DE69925626D1 - Zum wärmeabfuhr geeignete gestapelte leiterplattenanordnung - Google Patents

Zum wärmeabfuhr geeignete gestapelte leiterplattenanordnung

Info

Publication number
DE69925626D1
DE69925626D1 DE69925626T DE69925626T DE69925626D1 DE 69925626 D1 DE69925626 D1 DE 69925626D1 DE 69925626 T DE69925626 T DE 69925626T DE 69925626 T DE69925626 T DE 69925626T DE 69925626 D1 DE69925626 D1 DE 69925626D1
Authority
DE
Germany
Prior art keywords
circuit assembly
assembly suitable
stacked circuit
heat disposal
disposal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69925626T
Other languages
English (en)
Other versions
DE69925626T2 (de
Inventor
M Smith
K Tamarkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Application granted granted Critical
Publication of DE69925626D1 publication Critical patent/DE69925626D1/de
Publication of DE69925626T2 publication Critical patent/DE69925626T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
DE69925626T 1998-10-28 1999-10-27 Zum wärmeabfuhr geeignete gestapelte leiterplattenanordnung Expired - Fee Related DE69925626T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US181448 1988-04-14
US09/181,448 US5986887A (en) 1998-10-28 1998-10-28 Stacked circuit board assembly adapted for heat dissipation
PCT/US1999/025185 WO2000025562A1 (en) 1998-10-28 1999-10-27 Stacked circuit board assembly adapted for heat dissipation

Publications (2)

Publication Number Publication Date
DE69925626D1 true DE69925626D1 (de) 2005-07-07
DE69925626T2 DE69925626T2 (de) 2006-04-27

Family

ID=22664326

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69925626T Expired - Fee Related DE69925626T2 (de) 1998-10-28 1999-10-27 Zum wärmeabfuhr geeignete gestapelte leiterplattenanordnung

Country Status (7)

Country Link
US (1) US5986887A (de)
EP (1) EP1125482B1 (de)
JP (1) JP2002528922A (de)
BR (1) BR9914860A (de)
CA (1) CA2348507A1 (de)
DE (1) DE69925626T2 (de)
WO (1) WO2000025562A1 (de)

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US7167379B2 (en) * 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
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US6845013B2 (en) 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US20040120129A1 (en) * 2002-12-24 2004-06-24 Louis Soto Multi-layer laminated structures for mounting electrical devices and method for fabricating such structures
US6831835B2 (en) * 2002-12-24 2004-12-14 Ault, Inc. Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
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US6819562B2 (en) * 2003-01-31 2004-11-16 Hewlett-Packard Development Company, L.P. Cooling apparatus for stacked components
US6771507B1 (en) 2003-01-31 2004-08-03 Hewlett-Packard Development Company, L.P. Power module for multi-chip printed circuit boards
US6816378B1 (en) * 2003-04-28 2004-11-09 Hewlett-Packard Development Company, L.P. Stack up assembly
US7408258B2 (en) * 2003-08-20 2008-08-05 Salmon Technologies, Llc Interconnection circuit and electronic module utilizing same
US20050057907A1 (en) * 2003-09-12 2005-03-17 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7345891B2 (en) * 2003-10-07 2008-03-18 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7061126B2 (en) * 2003-10-07 2006-06-13 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7180751B1 (en) * 2004-02-19 2007-02-20 Isothermal Systems Research, Inc. Input/output transition board system
US7056144B2 (en) 2004-02-19 2006-06-06 Hewlett-Packard Development Company, L.P. Offset compensation system
US20050184376A1 (en) * 2004-02-19 2005-08-25 Salmon Peter C. System in package
US7327028B2 (en) * 2004-02-24 2008-02-05 Intel Corporation Embedded heat spreader for folded stacked chip-scale package
JP2005259962A (ja) * 2004-03-11 2005-09-22 Fuji Electric Fa Components & Systems Co Ltd 整流回路の実装構造
US7193307B2 (en) * 2004-03-25 2007-03-20 Ault Incorporated Multi-layer FET array and method of fabricating
US7254036B2 (en) 2004-04-09 2007-08-07 Netlist, Inc. High density memory module using stacked printed circuit boards
GB0413420D0 (en) * 2004-06-15 2004-07-21 Radstone Technology Plc Heat management in printed wiring boards
US7064955B2 (en) * 2004-11-24 2006-06-20 Hewlett-Packard Development Company, L.P. Redundant power for processor circuit board
US7068515B2 (en) * 2004-11-24 2006-06-27 Hewlett-Packard Development Company, L.P. Multi-chip module with stacked redundant power
US7427809B2 (en) * 2004-12-16 2008-09-23 Salmon Technologies, Llc Repairable three-dimensional semiconductor subsystem
US7623349B2 (en) * 2005-03-07 2009-11-24 Ati Technologies Ulc Thermal management apparatus and method for a circuit substrate
US7586747B2 (en) * 2005-08-01 2009-09-08 Salmon Technologies, Llc. Scalable subsystem architecture having integrated cooling channels
JP2007042906A (ja) * 2005-08-04 2007-02-15 Verigy (Singapore) Pte Ltd ヒートシンク付き回路基板
US7442050B1 (en) 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
US7619893B1 (en) 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US7742310B2 (en) * 2006-09-29 2010-06-22 Hewlett-Packard Development Company, L.P. Sequencer
US7397666B2 (en) * 2006-10-25 2008-07-08 Hewlett-Packard Development Company, L.P. Wedge lock
DE102007001407B4 (de) * 2007-01-09 2016-02-25 Continental Automotive Gmbh Montageanordnung zur Fixierung übereinander angeordneter Leiterplatten in einem Gehäuse
JP4450070B2 (ja) * 2007-12-28 2010-04-14 ソニー株式会社 電子機器
DE202008003872U1 (de) * 2008-03-19 2008-05-15 Doswald, Jörg A. Gehäuseaufbau
US8018723B1 (en) 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US8498124B1 (en) 2009-12-10 2013-07-30 Universal Lighting Technologies, Inc. Magnetic circuit board stacking component
JP4818429B2 (ja) * 2009-12-28 2011-11-16 株式会社東芝 電子機器
US8625284B2 (en) * 2010-05-28 2014-01-07 Lear Corporation Printed circuit board system for automotive power converter
JP5697394B2 (ja) * 2010-09-30 2015-04-08 Ｄｏｗａメタルテック株式会社 フィン付ベース一体型基板およびフィン付ベース一体型基板装置
US8547699B1 (en) 2010-11-09 2013-10-01 Adtran, Inc. Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment
CN104854760A (zh) 2012-09-03 2015-08-19 艾布雷德斯公司 用于智能接触阵列和层叠装置的方法
US9703321B2 (en) 2013-07-09 2017-07-11 I-Blades, Inc. Snap on wearable module
US9788460B2 (en) * 2015-12-02 2017-10-10 International Business Machines Corporation Heatsink providing equivalent cooling for multiple in-line modules
WO2018057651A1 (en) * 2016-09-22 2018-03-29 Apple Inc. Thermal distribution assembly in an electronic device
FR3060202B1 (fr) * 2016-12-12 2019-07-05 Aptiv Technologies Limited Dispositif de dissipation de chaleur d'une unite de controle multimedia
JP6622785B2 (ja) * 2017-12-19 2019-12-18 ファナック株式会社 電子部品ユニット
KR102421521B1 (ko) * 2018-01-31 2022-07-15 삼성전자주식회사 적층 구조의 커넥터를 포함하는 전자 장치
EP3690934A1 (de) * 2019-02-04 2020-08-05 Siemens Aktiengesellschaft Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe
US11680927B1 (en) 2019-11-22 2023-06-20 Cypress In-Line Inspection, LLC Dual layer circuit board for sensors on a pipeline inspection tool
US20230232596A1 (en) * 2022-01-14 2023-07-20 Nio Technology (Anhui) Co., Ltd. Serviceable and accessible liquid cooled modules

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Also Published As

Publication number Publication date
US5986887A (en) 1999-11-16
WO2000025562A1 (en) 2000-05-04
DE69925626T2 (de) 2006-04-27
CA2348507A1 (en) 2000-05-04
EP1125482B1 (de) 2005-06-01
JP2002528922A (ja) 2002-09-03
EP1125482A1 (de) 2001-08-22
BR9914860A (pt) 2001-07-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee