ES2047768T3 - Dispositivo de disipacion termica para componente de tipo cms montado sobre placa de circuito impreso. - Google Patents

Dispositivo de disipacion termica para componente de tipo cms montado sobre placa de circuito impreso.

Info

Publication number
ES2047768T3
ES2047768T3 ES90113132T ES90113132T ES2047768T3 ES 2047768 T3 ES2047768 T3 ES 2047768T3 ES 90113132 T ES90113132 T ES 90113132T ES 90113132 T ES90113132 T ES 90113132T ES 2047768 T3 ES2047768 T3 ES 2047768T3
Authority
ES
Spain
Prior art keywords
circuit board
printed circuit
dissipation device
component mounted
type component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90113132T
Other languages
English (en)
Inventor
Claude Malaurie
Joel Bertet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALE International SAS
Original Assignee
Alcatel Business Systemes SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Business Systemes SA filed Critical Alcatel Business Systemes SA
Application granted granted Critical
Publication of ES2047768T3 publication Critical patent/ES2047768T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

DISPOSITIVO DE DISIPACION TERMICA PARA COMPONENTE DE TIPO CMS (1) MONTADO EN UNA PLACA DE CIRCUITO IMPRESO (2). ESTA CONSTITUIDO POR UNA PLACA METALICA (15) SITUADA EN EL REVERSO (12) DEL SUBSTRATO, DEBAJO DEL COMPONENTE CMS (1), Y POR UN DISPOSITIVO DE ACOPLAMIENTO TERMICO CONSTITUIDO POR UNA PEQUEÑA PLACA COLECTORA (16) SITUADA EN EL ANVERSO DEL SUBSTRATO (2) Y POR EL ESPESOR DEL SUBSTRATO (2). ESTA PLACA METALICA (16) JUEGA IGUALMENTE UN PAPEL DE BLINDAJE ELECTROMAGNETICO, Y ESTA CONSTITUIDA PREFERENTEMENTE BIEN POR LA PLACA DE BLINDAJE NORMALMENTE PREVISTA A ESTE EFECTO, BIEN POR UNA PROLONGACION (17) DE ESTA ULTIMA.
ES90113132T 1989-07-10 1990-07-10 Dispositivo de disipacion termica para componente de tipo cms montado sobre placa de circuito impreso. Expired - Lifetime ES2047768T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8909246A FR2649578B1 (fr) 1989-07-10 1989-07-10 Dispositif de dissipation thermique pour composant de type cms monte sur plaque de circuit imprime

Publications (1)

Publication Number Publication Date
ES2047768T3 true ES2047768T3 (es) 1994-03-01

Family

ID=9383631

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90113132T Expired - Lifetime ES2047768T3 (es) 1989-07-10 1990-07-10 Dispositivo de disipacion termica para componente de tipo cms montado sobre placa de circuito impreso.

Country Status (7)

Country Link
US (1) US5050038A (es)
EP (1) EP0407957B1 (es)
AT (1) ATE99105T1 (es)
AU (1) AU632593B2 (es)
DE (1) DE69005382T2 (es)
ES (1) ES2047768T3 (es)
FR (1) FR2649578B1 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2668847B1 (fr) * 1990-11-07 1994-06-03 Alcatel Espace Methode de protection de composants electroniques d'un circuit contre les radiations et dispositif utilisant cette methode.
US5459348A (en) * 1991-05-24 1995-10-17 Astec International, Ltd. Heat sink and electromagnetic interference shield assembly
DE4222838C2 (de) * 1991-09-21 2002-03-28 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
JPH06252285A (ja) * 1993-02-24 1994-09-09 Fuji Xerox Co Ltd 回路基板
DE9413819U1 (de) * 1994-08-26 1994-11-03 Blaupunkt-Werke Gmbh, 31139 Hildesheim Durchkontaktierungen aufweisende Leiterplatte
EP0741395A1 (en) 1995-05-04 1996-11-06 AT&T IPM Corp. Post-mountable planar magnetic device and method of manufacture thereof
EP0741396A1 (en) * 1995-05-04 1996-11-06 AT&T IPM Corp. Power magnetic device employing a leadless connection to a printed circuit board and method of manufacture thereof
US5707893A (en) * 1995-12-01 1998-01-13 International Business Machines Corporation Method of making a circuitized substrate using two different metallization processes
US5981880A (en) * 1996-08-20 1999-11-09 International Business Machines Corporation Electronic device packages having glass free non conductive layers
US5792677A (en) * 1997-01-16 1998-08-11 Ford Motor Company Embedded metal planes for thermal management
US5817987A (en) * 1997-03-18 1998-10-06 Power Trends, Inc. Circuit board housing with molded in heat tab
US6583987B2 (en) * 1999-02-26 2003-06-24 Intel Corporation Electromagnetic interference and heatsinking
AT413171B (de) * 2002-12-16 2005-11-15 Siemens Ag Oesterreich Halbleiter-bauelement mit einer kühlplatte
US20050057907A1 (en) * 2003-09-12 2005-03-17 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7345891B2 (en) 2003-10-07 2008-03-18 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7061126B2 (en) * 2003-10-07 2006-06-13 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7056144B2 (en) 2004-02-19 2006-06-06 Hewlett-Packard Development Company, L.P. Offset compensation system
DE102004049154A1 (de) * 2004-09-30 2006-04-06 Robert Bosch Gmbh Elektrisches Gerät, insbesondere Steuergerät
US7233497B2 (en) * 2004-10-06 2007-06-19 Hewlett-Packard Development Company, L.P. Surface mount heat sink
US7742310B2 (en) * 2006-09-29 2010-06-22 Hewlett-Packard Development Company, L.P. Sequencer
US7397666B2 (en) * 2006-10-25 2008-07-08 Hewlett-Packard Development Company, L.P. Wedge lock
US8383946B2 (en) * 2010-05-18 2013-02-26 Joinset, Co., Ltd. Heat sink
US9125299B2 (en) * 2012-12-06 2015-09-01 Apple Inc. Cooling for electronic components
US9223167B2 (en) 2013-06-26 2015-12-29 Apple Inc. Liquid crystal switching barrier thermal control
US9389029B2 (en) 2013-09-30 2016-07-12 Apple Inc. Heat transfer structure
US9674986B2 (en) 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
AT518872B1 (de) * 2016-07-06 2018-02-15 Zkw Group Gmbh Bestückung von thermisch hochleistungsfähigen Bauteilen zu Wärmespreizung
DE102018217607A1 (de) 2018-10-15 2020-04-16 Continental Automotive Gmbh Halbleiterbauelement-Anordnung, Verfahren zu deren Herstellung sowie Entwärmungseinrichtung
JP7301600B2 (ja) * 2019-05-23 2023-07-03 キヤノン株式会社 電源装置及び画像形成装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4254447A (en) * 1979-04-10 1981-03-03 Rca Corporation Integrated circuit heat dissipator
DE3128856A1 (de) * 1981-07-22 1983-02-10 Oelsch KG, 1000 Berlin Vorrichtung zum befestigen elektronischer bauteile auf einer leiterplatte
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
FR2620587B1 (fr) * 1987-09-16 1993-07-02 Telemecanique Electrique Circuit imprime equipe d'un drain thermique

Also Published As

Publication number Publication date
EP0407957A1 (fr) 1991-01-16
AU632593B2 (en) 1993-01-07
EP0407957B1 (fr) 1993-12-22
FR2649578A1 (fr) 1991-01-11
ATE99105T1 (de) 1994-01-15
AU5860490A (en) 1991-01-10
DE69005382T2 (de) 1994-04-14
US5050038A (en) 1991-09-17
FR2649578B1 (fr) 1991-09-20
DE69005382D1 (de) 1994-02-03

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