GB1499578A - Circuit board assembly and heat transfer structure - Google Patents
Circuit board assembly and heat transfer structureInfo
- Publication number
- GB1499578A GB1499578A GB44838/75A GB4483875A GB1499578A GB 1499578 A GB1499578 A GB 1499578A GB 44838/75 A GB44838/75 A GB 44838/75A GB 4483875 A GB4483875 A GB 4483875A GB 1499578 A GB1499578 A GB 1499578A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat transfer
- transfer structure
- circuit board
- heat
- mountings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
1499578 Cooling circuit boards SUNDSTRAND HEAT TRANSFER Inc 30 Oct 1975 [25 Nov 1974] 44838/75 Heading F4U [Also in Division H1] An assembly comprises a circuit board 10 for a digital computer and an associated heat transfer structure through which an array of terminal pins 62, 64 of the circuit board extends, the array defining rows of mountings for integrated circuit modules 28, wherein the heat transfer structure comprises a first heat transfer surface 42 abutting the board 10, a second heat transfer surface 38 for abutting, in use, the modules 28, and between the two said surfaces 38, 42, a heat pipe associated with each row of mountings: and extending along the length of the row into a cooled condenser region (30, Fig. 1). The heat transfer structure also includes a central layer 40 which, with the aid of spacer elements, defines the heat pipes. The heat pipes include longitudinal capillary grooves 44. The layers 38, 40, 42 are formed of aluminium. An insulating layer 66 surrounds each terminal pin 62, 64.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52664374A | 1974-11-25 | 1974-11-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1499578A true GB1499578A (en) | 1978-02-01 |
Family
ID=24098158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB44838/75A Expired GB1499578A (en) | 1974-11-25 | 1975-10-30 | Circuit board assembly and heat transfer structure |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5162901A (en) |
DE (1) | DE2550419A1 (en) |
FR (1) | FR2292335A1 (en) |
GB (1) | GB1499578A (en) |
IT (1) | IT1052396B (en) |
SE (1) | SE412144B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4353415A (en) | 1979-07-30 | 1982-10-12 | United Kingdom Atomic Energy Authority | Heat pipes and thermal siphons |
GB2120860A (en) * | 1981-01-12 | 1983-12-07 | Owens Illinois Inc | Environmentally protected electronic control for a glassware forming machine |
GB2199650A (en) * | 1986-12-22 | 1988-07-13 | Sundstrand Corp | Cooling electronic components |
CN100449247C (en) * | 2002-12-12 | 2009-01-07 | 索尼株式会社 | Heat transport apparatus and heat transport apparatus manufacturing method |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3305687A1 (en) * | 1983-02-18 | 1984-08-23 | Raymond E. San Diego Calif. Wiech jun. | Method for producing complex micro-circuit boards, micro-circuit substrates and micro-circuits, and substrates and micro-circuits produced according to the method |
JPS59500742A (en) * | 1983-04-27 | 1984-04-26 | ヒユ−ズ・エアクラフト・カンパニ− | Heat pipe cooling module for high power circuit boards |
FR2577349B1 (en) * | 1985-02-08 | 1987-10-09 | Sintra | SEMICONDUCTOR INTEGRATED CIRCUIT COOLING DEVICE |
DE3805851A1 (en) * | 1988-02-25 | 1989-08-31 | Standard Elektrik Lorenz Ag | CIRCUIT BOARD WITH A COOLING DEVICE |
-
1975
- 1975-09-30 JP JP50117311A patent/JPS5162901A/en active Pending
- 1975-10-27 FR FR7532786A patent/FR2292335A1/en not_active Withdrawn
- 1975-10-30 GB GB44838/75A patent/GB1499578A/en not_active Expired
- 1975-11-10 DE DE19752550419 patent/DE2550419A1/en active Pending
- 1975-11-19 SE SE7512989A patent/SE412144B/en unknown
- 1975-11-25 IT IT52381/75A patent/IT1052396B/en active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4353415A (en) | 1979-07-30 | 1982-10-12 | United Kingdom Atomic Energy Authority | Heat pipes and thermal siphons |
GB2120860A (en) * | 1981-01-12 | 1983-12-07 | Owens Illinois Inc | Environmentally protected electronic control for a glassware forming machine |
GB2199650A (en) * | 1986-12-22 | 1988-07-13 | Sundstrand Corp | Cooling electronic components |
GB2199650B (en) * | 1986-12-22 | 1990-11-14 | Sundstrand Corp | Heat dissipating mounting for electronic components |
CN100449247C (en) * | 2002-12-12 | 2009-01-07 | 索尼株式会社 | Heat transport apparatus and heat transport apparatus manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
SE7512989L (en) | 1976-05-26 |
JPS5162901A (en) | 1976-05-31 |
FR2292335A1 (en) | 1976-06-18 |
DE2550419A1 (en) | 1976-05-26 |
IT1052396B (en) | 1981-06-20 |
SE412144B (en) | 1980-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4019098A (en) | Heat pipe cooling system for electronic devices | |
US5362986A (en) | Vertical chip mount memory package with packaging substrate and memory chip pairs | |
US4765400A (en) | Circuit module with pins conducting heat from floating plate contacting heat producing device | |
US3414892A (en) | Means interconnecting printed circuit memory planes | |
US5181167A (en) | Stacking heatpipe for three dimensional electronic packaging | |
US3240628A (en) | Thermoelectric panel | |
US3812402A (en) | High density digital systems and their method of fabrication with liquid cooling for semi-conductor circuit chips | |
DE3587481D1 (en) | CIRCUIT SUBSTRATE WITH HIGH HEAT CONDUCTIVITY. | |
GB1186261A (en) | Mounting Structures for Circuit Packages and Manufacture thereof. | |
SE511425C2 (en) | Packing device for integrated circuits | |
GB1499578A (en) | Circuit board assembly and heat transfer structure | |
JPH077282A (en) | Packing equipment for circuit part | |
JPH073840B2 (en) | Semiconductor integrated circuit | |
GB1322990A (en) | Integrated circuit devices | |
US3439109A (en) | Thin film magnetic stores using printed electric circuits | |
GB1379219A (en) | Thermoelectric microgenerator | |
US3747044A (en) | Microwave integrated circuit (mic) ground plane connector | |
US3184649A (en) | Miniature circuit assembly | |
JPH01258458A (en) | Wafer integration type integrated circuit | |
GB1217148A (en) | Improvements in or relating to substrates for microelectronic components | |
JPS55115339A (en) | Ic stem | |
GB1447070A (en) | Conductor base for breadboard or prototype circuits tuning arrangements | |
GB1509142A (en) | Lead assembly | |
JPS57186350A (en) | Semiconductor integrated circuit device | |
JPS6064503A (en) | Microwave circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |