A1 (en) * 2012-05-07 2013-11-07 Niall Thomas Davidson Cooled Part for Expansion Circuit Board Cooling
US9268376B2 (en) * 2013-01-09 2016-02-23 Google Technology Holdings LLC Mobile computing device dock station with headset jack heat pipe interface
US9706675B2 (en) * 2014-09-02 2017-07-11 Dell Products L.P. Systems and methods for insertion of an information handling resource in an information handling system
US9706688B2 (en) * 2014-09-02 2017-07-11 Dell Products L.P. Systems and methods for heat management of an information handling resource in an information handling system
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
CN105101753B (zh) * 2015-08-12 2017-08-29 东莞市努谢尔环境设备科技有限公司 一种铝型材及其回路热管系统和电气散热背板
CN106028745B (zh) * 2016-06-16 2019-04-30 北京纳源丰科技发展有限公司 一种基于二级热管的服务器机柜的散热结构
JP2018006642A (ja) 2016-07-06 2018-01-11 富士通株式会社 電子機器
CN207098137U (zh) * 2017-07-14 2018-03-13 番禺得意精密电子工业有限公司 连接器组合
JP6611203B2 (ja) * 2017-10-20 2019-11-27 Ｎｅｃプラットフォームズ株式会社 モジュール、サーバ
CN108509001B (zh) * 2018-04-02 2021-01-15 联想(北京)有限公司 电子设备及其水冷服务器

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JPS6370447A (ja) * 1986-09-11 1988-03-30 Fujitsu Ltd ヒ−トパイプを用いた放熱構造
JPH0258399A (ja) * 1988-08-24 1990-02-27 Fujitsu Ltd 放熱実装構造
JPH0279093A (ja) * 1988-09-16 1990-03-19 Hitachi Ltd ディスプレイ装置
JPH02155296A (ja) * 1988-12-07 1990-06-14 Fujitsu Ltd 発熱装置の高放熱構造
JP2825402B2 (ja) * 1992-08-10 1998-11-18 三菱プレシジョン株式会社 模様発生におけるアンチ・エリアシングの方法
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
US5365749A (en) * 1993-12-23 1994-11-22 Ncr Corporation Computer component cooling system with local evaporation of refrigerant
US5646822A (en) * 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device

Also Published As

Publication number Publication date
JP2874684B2 (ja) 1999-03-24
JPH10270884A (ja) 1998-10-09
CN1101643C (zh) 2003-02-12
US5946191A (en) 1999-08-31
CN1195264A (zh) 1998-10-07

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Legal Events

Date Code Title Description
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements