JPS5162901A - Denshisochonetsudentatsukozobutsu - Google Patents
DenshisochonetsudentatsukozobutsuInfo
- Publication number
- JPS5162901A JPS5162901A JP50117311A JP11731175A JPS5162901A JP S5162901 A JPS5162901 A JP S5162901A JP 50117311 A JP50117311 A JP 50117311A JP 11731175 A JP11731175 A JP 11731175A JP S5162901 A JPS5162901 A JP S5162901A
- Authority
- JP
- Japan
- Prior art keywords
- denshisochonetsudentatsukozobutsu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52664374A | 1974-11-25 | 1974-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5162901A true JPS5162901A (en) | 1976-05-31 |
Family
ID=24098158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50117311A Pending JPS5162901A (en) | 1974-11-25 | 1975-09-30 | Denshisochonetsudentatsukozobutsu |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5162901A (en) |
| DE (1) | DE2550419A1 (en) |
| FR (1) | FR2292335A1 (en) |
| GB (1) | GB1499578A (en) |
| IT (1) | IT1052396B (en) |
| SE (1) | SE412144B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59500742A (en) * | 1983-04-27 | 1984-04-26 | ヒユ−ズ・エアクラフト・カンパニ− | Heat pipe cooling module for high power circuit boards |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4353415A (en) | 1979-07-30 | 1982-10-12 | United Kingdom Atomic Energy Authority | Heat pipes and thermal siphons |
| US4339260A (en) * | 1981-01-12 | 1982-07-13 | Owens-Illinois, Inc. | Environmentally protected electronic control for a glassware forming machine |
| DE3305687A1 (en) * | 1983-02-18 | 1984-08-23 | Raymond E. San Diego Calif. Wiech jun. | Method for producing complex micro-circuit boards, micro-circuit substrates and micro-circuits, and substrates and micro-circuits produced according to the method |
| FR2577349B1 (en) * | 1985-02-08 | 1987-10-09 | Sintra | SEMICONDUCTOR INTEGRATED CIRCUIT COOLING DEVICE |
| US4805691A (en) * | 1986-12-22 | 1989-02-21 | Sundstrand Corporation | Cooling technique for compact electronics inverter |
| DE3805851A1 (en) * | 1988-02-25 | 1989-08-31 | Standard Elektrik Lorenz Ag | CIRCUIT BOARD WITH A COOLING DEVICE |
| JP3896961B2 (en) * | 2002-12-12 | 2007-03-22 | ソニー株式会社 | Heat transport device and method of manufacturing heat transport device |
-
1975
- 1975-09-30 JP JP50117311A patent/JPS5162901A/en active Pending
- 1975-10-27 FR FR7532786A patent/FR2292335A1/en not_active Withdrawn
- 1975-10-30 GB GB44838/75A patent/GB1499578A/en not_active Expired
- 1975-11-10 DE DE19752550419 patent/DE2550419A1/en active Pending
- 1975-11-19 SE SE7512989A patent/SE412144B/en unknown
- 1975-11-25 IT IT52381/75A patent/IT1052396B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59500742A (en) * | 1983-04-27 | 1984-04-26 | ヒユ−ズ・エアクラフト・カンパニ− | Heat pipe cooling module for high power circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2550419A1 (en) | 1976-05-26 |
| IT1052396B (en) | 1981-06-20 |
| FR2292335A1 (en) | 1976-06-18 |
| SE412144B (en) | 1980-02-18 |
| SE7512989L (en) | 1976-05-26 |
| GB1499578A (en) | 1978-02-01 |