ES2038349T3 - Placa de circuito impreso con un dispositivo de refrigeracion. - Google Patents
Placa de circuito impreso con un dispositivo de refrigeracion.Info
- Publication number
- ES2038349T3 ES2038349T3 ES198989102856T ES89102856T ES2038349T3 ES 2038349 T3 ES2038349 T3 ES 2038349T3 ES 198989102856 T ES198989102856 T ES 198989102856T ES 89102856 T ES89102856 T ES 89102856T ES 2038349 T3 ES2038349 T3 ES 2038349T3
- Authority
- ES
- Spain
- Prior art keywords
- circuit board
- printed
- cooling
- cut
- dissipate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Structure Of Printed Boards (AREA)
Abstract
PARA EVITAR LA PERDIDA DE VALOR, FUERTEMENTE CRECIENTE, CAUSADA POR LA CRECIENTE DENSIDAD EN LA INTEGRACION DE LOS ELEMENTOS SEMICONDUCTORES UTILIZADOS EN LA INTEGRACION DE LOS ELEMENTOS SEMICONDUCTORES UTILIZADOS EN LA CONSTRUCCION, HOY EN DIA, CON FRECUENCIA NO ES SUFICIENTE LA TRANSMISION DEL CALOR POR LA PLACA CONDUCTORA, NI LA CONDUCCION DEL CALOR POR CONVECCION Y, POR CONSIGUIENTE, HAY QUE PRESTAR ATENCION A UN ENFRIAMIENTO ADICCIONAL DE LA PLACA CONDUCTORA. ES CONOCIDA, POR EJEMPLO, LA TECNICA DE SUJETAR LA PLACA CONDUCTORA EN UNA PLACA CONCAVA DE COBRE. PERO ES MUY COSTOSO, FABRICAR UNA PLACA DE COBRE DE ESTE TIPO. LA IDEA DE ESTE INVENTO CONSISTE EN QUE LA PLACA CONDUCTORA SIRVE POR SI MISMA DE MECANISMO FRIGORIFICO. CONSISTE EN DOS CAPAS EXTERIORES (2), Y, AL MENOS, UNA CAPA INTRIOR (4), LAS CUALES ESTAN PEGADAS O UNIDAS CON UN "PREGPREG" MEDIANTE PRENSAS CALIENTES. EN LA CAPA INTERIOR (4) SE HA FIJADO, PERFORADO O CORTADO RANURAS O HUECOS, LOS CUALES FORMAN CANALES (5) DESPUES DE LA INSTALACION DE LAS CAPAS EXTERIORES (2). LOS CANALES SIRVEN PARA EL PASO DEL LIQUIDO FRIO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3805851A DE3805851A1 (de) | 1988-02-25 | 1988-02-25 | Leiterplatte mit einer kuehlvorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2038349T3 true ES2038349T3 (es) | 1993-07-16 |
Family
ID=6348107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES198989102856T Expired - Lifetime ES2038349T3 (es) | 1988-02-25 | 1989-02-18 | Placa de circuito impreso con un dispositivo de refrigeracion. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5142441A (es) |
EP (1) | EP0331953B1 (es) |
JP (1) | JPH01289297A (es) |
AT (1) | ATE83885T1 (es) |
CA (1) | CA1315013C (es) |
DE (2) | DE3805851A1 (es) |
ES (1) | ES2038349T3 (es) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4012100A1 (de) * | 1990-04-14 | 1991-10-17 | Standard Elektrik Lorenz Ag | Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben |
JP3254001B2 (ja) * | 1991-04-08 | 2002-02-04 | ゼネラル・エレクトリック・カンパニイ | 半導体モジュール用の一体化放熱器 |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
DE19711533C2 (de) * | 1997-03-20 | 1999-10-28 | Abb Daimler Benz Transp | Leiterplattenanordnung mit Wärmeaustauscher |
US5818692A (en) * | 1997-05-30 | 1998-10-06 | Motorola, Inc. | Apparatus and method for cooling an electrical component |
US6400012B1 (en) * | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
JP2000216550A (ja) * | 1999-01-25 | 2000-08-04 | Oki Electric Ind Co Ltd | 積層プリント配線基板 |
FR2798036B1 (fr) * | 1999-08-26 | 2002-01-18 | Sagem | Module electronique et procede de fabrication d'un tel module |
DE10023736A1 (de) * | 2000-05-15 | 2001-11-22 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte |
US20020163781A1 (en) * | 2001-05-01 | 2002-11-07 | Ericsson Inc. | Integrated cooling of a printed circuit board structure |
US6529377B1 (en) | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
US6988531B2 (en) * | 2002-01-11 | 2006-01-24 | Intel Corporation | Micro-chimney and thermosiphon die-level cooling |
JP2003329379A (ja) * | 2002-05-10 | 2003-11-19 | Furukawa Electric Co Ltd:The | ヒートパイプ回路基板 |
DE102004006533A1 (de) * | 2004-02-11 | 2005-09-01 | Conti Temic Microelectronic Gmbh | Elektrisch leitfähiger Kontaktstift zum Einpressen in eine Öffnung einer Leiterplatte sowie elektrische Baugruppe mit einem solchen Kontaktstift |
US7121998B1 (en) * | 2004-06-08 | 2006-10-17 | Eurica Califorrniaa | Vented microcradle for prenidial incubator |
DE102004062441B3 (de) * | 2004-12-16 | 2006-07-20 | Schweizer Electronic Ag | Mehrschichtaufbau mit Temperierfluidkanal und Herstellungsverfahren |
DE202005018284U1 (de) * | 2005-04-08 | 2006-02-02 | Rittal Gmbh & Co. Kg | Kühleinheit |
JP4710460B2 (ja) * | 2005-07-20 | 2011-06-29 | 株式会社村田製作所 | セラミック多層基板、その製造方法、およびパワー半導体モジュール |
EP1761114A3 (en) * | 2005-08-31 | 2009-09-16 | Kabushiki Kaisha Toyota Jidoshokki | Circuit board |
US7298623B1 (en) * | 2006-06-29 | 2007-11-20 | International Business Machines Corporation | Organic substrate with integral thermal dissipation channels, and method for producing same |
US7679916B2 (en) * | 2006-12-08 | 2010-03-16 | GE Intelligent Platforms Embedded Systems, Inc. | Method and system for extracting heat from electrical components |
US8919426B2 (en) * | 2007-10-22 | 2014-12-30 | The Peregrine Falcon Corporation | Micro-channel pulsating heat pipe |
US7738249B2 (en) * | 2007-10-25 | 2010-06-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
US20090194831A1 (en) * | 2008-02-01 | 2009-08-06 | Custom Sensors & Technologies, Inc. | Integrated cavity in pcb pressure sensor |
US8472193B2 (en) | 2008-07-04 | 2013-06-25 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
DE102009000514A1 (de) * | 2009-01-30 | 2010-08-26 | Robert Bosch Gmbh | Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil |
US7898807B2 (en) * | 2009-03-09 | 2011-03-01 | General Electric Company | Methods for making millichannel substrate, and cooling device and apparatus using the substrate |
DE202010017772U1 (de) | 2010-12-30 | 2012-10-22 | Schweizer Electronic Ag | Leiterplatte mit Kühlfluidkanal |
DE102015118146B4 (de) | 2015-10-23 | 2017-06-08 | Schweizer Electronic Ag | Kühlmittelanschlusselement und Leiterplatte mit Kühlkanal |
US10757809B1 (en) | 2017-11-13 | 2020-08-25 | Telephonics Corporation | Air-cooled heat exchanger and thermal arrangement for stacked electronics |
US11406010B2 (en) * | 2019-05-21 | 2022-08-02 | Benchmark Electronics, Inc. | Thermal management system and method therefor |
US10772188B1 (en) | 2019-06-11 | 2020-09-08 | International Business Machines Corporation | Stiffener cooling structure |
CN112638029B (zh) * | 2020-12-23 | 2022-07-22 | 华为数字能源技术有限公司 | 电路板 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1105068A (en) * | 1964-10-31 | 1968-03-06 | Hitachi Ltd | Improvements in or relating to printed circuits |
DE1930642A1 (de) * | 1969-06-18 | 1971-01-07 | Siemens Ag | Leiterplatte zum Aufnehmen und Verbinden elektrischer Bauelemente |
GB1477780A (en) * | 1974-08-14 | 1977-06-29 | Seikosha Kk | Assembly incorporating electrically conductive adhesive |
FR2285955A1 (fr) * | 1974-09-27 | 1976-04-23 | Inst Elektroswarki Patona | Procede de reglage de la vitesse de fusion de pieces a souder au cours d'un soudage en bout par resistance et etincelage, et dispositif pour la mise en oeuvre de ce procede |
JPS5162901A (en) * | 1974-11-25 | 1976-05-31 | Sandosutorando Hiito Toransufu | Denshisochonetsudentatsukozobutsu |
US4155402A (en) * | 1977-01-03 | 1979-05-22 | Sperry Rand Corporation | Compliant mat cooling |
CA1132213A (en) * | 1979-04-02 | 1982-09-21 | Matthew Pobog | Printed circuit board connector |
FR2519508A1 (fr) * | 1981-12-31 | 1983-07-08 | Thomson Csf | Dispositif de refroidissement pour carte de circuit imprime et procede de fabrication d'un tel dispositif |
DE3321321A1 (de) * | 1982-06-19 | 1983-12-22 | Ferranti plc, Gatley, Cheadle, Cheshire | Elektrische schaltungsanordnung |
DE3329325A1 (de) * | 1982-09-03 | 1984-03-08 | Peter 2563 Ipsach Herren | Kuehlkoerper zur fluessigkeitskuehlung wenigstens eines elektrischen leistungselementes |
FR2538989B1 (fr) * | 1982-12-30 | 1985-10-04 | Thomson Csf | Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage |
US4631636A (en) * | 1984-03-26 | 1986-12-23 | Harris Corporation | High density packaging technique for electronic systems |
FR2579060B1 (fr) * | 1985-03-18 | 1987-04-17 | Socapex | Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
US4734315A (en) * | 1985-06-05 | 1988-03-29 | Joyce Florence Space-Bate | Low power circuitry components |
US4739443A (en) * | 1985-12-30 | 1988-04-19 | Olin Corporation | Thermally conductive module |
DE3601140A1 (de) * | 1986-01-16 | 1987-07-23 | Siemens Ag | Vorrichtung fuer eine fluessigkeitskuehlung eines elektrischen bauelementes, insbesondere halbleiter-bauelementes |
-
1988
- 1988-02-25 DE DE3805851A patent/DE3805851A1/de active Granted
-
1989
- 1989-02-18 ES ES198989102856T patent/ES2038349T3/es not_active Expired - Lifetime
- 1989-02-18 DE DE8989102856T patent/DE58903063D1/de not_active Expired - Fee Related
- 1989-02-18 AT AT89102856T patent/ATE83885T1/de active
- 1989-02-18 EP EP89102856A patent/EP0331953B1/de not_active Expired - Lifetime
- 1989-02-21 CA CA000591614A patent/CA1315013C/en not_active Expired - Fee Related
- 1989-02-23 JP JP1045023A patent/JPH01289297A/ja active Pending
- 1989-02-23 US US07/314,079 patent/US5142441A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01289297A (ja) | 1989-11-21 |
EP0331953A1 (de) | 1989-09-13 |
DE3805851C2 (es) | 1990-10-04 |
DE3805851A1 (de) | 1989-08-31 |
EP0331953B1 (de) | 1992-12-23 |
US5142441A (en) | 1992-08-25 |
DE58903063D1 (de) | 1993-02-04 |
ATE83885T1 (de) | 1993-01-15 |
CA1315013C (en) | 1993-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2038349T3 (es) | Placa de circuito impreso con un dispositivo de refrigeracion. | |
CA1290078C (en) | Cooling structure for heat generating electronic components mounted on a substrate | |
SE8406220D0 (sv) | Anordning vid kylning av kretskort | |
GB2275370A (en) | Heat sink | |
SE9103109D0 (sv) | Anordning foer kylning av elektronik medelst straalningsoeverfoering | |
DE3480294D1 (en) | Signal light unit having heat dissipating function | |
IT1148817B (it) | Apparecchiatura per raffreddare moduli circuitali elettronici | |
SE8704303D0 (sv) | Kylkropp for ett elektriskt kretskort | |
ES2048886T3 (es) | Procedimiento de enfriamiento de componentes electricos, dispositivo para la realizacion de este procedimiento y aplicacion a los componentes embarcados en un vehiculo. | |
SE9301825D0 (sv) | Foerfarande och anordning foer att skydda ett moensterkort mot oeverstroemmar | |
DE60212957D1 (de) | Integrierte kühlung einer leiterplattenstruktur | |
DK542287A (da) | Monteringsanordning for trykte kredsloeb | |
US4339260A (en) | Environmentally protected electronic control for a glassware forming machine | |
DE59710570D1 (de) | Leiterplattenanordnung | |
GB9223021D0 (en) | Semiconductor module and power control device for use therewith and manufacturing method thereof | |
ATE379848T1 (de) | Schalt- oder steuergerät | |
GB2164499A (en) | Heat sinks for electronic components | |
ES2128450T3 (es) | Subconjunto electrico. | |
KR970024073A (ko) | 전자부품용 냉각장치(cooling apparatus for electronic parts) | |
GB2137422A (en) | Printed circuit board | |
JPS57162453A (en) | Heat radiating device | |
SE9702593D0 (sv) | Anordning vid ett kretskort | |
ATE144097T1 (de) | Kühlvorrichtung für eine elektrische baugruppe | |
ES2046027T3 (es) | Dispositivo que utiliza unos componentes electronicos montados en superficie y que comprende un dispositivo de enfriamiento perfeccionado. | |
JPS5661152A (en) | Integrated circuit cooler |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 331953 Country of ref document: ES |