AU6246399A - Method of plasma etching dielectric materials - Google Patents

Method of plasma etching dielectric materials

Info

Publication number
AU6246399A
AU6246399A AU62463/99A AU6246399A AU6246399A AU 6246399 A AU6246399 A AU 6246399A AU 62463/99 A AU62463/99 A AU 62463/99A AU 6246399 A AU6246399 A AU 6246399A AU 6246399 A AU6246399 A AU 6246399A
Authority
AU
Australia
Prior art keywords
plasma etching
dielectric materials
etching dielectric
materials
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU62463/99A
Other languages
English (en)
Inventor
Roger F. Lindquist
Helen Zhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU6246399A publication Critical patent/AU6246399A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AU62463/99A 1998-09-30 1999-09-24 Method of plasma etching dielectric materials Abandoned AU6246399A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09163301 1998-09-30
US09/163,301 US6297163B1 (en) 1998-09-30 1998-09-30 Method of plasma etching dielectric materials
PCT/US1999/020888 WO2000019506A1 (en) 1998-09-30 1999-09-24 Method of plasma etching dielectric materials

Publications (1)

Publication Number Publication Date
AU6246399A true AU6246399A (en) 2000-04-17

Family

ID=22589392

Family Applications (1)

Application Number Title Priority Date Filing Date
AU62463/99A Abandoned AU6246399A (en) 1998-09-30 1999-09-24 Method of plasma etching dielectric materials

Country Status (7)

Country Link
US (1) US6297163B1 (enExample)
EP (1) EP1121714A1 (enExample)
JP (1) JP4499289B2 (enExample)
KR (1) KR20010082216A (enExample)
AU (1) AU6246399A (enExample)
TW (1) TW584672B (enExample)
WO (1) WO2000019506A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
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US6518591B1 (en) * 1998-12-02 2003-02-11 Cypress Semiconductor Corporation Contact monitor, method of forming same and method of analizing contact-, via- and/or trench-forming processes in an integrated circuit
TW434816B (en) * 1998-12-28 2001-05-16 Asahi Chemical Micro Syst Method for forming contact hole
US6797189B2 (en) 1999-03-25 2004-09-28 Hoiman (Raymond) Hung Enhancement of silicon oxide etch rate and nitride selectivity using hexafluorobutadiene or other heavy perfluorocarbon
US6251770B1 (en) * 1999-06-30 2001-06-26 Lam Research Corp. Dual-damascene dielectric structures and methods for making the same
US6749763B1 (en) * 1999-08-02 2004-06-15 Matsushita Electric Industrial Co., Ltd. Plasma processing method
US20050158666A1 (en) * 1999-10-15 2005-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Lateral etch inhibited multiple etch method for etching material etchable with oxygen containing plasma
JP3586605B2 (ja) * 1999-12-21 2004-11-10 Ｎｅｃエレクトロニクス株式会社 シリコン窒化膜のエッチング方法及び半導体装置の製造方法
US6432318B1 (en) * 2000-02-17 2002-08-13 Applied Materials, Inc. Dielectric etch process reducing striations and maintaining critical dimensions
US7931820B2 (en) * 2000-09-07 2011-04-26 Daikin Industries, Ltd. Dry etching gas and method for dry etching
KR100379976B1 (ko) * 2000-11-27 2003-04-16 삼성전자주식회사 실리콘 산화물 식각용 가스 조성물 및 이를 사용한 실리콘산화물의 식각 방법
CN1249788C (zh) * 2000-12-21 2006-04-05 东京毅力科创株式会社 绝缘膜的蚀刻方法
KR100434312B1 (ko) * 2000-12-21 2004-06-05 주식회사 하이닉스반도체 반도체 소자의 콘택홀 형성 방법
US6740593B2 (en) * 2002-01-25 2004-05-25 Micron Technology, Inc. Semiconductor processing methods utilizing low concentrations of reactive etching components
US6593232B1 (en) 2002-07-05 2003-07-15 Taiwan Semiconductor Manufacturing Co., Ltd Plasma etch method with enhanced endpoint detection
US6838012B2 (en) 2002-10-31 2005-01-04 Lam Research Corporation Methods for etching dielectric materials
US7083903B2 (en) * 2003-06-17 2006-08-01 Lam Research Corporation Methods of etching photoresist on substrates
US6949469B1 (en) 2003-12-16 2005-09-27 Lam Research Corporation Methods and apparatus for the optimization of photo resist etching in a plasma processing system
US7504340B1 (en) * 2004-06-14 2009-03-17 National Semiconductor Corporation System and method for providing contact etch selectivity using RIE lag dependence on contact aspect ratio
US20070287301A1 (en) 2006-03-31 2007-12-13 Huiwen Xu Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics
TWI424498B (zh) * 2006-03-31 2014-01-21 Applied Materials Inc 用以改良介電薄膜之階梯覆蓋與圖案負載的方法
DE112007002810T5 (de) * 2007-01-05 2009-11-12 Nxp B.V. Ätzverfahren mit verbesserter Kontrolle der kritischen Ausdehnung eines Strukturelements an der Unterseite dicker Schichten
US7985681B2 (en) * 2007-06-22 2011-07-26 Micron Technology, Inc. Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconductor device
US8603363B1 (en) * 2012-06-20 2013-12-10 Praxair Technology, Inc. Compositions for extending ion source life and improving ion source performance during carbon implantation
JP2014007270A (ja) * 2012-06-25 2014-01-16 Tokyo Electron Ltd エッチング方法及びエッチング装置
CN103824767B (zh) * 2012-11-16 2017-05-17 中微半导体设备(上海)有限公司 一种深硅通孔的刻蚀方法
JP6557642B2 (ja) * 2016-09-05 2019-08-07 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013400A (en) 1990-01-30 1991-05-07 General Signal Corporation Dry etch process for forming champagne profiles, and dry etch apparatus
US5021121A (en) 1990-02-16 1991-06-04 Applied Materials, Inc. Process for RIE etching silicon dioxide
US5013398A (en) 1990-05-29 1991-05-07 Micron Technology, Inc. Anisotropic etch method for a sandwich structure
US5022958A (en) 1990-06-27 1991-06-11 At&T Bell Laboratories Method of etching for integrated circuits with planarized dielectric
US6171974B1 (en) * 1991-06-27 2001-01-09 Applied Materials, Inc. High selectivity oxide etch process for integrated circuit structures
US6238588B1 (en) * 1991-06-27 2001-05-29 Applied Materials, Inc. High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process
US5269879A (en) 1991-10-16 1993-12-14 Lam Research Corporation Method of etching vias without sputtering of underlying electrically conductive layer
JPH06188229A (ja) * 1992-12-16 1994-07-08 Tokyo Electron Yamanashi Kk エッチングの後処理方法
JP3271359B2 (ja) * 1993-02-25 2002-04-02 ソニー株式会社 ドライエッチング方法
JP3252518B2 (ja) * 1993-03-19 2002-02-04 ソニー株式会社 ドライエッチング方法
US5770098A (en) 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
KR100264445B1 (ko) 1993-10-04 2000-11-01 히가시 데쓰로 플라즈마처리장치
JPH07161702A (ja) 1993-10-29 1995-06-23 Applied Materials Inc 酸化物のプラズマエッチング方法
US5736457A (en) 1994-12-09 1998-04-07 Sematech Method of making a damascene metallization
JP3778299B2 (ja) 1995-02-07 2006-05-24 東京エレクトロン株式会社 プラズマエッチング方法
US5626716A (en) 1995-09-29 1997-05-06 Lam Research Corporation Plasma etching of semiconductors
US5843847A (en) * 1996-04-29 1998-12-01 Applied Materials, Inc. Method for etching dielectric layers with high selectivity and low microloading
JP3319285B2 (ja) * 1996-06-05 2002-08-26 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JP3862035B2 (ja) * 1996-07-17 2006-12-27 ソニー株式会社 半導体装置およびその製造方法
JP3997494B2 (ja) * 1996-09-17 2007-10-24 ソニー株式会社 半導体装置
EP0945896B1 (en) * 1996-10-11 2005-08-10 Tokyo Electron Limited Plasma etching method
JP3713869B2 (ja) * 1997-02-17 2005-11-09 ソニー株式会社 半導体装置の製造方法
US5972235A (en) * 1997-02-28 1999-10-26 Candescent Technologies Corporation Plasma etching using polycarbonate mask and low pressure-high density plasma
US5780338A (en) 1997-04-11 1998-07-14 Vanguard International Semiconductor Corporation Method for manufacturing crown-shaped capacitors for dynamic random access memory integrated circuits
GB9712019D0 (en) * 1997-06-09 1997-08-06 Northern Telecom Ltd Eye measurement of optical sampling
US6051504A (en) 1997-08-15 2000-04-18 International Business Machines Corporation Anisotropic and selective nitride etch process for high aspect ratio features in high density plasma

Also Published As

Publication number Publication date
JP2002526919A (ja) 2002-08-20
KR20010082216A (ko) 2001-08-29
WO2000019506A1 (en) 2000-04-06
TW584672B (en) 2004-04-21
JP4499289B2 (ja) 2010-07-07
WO2000019506A9 (en) 2000-08-31
US6297163B1 (en) 2001-10-02
EP1121714A1 (en) 2001-08-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase