ES8602339A1 - Una disposicion de placa de circuito impreso para componen- tes electronicos - Google Patents

Una disposicion de placa de circuito impreso para componen- tes electronicos

Info

Publication number
ES8602339A1
ES8602339A1 ES539843A ES539843A ES8602339A1 ES 8602339 A1 ES8602339 A1 ES 8602339A1 ES 539843 A ES539843 A ES 539843A ES 539843 A ES539843 A ES 539843A ES 8602339 A1 ES8602339 A1 ES 8602339A1
Authority
ES
Spain
Prior art keywords
liquid
circuit board
printed circuit
board assembly
cooling module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES539843A
Other languages
English (en)
Other versions
ES539843A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59013007A external-priority patent/JPS60160152A/ja
Priority claimed from JP59013006A external-priority patent/JPS60160151A/ja
Priority claimed from JP59013005A external-priority patent/JPS60160150A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of ES8602339A1 publication Critical patent/ES8602339A1/es
Publication of ES539843A0 publication Critical patent/ES539843A0/es
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PERFECCIONAMIENTOS EN UNA DISPOSICION DE PLACA DE CIRCUITO IMPRESO PARA COMPONENTES ELECTRONICOS. CONSISTENTES EN: DOTAR A UNA DISPOSICION DE PLACA DE CIRCUITOS IMPRESOS (22) DE UNOS MODULOS (30A, 30B) DE REFRIGERACION POR LIQUIDO, A AMBOS LADOS (24A, 24B) DE LA PLACA, PARA ELIMINAR LA COMBADURA O DEFORMACION DE LA PLACA DE CIRCUITOS IMPRESOS, Y LA TENSION MECANICA EJERCIDA SOBRE LOS COMPONENTES ELECTRONICOS (26) DE LA PLACA; DOTAR A CADA UNO DE LOS MODULOS DE REFRIGERACION POR LIQUIDO DE UNA PLATINA (32) DE REFRIGERACION POR LIQUIDO CON UNAS CABEZAS (36) DE SUMINISTRO DE REFRIGERANTE LIQUIDO, Y DE UNA PLURALIDAD DE UNIDADES ELASTICAS (40) DE TRANSMISION DE CALOR; DISPONER QUE LA CANTIDAD DE REFRIGERANTE LIQUIDO QUE LLEGA A LOS MODULOS DE REFRIGERACION SEA SUFICIENTE PARA ELIMINAR EL CALOR DE CADA LAMINA DE TRANSFERENCIA DE CALOR DEL CONJUNTO.
ES539843A 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos Granted ES539843A0 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59013007A JPS60160152A (ja) 1984-01-26 1984-01-26 集積回路冷却装置
JP59013006A JPS60160151A (ja) 1984-01-26 1984-01-26 集積回路の冷却方式
JP59013005A JPS60160150A (ja) 1984-01-26 1984-01-26 集積回路の冷却装置

Publications (2)

Publication Number Publication Date
ES8602339A1 true ES8602339A1 (es) 1985-11-16
ES539843A0 ES539843A0 (es) 1985-11-16

Family

ID=27280079

Family Applications (1)

Application Number Title Priority Date Filing Date
ES539843A Granted ES539843A0 (es) 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos

Country Status (8)

Country Link
US (1) US5050037A (es)
EP (1) EP0151546B1 (es)
KR (1) KR900002214B1 (es)
AU (1) AU552537B2 (es)
BR (1) BR8500360A (es)
CA (1) CA1227886A (es)
DE (1) DE3586661T2 (es)
ES (1) ES539843A0 (es)

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JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
US7149087B2 (en) * 2004-09-08 2006-12-12 Thermal Corp. Liquid cooled heat sink with cold plate retention mechanism
EP1637741A1 (de) * 2004-09-17 2006-03-22 Pumpenfabrik Ernst Vogel Gesellschaft m.b.H. Flüssigkeitsgekühltes Pumpensteuergerät und Flüssigkeitspumpenanordnung
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US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
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Also Published As

Publication number Publication date
DE3586661D1 (de) 1992-10-29
CA1227886A (en) 1987-10-06
AU552537B2 (en) 1986-06-05
EP0151546A2 (en) 1985-08-14
US5050037A (en) 1991-09-17
KR850006302A (ko) 1985-10-02
DE3586661T2 (de) 1993-02-04
ES539843A0 (es) 1985-11-16
EP0151546A3 (en) 1987-03-18
KR900002214B1 (ko) 1990-04-04
BR8500360A (pt) 1985-09-10
EP0151546B1 (en) 1992-09-23
AU3794385A (en) 1985-08-01

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