BR9914860A - Montagem de placa de circuitos empilhada adaptada para dissipação de calor - Google Patents
Montagem de placa de circuitos empilhada adaptada para dissipação de calorInfo
- Publication number
- BR9914860A BR9914860A BR9914860-9A BR9914860A BR9914860A BR 9914860 A BR9914860 A BR 9914860A BR 9914860 A BR9914860 A BR 9914860A BR 9914860 A BR9914860 A BR 9914860A
- Authority
- BR
- Brazil
- Prior art keywords
- heat dissipation
- board assembly
- circuit board
- assembly adapted
- stacked circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
''MONTAGEM DE PLACA DE CIRCUITOS EMPILHADA ADAPTADA PARA DISSIPAçãO DE CALOR'' Um aparelho é fornecido para dissipação de calor de uma montagem de placa de circuitos empilhada. O aparelho inclui placas de circuito que são orientadas em planos espaçados que se estendem substancialmente paralelos um ao outro. Um dispositivo de transferência de calor conectado nas placas de circuito transfere calor entre as placas de circuito. Um dispositivo de dissipação de calor conectado em pelo menos uma das placas de circuito dissipa pelo menos uma porção do calor transferido.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/181,448 US5986887A (en) | 1998-10-28 | 1998-10-28 | Stacked circuit board assembly adapted for heat dissipation |
PCT/US1999/025185 WO2000025562A1 (en) | 1998-10-28 | 1999-10-27 | Stacked circuit board assembly adapted for heat dissipation |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9914860A true BR9914860A (pt) | 2001-07-17 |
Family
ID=22664326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9914860-9A BR9914860A (pt) | 1998-10-28 | 1999-10-27 | Montagem de placa de circuitos empilhada adaptada para dissipação de calor |
Country Status (7)
Country | Link |
---|---|
US (1) | US5986887A (pt) |
EP (1) | EP1125482B1 (pt) |
JP (1) | JP2002528922A (pt) |
BR (1) | BR9914860A (pt) |
CA (1) | CA2348507A1 (pt) |
DE (1) | DE69925626T2 (pt) |
WO (1) | WO2000025562A1 (pt) |
Families Citing this family (68)
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US6118656A (en) * | 1998-06-23 | 2000-09-12 | Dell Usa, Lp | Heat sink having a pressure gradient |
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US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
US6618268B2 (en) | 1999-07-15 | 2003-09-09 | Incep Technologies, Inc. | Apparatus for delivering power to high performance electronic assemblies |
US6741480B2 (en) | 1999-07-15 | 2004-05-25 | Incep Technologies, Inc. | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
US6304450B1 (en) | 1999-07-15 | 2001-10-16 | Incep Technologies, Inc. | Inter-circuit encapsulated packaging |
US6801431B2 (en) * | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
US20030214800A1 (en) | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6947293B2 (en) | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6212071B1 (en) * | 1999-08-20 | 2001-04-03 | Lucent Technologies, Inc. | Electrical circuit board heat dissipation system |
DE19950026B4 (de) * | 1999-10-09 | 2010-11-11 | Robert Bosch Gmbh | Leistungshalbleitermodul |
US6201700B1 (en) * | 2000-01-06 | 2001-03-13 | Ford Motor Company | Box design for maximum heat dissipation |
US6362974B1 (en) * | 2000-03-20 | 2002-03-26 | Hewlett-Packard Company | Stacked processor construction and a method for producing same |
US7167379B2 (en) * | 2001-02-16 | 2007-01-23 | Dibene Ii Joseph T | Micro-spring interconnect systems for low impedance high power applications |
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US6538884B1 (en) | 2001-09-21 | 2003-03-25 | Motorola, Inc. | Method and apparatus for removing heat from a component |
US6845013B2 (en) | 2002-03-04 | 2005-01-18 | Incep Technologies, Inc. | Right-angle power interconnect electronic packaging assembly |
US20040120129A1 (en) * | 2002-12-24 | 2004-06-24 | Louis Soto | Multi-layer laminated structures for mounting electrical devices and method for fabricating such structures |
US6831835B2 (en) * | 2002-12-24 | 2004-12-14 | Ault, Inc. | Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures |
US6711021B1 (en) * | 2003-01-15 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Systems and methods that use at least one component to remove the heat generated by at least one other component |
EP1590995A1 (en) * | 2003-01-29 | 2005-11-02 | Koninklijke Philips Electronics N.V. | Heat dissipating arrangement for an electronic appliance |
US6771507B1 (en) | 2003-01-31 | 2004-08-03 | Hewlett-Packard Development Company, L.P. | Power module for multi-chip printed circuit boards |
US6819562B2 (en) * | 2003-01-31 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Cooling apparatus for stacked components |
US6816378B1 (en) * | 2003-04-28 | 2004-11-09 | Hewlett-Packard Development Company, L.P. | Stack up assembly |
US7408258B2 (en) * | 2003-08-20 | 2008-08-05 | Salmon Technologies, Llc | Interconnection circuit and electronic module utilizing same |
US20050057907A1 (en) * | 2003-09-12 | 2005-03-17 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7345891B2 (en) | 2003-10-07 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7061126B2 (en) * | 2003-10-07 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7180751B1 (en) * | 2004-02-19 | 2007-02-20 | Isothermal Systems Research, Inc. | Input/output transition board system |
US7056144B2 (en) | 2004-02-19 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Offset compensation system |
US20050184376A1 (en) * | 2004-02-19 | 2005-08-25 | Salmon Peter C. | System in package |
US7327028B2 (en) * | 2004-02-24 | 2008-02-05 | Intel Corporation | Embedded heat spreader for folded stacked chip-scale package |
JP2005259962A (ja) * | 2004-03-11 | 2005-09-22 | Fuji Electric Fa Components & Systems Co Ltd | 整流回路の実装構造 |
US7193307B2 (en) * | 2004-03-25 | 2007-03-20 | Ault Incorporated | Multi-layer FET array and method of fabricating |
US7254036B2 (en) | 2004-04-09 | 2007-08-07 | Netlist, Inc. | High density memory module using stacked printed circuit boards |
GB0413420D0 (en) * | 2004-06-15 | 2004-07-21 | Radstone Technology Plc | Heat management in printed wiring boards |
US7068515B2 (en) * | 2004-11-24 | 2006-06-27 | Hewlett-Packard Development Company, L.P. | Multi-chip module with stacked redundant power |
US7064955B2 (en) * | 2004-11-24 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Redundant power for processor circuit board |
US7427809B2 (en) * | 2004-12-16 | 2008-09-23 | Salmon Technologies, Llc | Repairable three-dimensional semiconductor subsystem |
US7623349B2 (en) * | 2005-03-07 | 2009-11-24 | Ati Technologies Ulc | Thermal management apparatus and method for a circuit substrate |
US7586747B2 (en) * | 2005-08-01 | 2009-09-08 | Salmon Technologies, Llc. | Scalable subsystem architecture having integrated cooling channels |
JP2007042906A (ja) * | 2005-08-04 | 2007-02-15 | Verigy (Singapore) Pte Ltd | ヒートシンク付き回路基板 |
US7442050B1 (en) | 2005-08-29 | 2008-10-28 | Netlist, Inc. | Circuit card with flexible connection for memory module with heat spreader |
US7619893B1 (en) | 2006-02-17 | 2009-11-17 | Netlist, Inc. | Heat spreader for electronic modules |
US7742310B2 (en) * | 2006-09-29 | 2010-06-22 | Hewlett-Packard Development Company, L.P. | Sequencer |
US7397666B2 (en) * | 2006-10-25 | 2008-07-08 | Hewlett-Packard Development Company, L.P. | Wedge lock |
DE102007001407B4 (de) * | 2007-01-09 | 2016-02-25 | Continental Automotive Gmbh | Montageanordnung zur Fixierung übereinander angeordneter Leiterplatten in einem Gehäuse |
JP4450070B2 (ja) * | 2007-12-28 | 2010-04-14 | ソニー株式会社 | 電子機器 |
DE202008003872U1 (de) * | 2008-03-19 | 2008-05-15 | Doswald, Jörg A. | Gehäuseaufbau |
US8018723B1 (en) | 2008-04-30 | 2011-09-13 | Netlist, Inc. | Heat dissipation for electronic modules |
US8498124B1 (en) | 2009-12-10 | 2013-07-30 | Universal Lighting Technologies, Inc. | Magnetic circuit board stacking component |
JP4818429B2 (ja) * | 2009-12-28 | 2011-11-16 | 株式会社東芝 | 電子機器 |
US8625284B2 (en) * | 2010-05-28 | 2014-01-07 | Lear Corporation | Printed circuit board system for automotive power converter |
JP5697394B2 (ja) * | 2010-09-30 | 2015-04-08 | Dowaメタルテック株式会社 | フィン付ベース一体型基板およびフィン付ベース一体型基板装置 |
US8547699B1 (en) | 2010-11-09 | 2013-10-01 | Adtran, Inc. | Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment |
US9576409B2 (en) | 2012-09-03 | 2017-02-21 | I-Blades, Inc. | Method and system for smart contact arrays |
US9703321B2 (en) | 2013-07-09 | 2017-07-11 | I-Blades, Inc. | Snap on wearable module |
US9788460B2 (en) * | 2015-12-02 | 2017-10-10 | International Business Machines Corporation | Heatsink providing equivalent cooling for multiple in-line modules |
WO2018057645A1 (en) | 2016-09-22 | 2018-03-29 | Apple Inc. | Battery architecture in an electronic device |
FR3060202B1 (fr) * | 2016-12-12 | 2019-07-05 | Aptiv Technologies Limited | Dispositif de dissipation de chaleur d'une unite de controle multimedia |
JP6622785B2 (ja) * | 2017-12-19 | 2019-12-18 | ファナック株式会社 | 電子部品ユニット |
KR102421521B1 (ko) * | 2018-01-31 | 2022-07-15 | 삼성전자주식회사 | 적층 구조의 커넥터를 포함하는 전자 장치 |
EP3690934A1 (de) * | 2019-02-04 | 2020-08-05 | Siemens Aktiengesellschaft | Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe |
US11680927B1 (en) | 2019-11-22 | 2023-06-20 | Cypress In-Line Inspection, LLC | Dual layer circuit board for sensors on a pipeline inspection tool |
CN115623731A (zh) * | 2021-07-12 | 2023-01-17 | 台达电子工业股份有限公司 | 堆叠系统 |
US20230232596A1 (en) * | 2022-01-14 | 2023-07-20 | Nio Technology (Anhui) Co., Ltd. | Serviceable and accessible liquid cooled modules |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
DE3331112A1 (de) * | 1983-08-30 | 1985-03-14 | Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen | Vorrichtung zur waermeabfuhr von leiterplatten |
US4887353A (en) * | 1985-05-01 | 1989-12-19 | Amp Incorporated | Conduction cooled module connector system and method of making |
US4963976A (en) * | 1988-09-12 | 1990-10-16 | Sundstrand Corporation | Integrated electrical conducting, cooling and clamping assembly for power semiconductors |
US5020586A (en) * | 1989-09-08 | 1991-06-04 | Hewlett-Packard Company | Air-cooled heat exchanger for electronic circuit modules |
US5014904A (en) * | 1990-01-16 | 1991-05-14 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
US5181167A (en) * | 1991-12-02 | 1993-01-19 | Sun Microsystems, Inc. | Stacking heatpipe for three dimensional electronic packaging |
NL9200117A (nl) * | 1992-01-22 | 1993-08-16 | Du Pont Nederland | Stelsel en connectoren voor het onderling elektrisch verbinden van componentplaten. |
US5353192A (en) * | 1993-02-08 | 1994-10-04 | At&T Bell Laboratories | Circuit card assembly |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
JP2901835B2 (ja) * | 1993-04-05 | 1999-06-07 | 株式会社東芝 | 半導体装置 |
US5390078A (en) * | 1993-08-30 | 1995-02-14 | At&T Global Information Solutions Company | Apparatus for using an active circuit board as a heat sink |
US5701233A (en) * | 1995-01-23 | 1997-12-23 | Irvine Sensors Corporation | Stackable modules and multimodular assemblies |
US5657537A (en) * | 1995-05-30 | 1997-08-19 | General Electric Company | Method for fabricating a stack of two dimensional circuit modules |
US5729433A (en) * | 1996-01-30 | 1998-03-17 | Micromodule Systems, Inc. | Multiple chip module assembly for top of mother board |
US5812374A (en) * | 1996-10-28 | 1998-09-22 | Shuff; Gregg Douglas | Electrical circuit cooling device |
-
1998
- 1998-10-28 US US09/181,448 patent/US5986887A/en not_active Expired - Lifetime
-
1999
- 1999-10-27 WO PCT/US1999/025185 patent/WO2000025562A1/en active IP Right Grant
- 1999-10-27 EP EP99962662A patent/EP1125482B1/en not_active Expired - Lifetime
- 1999-10-27 BR BR9914860-9A patent/BR9914860A/pt not_active IP Right Cessation
- 1999-10-27 DE DE69925626T patent/DE69925626T2/de not_active Expired - Fee Related
- 1999-10-27 CA CA002348507A patent/CA2348507A1/en not_active Abandoned
- 1999-10-27 JP JP2000579033A patent/JP2002528922A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69925626D1 (de) | 2005-07-07 |
WO2000025562A1 (en) | 2000-05-04 |
DE69925626T2 (de) | 2006-04-27 |
US5986887A (en) | 1999-11-16 |
CA2348507A1 (en) | 2000-05-04 |
EP1125482A1 (en) | 2001-08-22 |
JP2002528922A (ja) | 2002-09-03 |
EP1125482B1 (en) | 2005-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 10A E 11A ANUIDADE(S), |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2082 DE 30/11/2010. |