IT1148817B - Apparecchiatura per raffreddare moduli circuitali elettronici - Google Patents

Apparecchiatura per raffreddare moduli circuitali elettronici

Info

Publication number
IT1148817B
IT1148817B IT21314/80A IT2131480A IT1148817B IT 1148817 B IT1148817 B IT 1148817B IT 21314/80 A IT21314/80 A IT 21314/80A IT 2131480 A IT2131480 A IT 2131480A IT 1148817 B IT1148817 B IT 1148817B
Authority
IT
Italy
Prior art keywords
equipment
electronic circuit
circuit modules
cooling electronic
cooling
Prior art date
Application number
IT21314/80A
Other languages
English (en)
Other versions
IT8021314A0 (it
Inventor
Robert Matthew Dunn
Martin David Schulman
Nicholas Timko Jr
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT8021314A0 publication Critical patent/IT8021314A0/it
Application granted granted Critical
Publication of IT1148817B publication Critical patent/IT1148817B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/908—Fluid jets

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Transmitters (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
IT21314/80A 1979-05-29 1980-04-11 Apparecchiatura per raffreddare moduli circuitali elettronici IT1148817B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/043,404 US4277816A (en) 1979-05-29 1979-05-29 Electronic circuit module cooling

Publications (2)

Publication Number Publication Date
IT8021314A0 IT8021314A0 (it) 1980-04-11
IT1148817B true IT1148817B (it) 1986-12-03

Family

ID=21927005

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21314/80A IT1148817B (it) 1979-05-29 1980-04-11 Apparecchiatura per raffreddare moduli circuitali elettronici

Country Status (8)

Country Link
US (1) US4277816A (it)
EP (1) EP0019780B1 (it)
JP (1) JPS55158655A (it)
AT (1) ATE3743T1 (it)
CA (1) CA1126845A (it)
DE (1) DE3063664D1 (it)
IT (1) IT1148817B (it)
ZA (1) ZA801932B (it)

Families Citing this family (51)

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US4291364A (en) * 1979-12-26 1981-09-22 International Business Machines Corporation Air-cooled hybrid electronic package
US4442049A (en) * 1980-11-10 1984-04-10 Haden Schweitzer Corporation Apparatus for ensuring heat exchange between a gas flow and a heat exchanger
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4699051A (en) * 1981-12-10 1987-10-13 Dataproducts Corporation Cooling assembly for hammer bank
US4449164A (en) * 1982-09-27 1984-05-15 Control Data Corporation Electronic module cooling system using parallel air streams
DE3236325A1 (de) * 1982-09-30 1984-04-05 Siemens AG, 1000 Berlin und 8000 München Flachbaugruppe
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4529478A (en) * 1983-09-14 1985-07-16 Usm Corporation Rotary processors and vacuum systems
US4628992A (en) * 1984-01-23 1986-12-16 At&T Information Systems Induced flow heat exchanger
GB2186842B (en) * 1986-02-19 1990-08-01 Dataproducts Corp Impact printer
JPS62274798A (ja) * 1986-05-19 1987-11-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション ヒ−トシンク構造体
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
FR2609233A1 (fr) * 1986-12-30 1988-07-01 Bull Sa Dispositif de ventilation de composants disposes en rangees sur une plaque
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US4858717A (en) * 1988-03-23 1989-08-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Acoustic convective system
US5079438A (en) * 1989-01-30 1992-01-07 Heung Lap Yan Circuit module fan assembly
US5191230A (en) * 1989-01-30 1993-03-02 Heung Lap Yan Circuit module fan assembly
JP2741255B2 (ja) * 1989-08-18 1998-04-15 株式会社日立製作所 沸騰冷却用伝熱体
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
US5196989A (en) * 1990-04-09 1993-03-23 Trw Inc. Rigid circuit board structure using impingement cooling
US5097385A (en) * 1990-04-18 1992-03-17 International Business Machines Corporation Super-position cooling
US5067047A (en) * 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
US5121290A (en) * 1990-06-25 1992-06-09 At&T Bell Laboratories Circuit pack cooling using perforations
US5161092A (en) * 1991-07-02 1992-11-03 Hughes Aircraft Company Circuit card assembly conduction converter
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
US5353865A (en) * 1992-03-30 1994-10-11 General Electric Company Enhanced impingement cooled components
US5416427A (en) * 1993-02-11 1995-05-16 Tracewell Enclosures, Inc. Test and development apparatus for bus-based circuit modules with open side and backplane access features
GB2276763B (en) * 1993-03-30 1997-05-07 Thermalloy Inc Method and apparatus for dissipating thermal energy
US5864466A (en) * 1994-07-19 1999-01-26 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan
US5604665A (en) * 1995-06-30 1997-02-18 International Business Machines Corporation Multiple parallel impingement flow cooling with tuning
US5597035A (en) * 1995-08-18 1997-01-28 Dell Usa, L.P. For use with a heatsink a shroud having a varying cross-sectional area
US5638895A (en) * 1996-03-25 1997-06-17 Dodson; Douglas A. Twin fan cooling device
US5787971A (en) * 1996-03-25 1998-08-04 Dodson; Douglas A. Multiple fan cooling device
US5793608A (en) * 1996-06-11 1998-08-11 Sun Microsystems, Inc. Cooling system for enclosed electronic components
TW313277U (en) * 1996-07-19 1997-08-11 Mitac Int Corp Transmission interface bridge device
US5815371A (en) * 1996-09-26 1998-09-29 Dell U.S.A., L.P. Multi-function heat dissipator
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
JPH11121666A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd マルチチップモジュールの冷却装置
CN1435075A (zh) * 2000-12-23 2003-08-06 韩国科学技术院 散热器
DE10148520A1 (de) * 2001-10-01 2003-04-17 Fujitsu Siemens Computers Gmbh Kühlluftführung
US6650538B1 (en) * 2002-07-17 2003-11-18 International Business Machines Corporation Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof
US6765796B2 (en) 2002-11-21 2004-07-20 Teradyne, Inc. Circuit board cover with exhaust apertures for cooling electronic components
JP2005079175A (ja) * 2003-08-28 2005-03-24 Toshiba Corp 放熱装置
US9047066B2 (en) 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
EP2182502B1 (en) * 2007-08-20 2014-11-12 Mitsubishi Electric Corporation Display device
US7751189B2 (en) * 2007-09-07 2010-07-06 Intel Corporation Cooling arrangement to cool components on circuit board
US8305755B2 (en) * 2010-03-04 2012-11-06 Toyota Motor Engineering & Manufacturing North America, Inc. Power modules, cooling devices and methods thereof
US10037062B1 (en) 2017-03-17 2018-07-31 Microsoft Technology Licensing, Llc Thermal venting device with pressurized plenum
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2169109A (en) * 1935-08-02 1939-08-08 Gen Electric Air cooling means for dry rectifiers
US2380026A (en) * 1943-08-06 1945-07-10 Standard Telephones Cables Ltd Cooling device for metal rectifiers
US3387648A (en) * 1967-02-23 1968-06-11 Navy Usa Cabinet enclosed recirculation cooling system carried on extensible chassis mountingelectronic modules
FR2157094A5 (it) * 1971-10-18 1973-06-01 Thomson Csf
JPS5015483A (it) * 1973-06-08 1975-02-18
US4093021A (en) * 1975-12-29 1978-06-06 The Boeing Company Instrument and panel cooling apparatus
JPS5917560B2 (ja) * 1977-03-03 1984-04-21 富士通株式会社 電子装置の冷却方式
JPS53107665A (en) * 1977-03-03 1978-09-19 Fujitsu Ltd Structural unit for mounting electronic device
JPS5917559B2 (ja) * 1977-03-03 1984-04-21 富士通株式会社 電子装置の冷却方式

Also Published As

Publication number Publication date
IT8021314A0 (it) 1980-04-11
EP0019780B1 (de) 1983-06-08
ZA801932B (en) 1981-04-29
CA1126845A (en) 1982-06-29
JPS5725980B2 (it) 1982-06-02
ATE3743T1 (de) 1983-06-15
US4277816A (en) 1981-07-07
JPS55158655A (en) 1980-12-10
DE3063664D1 (en) 1983-07-14
EP0019780A1 (de) 1980-12-10

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940428