BR0204606A - Conectividade de baixa impedância/alta densidade para componentes de montagem em superfìcie sobre uma placa de fiação impressa - Google Patents
Conectividade de baixa impedância/alta densidade para componentes de montagem em superfìcie sobre uma placa de fiação impressaInfo
- Publication number
- BR0204606A BR0204606A BR0204606-7A BR0204606A BR0204606A BR 0204606 A BR0204606 A BR 0204606A BR 0204606 A BR0204606 A BR 0204606A BR 0204606 A BR0204606 A BR 0204606A
- Authority
- BR
- Brazil
- Prior art keywords
- wiring board
- printed wiring
- high density
- low impedance
- surface mount
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
"CONECTIVIDADE DE BAIXA IMPEDâNCIA/ALTA DENSIDADE PARA COMPONENTES DE MONTAGEM EM SUPERFìCIE SOBRE UMA PLACA DE FIAçãO IMPRESSA". Um componente montado em superfície e uma via partilham a mesma almofada sobre a superfície de uma placa de fiação impressa de múltiplas camadas para aumentar a densidade de componentes montados em superfície sobre a superfície e para reduzir a impedância entre o componente montado em superfície e a via.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/000,902 US20030089522A1 (en) | 2001-11-15 | 2001-11-15 | Low impedance / high density connectivity of surface mount components on a printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0204606A true BR0204606A (pt) | 2003-09-16 |
Family
ID=21693502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0204606-7A BR0204606A (pt) | 2001-11-15 | 2002-11-04 | Conectividade de baixa impedância/alta densidade para componentes de montagem em superfìcie sobre uma placa de fiação impressa |
Country Status (4)
Country | Link |
---|---|
US (1) | US20030089522A1 (pt) |
EP (1) | EP1313356A1 (pt) |
JP (1) | JP2003188509A (pt) |
BR (1) | BR0204606A (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI245378B (en) * | 2003-11-05 | 2005-12-11 | Advanced Semiconductor Eng | Substrate for use in forming electronic package |
US7564694B2 (en) * | 2005-12-21 | 2009-07-21 | Intel Corporation | Apparatus and method for impedance matching in a backplane signal channel |
US7292450B2 (en) * | 2006-01-31 | 2007-11-06 | Microsoft Corporation | High density surface mount part array layout and assembly technique |
US7851709B2 (en) * | 2006-03-22 | 2010-12-14 | Advanced Semiconductor Engineering, Inc. | Multi-layer circuit board having ground shielding walls |
KR100828174B1 (ko) * | 2006-08-03 | 2008-05-08 | 주식회사 이츠웰 | 표면 실장형 발광 다이오드 램프 및 그 제조 방법 |
US7724193B2 (en) * | 2007-07-24 | 2010-05-25 | Sony Ericsson Mobile Communications Ab | Printed circuit boards with a multi-plane antenna and methods for configuring the same |
US8198538B2 (en) * | 2008-02-29 | 2012-06-12 | Industrial Technology Research Institute | Capacitor devices having multi-sectional conductors |
US8399969B2 (en) * | 2010-07-27 | 2013-03-19 | Visera Technologies Company Limited | Chip package and fabricating method thereof |
US8759689B2 (en) * | 2011-01-04 | 2014-06-24 | Alcatel Lucent | Land pattern for 0201 components on a 0.8 mm pitch array |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5731960A (en) * | 1996-09-19 | 1998-03-24 | Bay Networks, Inc. | Low inductance decoupling capacitor arrangement |
DE19642929A1 (de) * | 1996-10-17 | 1997-07-17 | Siemens Ag | Kontaktierung wenigstens eines Bauelementes auf einer mehrlagigen Leiterplatte |
US6252177B1 (en) * | 1998-02-18 | 2001-06-26 | Compaq Computer Corporation | Low inductance capacitor mounting structure for capacitors of a printed circuit board |
-
2001
- 2001-11-15 US US10/000,902 patent/US20030089522A1/en not_active Abandoned
-
2002
- 2002-11-04 BR BR0204606-7A patent/BR0204606A/pt not_active Application Discontinuation
- 2002-11-11 JP JP2002326623A patent/JP2003188509A/ja not_active Withdrawn
- 2002-11-15 EP EP02025714A patent/EP1313356A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2003188509A (ja) | 2003-07-04 |
US20030089522A1 (en) | 2003-05-15 |
EP1313356A1 (en) | 2003-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired | ||
B15K | Others concerning applications: alteration of classification |
Ipc: H05K 1/11 (2006.01), H05K 1/02 (2006.01) |