BR0113504A - Solução de resina de poliamidaimida e seu uso para preparar esmaltes para fios - Google Patents

Solução de resina de poliamidaimida e seu uso para preparar esmaltes para fios

Info

Publication number
BR0113504A
BR0113504A BR0113504-0A BR0113504A BR0113504A BR 0113504 A BR0113504 A BR 0113504A BR 0113504 A BR0113504 A BR 0113504A BR 0113504 A BR0113504 A BR 0113504A
Authority
BR
Brazil
Prior art keywords
resin solution
wire enamels
polyamideimide resin
prepare wire
polyamideimide
Prior art date
Application number
BR0113504-0A
Other languages
English (en)
Other versions
BR0113504B1 (pt
Inventor
Sascha Toedter-Koenig
Klaus-Wilhelm Lienert
Gerold Schmidt
Original Assignee
Schenectady Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schenectady Int Inc filed Critical Schenectady Int Inc
Publication of BR0113504A publication Critical patent/BR0113504A/pt
Publication of BR0113504B1 publication Critical patent/BR0113504B1/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2904Staple length fiber
    • Y10T428/2907Staple length fiber with coating or impregnation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/2933Coated or with bond, impregnation or core
    • Y10T428/2964Artificial fiber or filament
    • Y10T428/2967Synthetic resin or polymer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/2933Coated or with bond, impregnation or core
    • Y10T428/2964Artificial fiber or filament
    • Y10T428/2967Synthetic resin or polymer
    • Y10T428/2969Polyamide, polyimide or polyester

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Organic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Artificial Filaments (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)

Abstract

"SOLUçãO DE RESINA DE POLIAMIDAIMIDA E SEU USO PARA PREPARAR ESMALTES PARA FIOS". A presente invenção refere-se a uma solução de resina de poliamidaimida preparável através de reação de (a) ácidos policarboxílicos aromáticos e/ou seus anidridos com (b) componentes de formação de amida e imida aromáticas em cresol em temperaturas acima de 170<198>C, ao uso dessa solução de poliamidaimida para a preparação de esmaltes para fios, aos esmaltes para fios em questão e aos fios esmaltados revestidos com os mesmos.
BRPI0113504-0A 2000-08-25 2001-08-27 soluÇço de resina de poliamidaimida, seu uso para preparar esmaltes para fios, esmalte para fios e uso do mesmo, bem como fio esmaltado e seu processo de produÇço. BR0113504B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10041943A DE10041943A1 (de) 2000-08-25 2000-08-25 Polyamidimidharzlösung und ihre Verwendung zur Herstellung von Drahtlacken
PCT/EP2001/009841 WO2002016476A1 (de) 2000-08-25 2001-08-27 Polyamidimidharzlösung und ihre verwendung zur herstellung von drahtlacken

Publications (2)

Publication Number Publication Date
BR0113504A true BR0113504A (pt) 2003-07-08
BR0113504B1 BR0113504B1 (pt) 2011-06-14

Family

ID=7653860

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0113504-0A BR0113504B1 (pt) 2000-08-25 2001-08-27 soluÇço de resina de poliamidaimida, seu uso para preparar esmaltes para fios, esmalte para fios e uso do mesmo, bem como fio esmaltado e seu processo de produÇço.

Country Status (15)

Country Link
US (1) US7122244B2 (pt)
EP (1) EP1311588B1 (pt)
JP (1) JP2004506796A (pt)
KR (1) KR20030029845A (pt)
CN (1) CN1244611C (pt)
AT (1) ATE345360T1 (pt)
AU (1) AU8590701A (pt)
BR (1) BR0113504B1 (pt)
CA (1) CA2420314C (pt)
DE (2) DE10041943A1 (pt)
ES (1) ES2275720T3 (pt)
MX (1) MXPA03001629A (pt)
TW (1) TW574264B (pt)
WO (1) WO2002016476A1 (pt)
ZA (1) ZA200301452B (pt)

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KR100483712B1 (ko) * 2001-12-19 2005-04-18 엘에스전선 주식회사 에나멜 동선 피복용 폴리아미드이미드 중합체 및 이를이용한 에나멜 동선의 제조 방법
KR20040009235A (ko) * 2002-07-23 2004-01-31 정학기 폴리아미드를 도입하여 금속에 대한 폴리아미드이미드의접착력을 향상시킨 폴리아미드이미드아미드 공중합체제조방법
DE10303635A1 (de) * 2003-01-30 2004-12-02 Altana Electrical Insulation Gmbh Verfahren zur Herstellung lagerstabiler Polyamidimid-Harze und Überzugsmittel, die diese enthalten
KR100627508B1 (ko) 2005-02-21 2006-09-22 엘에스전선 주식회사 에나멜 전선 피복도료 조성물 및 이를 이용한 에나멜 전선
KR100679369B1 (ko) 2005-02-21 2007-02-05 엘에스전선 주식회사 에나멜 전선 피복도료 조성물 및 이를 이용한 에나멜 전선
WO2006112568A1 (en) * 2005-02-21 2006-10-26 Ls Cable Ltd. Enamel vanish composition for enamel wire and enamel wire using the same
JP4542463B2 (ja) * 2005-04-25 2010-09-15 日立マグネットワイヤ株式会社 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法
SG173327A1 (en) * 2006-07-04 2011-08-29 Sumitomo Electric Industries Heat-resistant resin varnish, heat-resistant resin films, heat-resistant resin composites, and insulated wire
EP1983022A1 (en) * 2007-04-16 2008-10-22 Altana Electrical Insulation GmbH Nano-modified wire enamels and enamelled wires thereof
JP5365899B2 (ja) * 2008-06-04 2013-12-11 日立金属株式会社 ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線
CN102190955A (zh) * 2011-04-06 2011-09-21 丹阳四达化工有限公司 一种混合溶剂制备聚酰胺酰亚胺漆包线漆的方法
CN102592752B (zh) * 2012-03-27 2014-06-18 江西德源欣茂铜业有限公司 一种单涂层漆包线的生产方法
CN103050189A (zh) * 2012-12-25 2013-04-17 天津精达里亚特种漆包线有限公司 自粘性电磁线的生产方法
CN104449527A (zh) * 2013-09-16 2015-03-25 丹阳四达化工有限公司 一种漆包线用粘结剂的制备方法
CN104449526A (zh) * 2013-09-16 2015-03-25 丹阳四达化工有限公司 一种附着力强的漆包线用粘结剂的制备方法
CN104992784A (zh) * 2015-06-29 2015-10-21 深圳市沃尔核材股份有限公司 一种芳纶漆包线及其生产方法
CN105244090A (zh) * 2015-10-30 2016-01-13 陈胜民 漆包多路并列并行平行组合高效节能漆包线及其制造使用方法
CN106098198A (zh) * 2016-08-15 2016-11-09 常州百富电子有限公司 聚氨酯漆包线
KR102053932B1 (ko) 2016-09-13 2019-12-09 주식회사 엘지화학 폴리이미드계 블록 공중합체 및 이를 포함하는 폴리이미드계 필름
CN106782919B (zh) * 2017-01-18 2018-08-14 四川大学 漆包线及其制造方法
JP2023542189A (ja) * 2020-09-22 2023-10-05 エランタス ヨーロッパ ソシエタ ア レスポンサビリタ リミタータ ポリアミドイミドを含有するワイヤエナメル組成物

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Also Published As

Publication number Publication date
US7122244B2 (en) 2006-10-17
WO2002016476A8 (de) 2003-12-18
ZA200301452B (en) 2004-03-08
CA2420314A1 (en) 2003-02-20
DE50111460D1 (de) 2006-12-28
CN1449424A (zh) 2003-10-15
BR0113504B1 (pt) 2011-06-14
EP1311588A1 (de) 2003-05-21
DE10041943A1 (de) 2002-03-14
MXPA03001629A (es) 2004-09-10
ES2275720T3 (es) 2007-06-16
ATE345360T1 (de) 2006-12-15
CN1244611C (zh) 2006-03-08
KR20030029845A (ko) 2003-04-16
CA2420314C (en) 2009-11-03
EP1311588B1 (de) 2006-11-15
JP2004506796A (ja) 2004-03-04
AU8590701A (en) 2002-03-04
TW574264B (en) 2004-02-01
WO2002016476A1 (de) 2002-02-28
US20040006174A1 (en) 2004-01-08

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B06A Patent application procedure suspended [chapter 6.1 patent gazette]
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