GB1499578A - Circuit board assembly and heat transfer structure - Google Patents

Circuit board assembly and heat transfer structure

Info

Publication number
GB1499578A
GB1499578A GB44838/75A GB4483875A GB1499578A GB 1499578 A GB1499578 A GB 1499578A GB 44838/75 A GB44838/75 A GB 44838/75A GB 4483875 A GB4483875 A GB 4483875A GB 1499578 A GB1499578 A GB 1499578A
Authority
GB
United Kingdom
Prior art keywords
heat transfer
transfer structure
circuit board
heat
mountings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB44838/75A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sundstrand Heat Transfer Inc
Original Assignee
Sundstrand Heat Transfer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundstrand Heat Transfer Inc filed Critical Sundstrand Heat Transfer Inc
Publication of GB1499578A publication Critical patent/GB1499578A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1499578 Cooling circuit boards SUNDSTRAND HEAT TRANSFER Inc 30 Oct 1975 [25 Nov 1974] 44838/75 Heading F4U [Also in Division H1] An assembly comprises a circuit board 10 for a digital computer and an associated heat transfer structure through which an array of terminal pins 62, 64 of the circuit board extends, the array defining rows of mountings for integrated circuit modules 28, wherein the heat transfer structure comprises a first heat transfer surface 42 abutting the board 10, a second heat transfer surface 38 for abutting, in use, the modules 28, and between the two said surfaces 38, 42, a heat pipe associated with each row of mountings: and extending along the length of the row into a cooled condenser region (30, Fig. 1). The heat transfer structure also includes a central layer 40 which, with the aid of spacer elements, defines the heat pipes. The heat pipes include longitudinal capillary grooves 44. The layers 38, 40, 42 are formed of aluminium. An insulating layer 66 surrounds each terminal pin 62, 64.
GB44838/75A 1974-11-25 1975-10-30 Circuit board assembly and heat transfer structure Expired GB1499578A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52664374A 1974-11-25 1974-11-25

Publications (1)

Publication Number Publication Date
GB1499578A true GB1499578A (en) 1978-02-01

Family

ID=24098158

Family Applications (1)

Application Number Title Priority Date Filing Date
GB44838/75A Expired GB1499578A (en) 1974-11-25 1975-10-30 Circuit board assembly and heat transfer structure

Country Status (6)

Country Link
JP (1) JPS5162901A (en)
DE (1) DE2550419A1 (en)
FR (1) FR2292335A1 (en)
GB (1) GB1499578A (en)
IT (1) IT1052396B (en)
SE (1) SE412144B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
GB2120860A (en) * 1981-01-12 1983-12-07 Owens Illinois Inc Environmentally protected electronic control for a glassware forming machine
GB2199650A (en) * 1986-12-22 1988-07-13 Sundstrand Corp Cooling electronic components
CN100449247C (en) * 2002-12-12 2009-01-07 索尼株式会社 Heat transport apparatus and heat transport apparatus manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3305687A1 (en) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Method for producing complex micro-circuit boards, micro-circuit substrates and micro-circuits, and substrates and micro-circuits produced according to the method
JPS59500742A (en) * 1983-04-27 1984-04-26 ヒユ−ズ・エアクラフト・カンパニ− Heat pipe cooling module for high power circuit boards
FR2577349B1 (en) * 1985-02-08 1987-10-09 Sintra SEMICONDUCTOR INTEGRATED CIRCUIT COOLING DEVICE
DE3805851A1 (en) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag CIRCUIT BOARD WITH A COOLING DEVICE

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
GB2120860A (en) * 1981-01-12 1983-12-07 Owens Illinois Inc Environmentally protected electronic control for a glassware forming machine
GB2199650A (en) * 1986-12-22 1988-07-13 Sundstrand Corp Cooling electronic components
GB2199650B (en) * 1986-12-22 1990-11-14 Sundstrand Corp Heat dissipating mounting for electronic components
CN100449247C (en) * 2002-12-12 2009-01-07 索尼株式会社 Heat transport apparatus and heat transport apparatus manufacturing method

Also Published As

Publication number Publication date
SE7512989L (en) 1976-05-26
JPS5162901A (en) 1976-05-31
FR2292335A1 (en) 1976-06-18
DE2550419A1 (en) 1976-05-26
IT1052396B (en) 1981-06-20
SE412144B (en) 1980-02-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee