JPS61134045A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS61134045A
JPS61134045A JP59256648A JP25664884A JPS61134045A JP S61134045 A JPS61134045 A JP S61134045A JP 59256648 A JP59256648 A JP 59256648A JP 25664884 A JP25664884 A JP 25664884A JP S61134045 A JPS61134045 A JP S61134045A
Authority
JP
Japan
Prior art keywords
resin
lead
insulator
semiconductor device
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59256648A
Other languages
English (en)
Inventor
Itsuro Adachi
安達　逸郎
Takashi Taniura
谷浦　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP59256648A priority Critical patent/JPS61134045A/ja
Publication of JPS61134045A publication Critical patent/JPS61134045A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関する。
〔従来の技術〕
従来の樹脂封止型半導体装置は、第４図に示すように、
金属１を外部引き出しリードとして樹脂封止体２より導
出して使用している。
〔発明が解決しようとする問題点〕
このため、半導体装置の組立中や選別中、または梱包運
送中等いろいろな工程で外部引き出しリードが曲がった
りねじれた９という不具合を発生し、歩留及び品質の悪
いものでめった。
本発明の目的はよシ品質の高い装置を提供することＫあ
る。
〔問題点を解決するための手段〕
本発明は、導電性金属を絶縁物で被覆したフィルム状の
外部引き出しり−ドｔ−有することを特徴とする。
〔実施例〕
第１図は本発明の一実施例を示す。外部引出リードは、
導電性金属４ｔ−絶縁物３で被覆してフィルム状に形成
されており、樹脂封止体２が導出されている。外部リー
ドの一端は、第２図に示すように半導体素子５の電柱に
ＴＡＢ型式で接続されている。
第３図は他の実施例で、これは素子５が絶縁体３上に接
着材６で接着され、さらに、素子５の電極がワイヤ７に
よって導電金属部４に接続されている。
このように、樹脂封止体２の外側の外部引き出しリード
がポリイミド等の絶縁物３でフィルム状に一体に被覆さ
れた形状、または樹脂面から導出された外部引き出しリ
ードが各樹脂面毎にフィルム状に一体に被覆された形状
を有するため、ＩＪ　＋ド曲Ｄ　＋７−ドねじれ等の不
具合はなく、品質の高い装置が得られる。
尚金属部！ｍ７にて該４を接続する場合は、第３図に限
定されず、リード４と同様に導電性金属にて半導体素子
搭載部を形成し、この搭載部に半導体素子５を搭載して
導を接続すればよい。またＴλＢにおいてに引き出しリ
ードにより４ｍ接続して形成してもよい。
〔発明の効果〕
以上のとおり本発明は従来あったリード曲りやねじれ等
の不具合をなく丁ことかでき、しかも、リードがポリイ
ミド等の絶縁物でフィルム上に形成されているためリー
ドを薄くすることができてリードに柔軟性をもたすこと
ができ安価にするとともに該装置の！！装においても自
由度が増え、実装面積も小さくすることができるという
利点もある０
【図面の簡単な説明】
第１図（Ａ）、（Ｂ）は夫々本発明の一実施例を示す上
面図および側面図、第２図は第１図の部分断面図、第３
図は他の実施例を示す部分断面図、第４図（５）。 （ハ）は夫々従来例金示す上図面、側面図である。 １：外部引き出しリード、２：封止樹脂、３：外部引き
出しリードを被覆したフィルム状の絶縁物、４：絶縁物
で被覆した円部引き出しリード、５：半導体素子、６：
ソルダー、７：ワイヤー（Ａ）　　　第１図　　（８） （△）　　　第４区　　　（Ｂ） ７　ワイ■− 第３図

Claims (1)

    【特許請求の範囲】
  1. 導電性金属を絶縁物で被覆したフィルム状の外部引き出
    しリードを有し、該リードの一端は半導体素子と導電接
    続され、半導体素子及び半導体素子との導電接続部を含
    む該引き出しリードの一部が樹脂封止されて形成されて
    いることを特徴とする樹脂封止型半導体装置。
JP59256648A 1984-12-05 1984-12-05 樹脂封止型半導体装置 Pending JPS61134045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59256648A JPS61134045A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59256648A JPS61134045A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS61134045A true JPS61134045A (ja) 1986-06-21

Family

ID=17295526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59256648A Pending JPS61134045A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS61134045A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242051A (ja) * 1985-04-19 1986-10-28 Matsushita Electronics Corp 半導体装置
JPS63258048A (ja) * 1987-04-15 1988-10-25 Mitsubishi Electric Corp 半導体装置
EP0350593A2 (en) * 1988-07-13 1990-01-17 International Business Machines Corporation Electronic package with heat spreader member
JPH03105961A (ja) * 1989-09-19 1991-05-02 Nec Corp 樹脂封止型半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242051A (ja) * 1985-04-19 1986-10-28 Matsushita Electronics Corp 半導体装置
JPS63258048A (ja) * 1987-04-15 1988-10-25 Mitsubishi Electric Corp 半導体装置
EP0350593A2 (en) * 1988-07-13 1990-01-17 International Business Machines Corporation Electronic package with heat spreader member
JPH03105961A (ja) * 1989-09-19 1991-05-02 Nec Corp 樹脂封止型半導体装置

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