BR8903415A - Pacote eletronico - Google Patents

Pacote eletronico

Info

Publication number
BR8903415A
BR8903415A BR898903415A BR8903415A BR8903415A BR 8903415 A BR8903415 A BR 8903415A BR 898903415 A BR898903415 A BR 898903415A BR 8903415 A BR8903415 A BR 8903415A BR 8903415 A BR8903415 A BR 8903415A
Authority
BR
Brazil
Prior art keywords
heat
substrate
heat sink
attached
chrome
Prior art date
Application number
BR898903415A
Other languages
English (en)
Inventor
Morris Anschel
Bahgat Ghaleb Sammakia
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR8903415A publication Critical patent/BR8903415A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
BR898903415A 1988-07-13 1989-07-12 Pacote eletronico BR8903415A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/218,725 US4914551A (en) 1988-07-13 1988-07-13 Electronic package with heat spreader member

Publications (1)

Publication Number Publication Date
BR8903415A true BR8903415A (pt) 1990-02-13

Family

ID=22816253

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898903415A BR8903415A (pt) 1988-07-13 1989-07-12 Pacote eletronico

Country Status (7)

Country Link
US (1) US4914551A (pt)
EP (1) EP0350593B1 (pt)
JP (1) JPH0240942A (pt)
AT (1) ATE126396T1 (pt)
BR (1) BR8903415A (pt)
CA (1) CA1287929C (pt)
DE (1) DE68923740T2 (pt)

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Also Published As

Publication number Publication date
ATE126396T1 (de) 1995-08-15
DE68923740D1 (de) 1995-09-14
JPH0240942A (ja) 1990-02-09
DE68923740T2 (de) 1996-04-18
EP0350593A3 (en) 1990-12-05
EP0350593B1 (en) 1995-08-09
US4914551A (en) 1990-04-03
EP0350593A2 (en) 1990-01-17
CA1287929C (en) 1991-08-20

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