BR112019010415A8 - Substratos funcionais para dispositivos eletrônicos impressos - Google Patents

Substratos funcionais para dispositivos eletrônicos impressos

Info

Publication number
BR112019010415A8
BR112019010415A8 BR112019010415A BR112019010415A BR112019010415A8 BR 112019010415 A8 BR112019010415 A8 BR 112019010415A8 BR 112019010415 A BR112019010415 A BR 112019010415A BR 112019010415 A BR112019010415 A BR 112019010415A BR 112019010415 A8 BR112019010415 A8 BR 112019010415A8
Authority
BR
Brazil
Prior art keywords
printed electronic
substrate component
functional
functional substrate
electronic devices
Prior art date
Application number
BR112019010415A
Other languages
English (en)
Other versions
BR112019010415A2 (pt
Inventor
J Foster Ian
Original Assignee
Avery Dennison Retail Information Services Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Retail Information Services Llc filed Critical Avery Dennison Retail Information Services Llc
Publication of BR112019010415A2 publication Critical patent/BR112019010415A2/pt
Publication of BR112019010415A8 publication Critical patent/BR112019010415A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A presente invenção refere-se a um dispositivo de circuito, formado a partir de um substrato funcional. O dispositivo de circuito (100) compreende um componente de substrato funcional (104) e elementos eletrônicos impressos (102) formados no componente do substrato funcional. Os elementos eletrônicos impressos, formados no componente de substrato funcional, interagem com o componente do substrato, para realizar uma função, e para modificar o componente do substrato funcional. O dispositivo de circuito tipicamente necessita de um material de base passivo (106) que não tira a parte funcional na operação do dispositivo exceto suporte mecânico.
BR112019010415A 2016-12-01 2017-12-01 Substratos funcionais para dispositivos eletrônicos impressos BR112019010415A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662428878P 2016-12-01 2016-12-01
PCT/US2017/064184 WO2018102666A1 (en) 2016-12-01 2017-12-01 Functional substrates for printed electronic devices

Publications (2)

Publication Number Publication Date
BR112019010415A2 BR112019010415A2 (pt) 2019-09-03
BR112019010415A8 true BR112019010415A8 (pt) 2023-02-28

Family

ID=60923890

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019010415A BR112019010415A8 (pt) 2016-12-01 2017-12-01 Substratos funcionais para dispositivos eletrônicos impressos

Country Status (5)

Country Link
US (2) US10660205B2 (pt)
EP (1) EP3549131A1 (pt)
CN (1) CN109983537A (pt)
BR (1) BR112019010415A8 (pt)
WO (1) WO2018102666A1 (pt)

Family Cites Families (33)

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JPH07147035A (ja) * 1993-11-22 1995-06-06 Hitachi Maxell Ltd 情報記録媒体およびその製造方法
JP2000113152A (ja) * 1998-10-05 2000-04-21 Hitachi Maxell Ltd 非接触メモリ素子を内蔵した磁気ストライプテープ及びそれを利用して製造されたｉｃカード及びｉｃタグ
US6483225B1 (en) * 2000-07-05 2002-11-19 Acuson Corporation Ultrasound transducer and method of manufacture thereof
JP2002290182A (ja) * 2001-03-27 2002-10-04 Sumitomo Electric Ind Ltd 表面弾性波素子用基板の製造方法
JP2003163459A (ja) 2001-11-26 2003-06-06 Sony Corp 高周波回路ブロック体及びその製造方法、高周波モジュール装置及びその製造方法。
US6873529B2 (en) * 2002-02-26 2005-03-29 Kyocera Corporation High frequency module
US7105980B2 (en) 2002-07-03 2006-09-12 Sawtek, Inc. Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics
US7230512B1 (en) 2003-08-19 2007-06-12 Triquint, Inc. Wafer-level surface acoustic wave filter package with temperature-compensating characteristics
US7309392B2 (en) 2003-11-25 2007-12-18 Sumitomo Metal Mining Co., Ltd. Lithium niobate substrate and method of producing the same
US7152804B1 (en) 2004-03-15 2006-12-26 Kovlo, Inc. MOS electronic article surveillance, RF and/or RF identification tag/device, and methods for making and using the same
JP4604743B2 (ja) 2005-02-01 2011-01-05 セイコーエプソン株式会社 機能性基板の製造方法、機能性基板、微細パターンの形成方法、導電膜配線、電子光学装置および電子機器
JP2006238014A (ja) * 2005-02-24 2006-09-07 Kyocera Corp 弾性表面波素子実装基板及びそれを用いた高周波モジュール、通信機器
GB0511460D0 (en) 2005-06-06 2005-07-13 Univ Liverpool Process
US7243544B2 (en) * 2005-06-16 2007-07-17 Honeywell International Inc. Passive and wireless acoustic wave accelerometer
JP4686342B2 (ja) 2005-11-30 2011-05-25 株式会社日立メディアエレクトロニクス 弾性表面波装置及びこれを搭載した通信端末。
DE102005063283A1 (de) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Elektronisches Modul
US7408286B1 (en) 2007-01-17 2008-08-05 Rf Micro Devices, Inc. Piezoelectric substrate for a saw device
US7683323B2 (en) 2007-03-20 2010-03-23 The Trustees Of Columbia University In The City Of New York Organic field effect transistor systems and methods
KR100934957B1 (ko) * 2008-02-22 2010-01-06 한국과학기술연구원 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법
US8957484B2 (en) 2008-02-29 2015-02-17 University Of Washington Piezoelectric substrate, fabrication and related methods
JP2010259000A (ja) * 2009-04-28 2010-11-11 Murata Mfg Co Ltd 弾性表面波素子の製造方法
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Also Published As

Publication number Publication date
US11665823B2 (en) 2023-05-30
BR112019010415A2 (pt) 2019-09-03
US20180160535A1 (en) 2018-06-07
CN109983537A (zh) 2019-07-05
WO2018102666A1 (en) 2018-06-07
US10660205B2 (en) 2020-05-19
EP3549131A1 (en) 2019-10-09
US20200281077A1 (en) 2020-09-03

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: AVERY DENNISON RETAIL INFORMATION SERVICES LLC (US)

B25G Requested change of headquarter approved

Owner name: AVERY DENNISON RETAIL INFORMATION SERVICES LLC (US)

B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements