AU2001247879A1 - Emi and rfi shielding for printed circuit boards - Google Patents

Emi and rfi shielding for printed circuit boards

Info

Publication number
AU2001247879A1
AU2001247879A1 AU2001247879A AU4787901A AU2001247879A1 AU 2001247879 A1 AU2001247879 A1 AU 2001247879A1 AU 2001247879 A AU2001247879 A AU 2001247879A AU 4787901 A AU4787901 A AU 4787901A AU 2001247879 A1 AU2001247879 A1 AU 2001247879A1
Authority
AU
Australia
Prior art keywords
emi
printed circuit
circuit boards
rfi shielding
rfi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247879A
Other languages
English (en)
Inventor
Rocky R. Arnold
Jesus Al Ortiz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shielding for Electronics Inc
Original Assignee
Shielding for Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shielding for Electronics Inc filed Critical Shielding for Electronics Inc
Publication of AU2001247879A1 publication Critical patent/AU2001247879A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AU2001247879A 2000-04-21 2001-03-28 Emi and rfi shielding for printed circuit boards Abandoned AU2001247879A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US19876900P 2000-04-21 2000-04-21
US60198769 2000-04-21
US20326300P 2000-05-09 2000-05-09
US60203263 2000-05-09
US09788263 2001-02-16
US09/788,263 US20010033478A1 (en) 2000-04-21 2001-02-16 EMI and RFI shielding for printed circuit boards
PCT/US2001/010119 WO2001082672A1 (en) 2000-04-21 2001-03-28 Emi and rfi shielding for printed circuit boards

Publications (1)

Publication Number Publication Date
AU2001247879A1 true AU2001247879A1 (en) 2001-11-07

Family

ID=27393930

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247879A Abandoned AU2001247879A1 (en) 2000-04-21 2001-03-28 Emi and rfi shielding for printed circuit boards

Country Status (4)

Country Link
US (1) US20010033478A1 (zh)
CN (1) CN100403864C (zh)
AU (1) AU2001247879A1 (zh)
WO (1) WO2001082672A1 (zh)

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028305A1 (en) * 1999-10-12 2001-04-19 Shielding For Electronics, Inc. Emi containment apparatus
AUPR245201A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus and method (WSM05)
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US6807731B2 (en) * 2002-04-02 2004-10-26 Delphi Technologies, Inc. Method for forming an electronic assembly
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
AU2003267260A1 (en) 2002-09-17 2004-04-08 Shielding For Electronics Equipment and methods for producing continuous metallized thermoformable emi shielding material
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
CN100454533C (zh) * 2003-04-15 2009-01-21 波零公司 用于电子元件封装的emi屏蔽
KR100671739B1 (ko) * 2003-10-31 2007-01-22 장상호 증착지그를 이용한 휴대폰 외장케이스의 이엠아이층진공증착방법 및 지그
KR100589370B1 (ko) * 2003-11-26 2006-06-14 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100579516B1 (ko) * 2003-11-28 2006-05-15 삼성전자주식회사 화상형성장치의 기판커버유닛
FI117257B (fi) * 2003-12-15 2006-08-15 Nokia Corp Menetelmä ja järjestely komponentin suojaamiseksi sähköstaattisilta häiriöiltä
CN1314308C (zh) * 2004-01-16 2007-05-02 华硕电脑股份有限公司 电子装置及其遮蔽元件
US20080112151A1 (en) 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US8399972B2 (en) 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US7147384B2 (en) * 2004-03-26 2006-12-12 3M Innovative Properties Company Small form factor optical connector with thermoplastic adhesive
SG118244A1 (en) * 2004-04-23 2006-01-27 Mi Holdings Pte Ltd Radio-frequency and electro-magnetic isolation forcover and isolated cover
FR2870429B1 (fr) * 2004-05-11 2006-07-28 Sagem Dispositif de blindage pour module electronique radioelectrique
KR100565324B1 (ko) * 2004-05-15 2006-03-30 엘지전자 주식회사 이동통신 단말기용 카메라의 에프피시비
US7353059B2 (en) * 2004-06-18 2008-04-01 Medtronic, Inc. Medical device with low EMI leakage
JP2006087523A (ja) 2004-09-21 2006-04-06 Olympus Corp 電子装置および被検体内導入システム
US7550679B1 (en) * 2004-11-30 2009-06-23 Mark Wershoven Active electromagnetic filter
US6958445B1 (en) * 2004-12-16 2005-10-25 Hewlett-Packard Development Company, L.P. Electromagnetic interference shield for electronic devices on a circuit board
TWI270341B (en) * 2005-03-02 2007-01-01 Cateron Technology Co Ltd Electronic assembly unit with conductive film, conductive film and method of making the same thereof
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
KR101156333B1 (ko) 2005-07-25 2012-06-13 엘지전자 주식회사 휴대용 단말기에 내장되는 연성회로기판 및 그 제조 방법
ATE397310T1 (de) * 2005-11-01 2008-06-15 Black & Decker Inc Kodiereinheit mit widerständen für einen kabelbaum
US20070119620A1 (en) * 2005-11-29 2007-05-31 Rodriguez Jose F Flexible circuit shields
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
US20080170379A1 (en) * 2007-01-12 2008-07-17 Suresh Basoor Optical Receiver Having Improved Shielding
US7965520B2 (en) * 2007-01-22 2011-06-21 Sony Ericsson Mobile Communications Ab Electronic device with flip module having low height
EP2043149A1 (en) * 2007-09-27 2009-04-01 Oticon A/S Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use
US8022511B2 (en) 2008-02-05 2011-09-20 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8350367B2 (en) 2008-02-05 2013-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7989928B2 (en) 2008-02-05 2011-08-02 Advanced Semiconductor Engineering Inc. Semiconductor device packages with electromagnetic interference shielding
US8212339B2 (en) 2008-02-05 2012-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7633015B2 (en) * 2008-03-31 2009-12-15 Apple Inc. Conforming, electro-magnetic interference reducing cover for circuit components
US7759168B2 (en) * 2008-05-13 2010-07-20 International Business Machines Corporation Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid
US8525045B2 (en) * 2008-06-26 2013-09-03 U-Tec Corporation Faraday cage and device having same
US7638717B1 (en) * 2008-08-06 2009-12-29 Apple Inc. Can spring housing contact
US8410584B2 (en) 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
CN102077700B (zh) * 2008-08-19 2014-03-26 株式会社村田制作所 电路模块及其制造方法
US8126170B2 (en) * 2008-09-05 2012-02-28 Apple Inc. Electromagnetic interference shields with piezos
US8265329B2 (en) * 2008-09-05 2012-09-11 Apple Inc. Compact housing for portable electronic device with internal speaker
US20100110656A1 (en) 2008-10-31 2010-05-06 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
JP2010177520A (ja) * 2009-01-30 2010-08-12 Toshiba Corp 電子回路モジュールおよびその製造方法
US8110902B2 (en) 2009-02-19 2012-02-07 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8071893B2 (en) 2009-03-04 2011-12-06 Apple Inc. Methods and apparatus for shielding circuitry from interference
US20100246143A1 (en) * 2009-03-26 2010-09-30 Richard Hung Minh Dinh Electromagnetic Interference Shielding for Compact Electronic Devices
US20120012382A1 (en) * 2009-05-13 2012-01-19 Laird Technologies, Inc. Conductive Films for EMI Shielding Applications
CN101901799A (zh) * 2009-05-25 2010-12-01 晟铭电子科技股份有限公司 集成电路封装结构及封装方法
US8212340B2 (en) 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US7944029B2 (en) * 2009-09-16 2011-05-17 Sandisk Corporation Non-volatile memory with reduced mobile ion diffusion
CN102045993B (zh) * 2009-10-22 2012-08-22 环旭电子股份有限公司 防电磁波干扰的电路模块及其制造方法
US8368185B2 (en) 2009-11-19 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8030750B2 (en) 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8378466B2 (en) 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
US20110255250A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
US8659359B2 (en) 2010-04-22 2014-02-25 Freescale Semiconductor, Inc. RF power transistor circuit
TWI388248B (zh) * 2010-06-25 2013-03-01 Pegatron Corp 電子裝置
TWI540698B (zh) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 半導體封裝件與其製造方法
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US8513541B2 (en) 2011-01-21 2013-08-20 Remy Technologies, L.L.C. Method of blocking electro-magnetic interference (EMI) in an electric machine and apparatus
KR101248820B1 (ko) 2011-02-18 2013-04-01 주식회사 파인테크닉스 엘이디 등기구용 전자기파 차단장치
CN102709274B (zh) * 2011-03-28 2016-06-29 环旭电子股份有限公司 集成电路基板的电磁干扰屏蔽结构与其制造方法
CN102738052B (zh) * 2011-04-13 2014-08-13 群登科技股份有限公司 一种工具以及使用了该工具的电子元件镀膜方法
TWI593324B (zh) 2011-04-28 2017-07-21 鐘化股份有限公司 新穎導電層一體型可撓性印刷基板
WO2012155432A1 (zh) * 2011-09-23 2012-11-22 中兴通讯股份有限公司 一种电子通信设备系统及电磁屏蔽装置
EP2820929A4 (en) * 2012-03-01 2015-09-30 Autoliv Dev ELECTRONIC UNIT WITH PCB AND TWO PARTS OF HOUSING
US20130260823A1 (en) * 2012-03-31 2013-10-03 Ashutosh Y. Shukla Compact Portable Electronic Device Having Augmented Back Volume for Speaker
US8704341B2 (en) 2012-05-15 2014-04-22 Advanced Semiconductor Engineering, Inc. Semiconductor packages with thermal dissipation structures and EMI shielding
TW201351599A (zh) * 2012-06-04 2013-12-16 矽品精密工業股份有限公司 半導體封裝件及其製法
US8653634B2 (en) 2012-06-11 2014-02-18 Advanced Semiconductor Engineering, Inc. EMI-shielded semiconductor devices and methods of making
KR101375956B1 (ko) * 2012-07-05 2014-03-18 엘에스산전 주식회사 자동차용 전장부품 박스
CN102779811B (zh) * 2012-07-20 2015-02-04 华为技术有限公司 一种芯片封装及封装方法
US9281283B2 (en) 2012-09-12 2016-03-08 Freescale Semiconductor, Inc. Semiconductor devices with impedance matching-circuits
WO2014046058A1 (ja) * 2012-09-20 2014-03-27 ローム株式会社 パワーモジュール半導体装置およびインバータ装置、およびパワーモジュール半導体装置の製造方法、および金型
US9048124B2 (en) * 2012-09-20 2015-06-02 Apple Inc. Heat sinking and electromagnetic shielding structures
US9250651B2 (en) 2013-04-24 2016-02-02 Google Technology Holdings LLC Electronic device with folded display
US10061732B2 (en) * 2013-05-15 2018-08-28 Tactotek Oy Enabling arrangement for an electronic device with housing-integrated functionalities and method therefor
CN105409056B (zh) * 2013-10-01 2019-08-02 维宁尔美国公司 紧凑型屏蔽的车载雷达模块和方法
US9564937B2 (en) 2013-11-05 2017-02-07 Skyworks Solutions, Inc. Devices and methods related to packaging of radio-frequency devices on ceramic substrates
US10070547B2 (en) * 2014-02-26 2018-09-04 Sparton Corporation Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
US20150245548A1 (en) * 2014-02-26 2015-08-27 Sparton Corporation Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
CN103916577B (zh) * 2014-03-24 2018-06-15 南昌欧菲光电技术有限公司 静电导电元件及具有该静电导电元件的摄像模组
CN103889198A (zh) * 2014-04-16 2014-06-25 曾芳勤 屏蔽罩及其制备方法
WO2015158008A1 (zh) * 2014-04-18 2015-10-22 华为终端有限公司 一种屏蔽膜、屏蔽电路板及终端设备
US9521741B1 (en) 2014-06-04 2016-12-13 Amazon Technologies, Inc. Side surface mounting of shields for a circuit board assembly
DE112015002947A5 (de) 2014-06-23 2017-03-16 Epcos Ag Gehäuse für ein elektrisches Bauelement und Verfahren zur Herstellung eines Gehäuses für ein elektrisches Bauelement
US9438184B2 (en) 2014-06-27 2016-09-06 Freescale Semiconductor, Inc. Integrated passive device assemblies for RF amplifiers, and methods of manufacture thereof
CN104202955B (zh) * 2014-08-15 2019-05-28 潍柴动力股份有限公司 一种提高电路电磁兼容性的装置
WO2016111512A1 (en) 2015-01-09 2016-07-14 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
WO2016144039A1 (en) 2015-03-06 2016-09-15 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10432152B2 (en) 2015-05-22 2019-10-01 Nxp Usa, Inc. RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
CN106376169A (zh) * 2015-07-24 2017-02-01 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
WO2017031229A1 (en) * 2015-08-20 2017-02-23 3M Innovative Properties Company Flexible electrically conductive bonding films
US9571044B1 (en) 2015-10-21 2017-02-14 Nxp Usa, Inc. RF power transistors with impedance matching circuits, and methods of manufacture thereof
US9692363B2 (en) 2015-10-21 2017-06-27 Nxp Usa, Inc. RF power transistors with video bandwidth circuits, and methods of manufacture thereof
US10477737B2 (en) * 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US10080317B2 (en) 2016-06-29 2018-09-18 Microsoft Technology Licensing, Llc Polymeric electromagnetic shield for electronic components
US10477687B2 (en) * 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
KR102551657B1 (ko) 2016-12-12 2023-07-06 삼성전자주식회사 전자파 차폐구조 및 그 제조방법
US20180190593A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Conductive adhesive layer for semiconductor devices and packages
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
CN109390175B (zh) * 2017-08-04 2020-06-23 神讯电脑(昆山)有限公司 立体电路膜、其按键及其制造方法
KR102373931B1 (ko) 2017-09-08 2022-03-14 삼성전자주식회사 전자파 차폐구조
US10834827B2 (en) * 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap
JP2019091866A (ja) * 2017-11-17 2019-06-13 東洋インキＳｃホールディングス株式会社 電子素子の製造方法
KR101961316B1 (ko) * 2018-05-16 2019-03-25 썬시스템(주) 솔리드 스테이트 드라이브의 전자파 차폐 구조
KR102567412B1 (ko) 2018-10-31 2023-08-16 삼성전자주식회사 복수의 레이어를 포함하는 차폐 필름 및 그것을 사용하는 전자 장치
US10694620B1 (en) * 2019-04-02 2020-06-23 Microsoft Technology Licensing, Llc Method and apparatus for circuit board noise shielding and grounding
TW202044934A (zh) * 2019-05-24 2020-12-01 華碩電腦股份有限公司 印刷電路板與具有此印刷電路板之主機板
TWI728435B (zh) * 2019-08-23 2021-05-21 大陸商驛科新材料科技（深圳）有限公司 具防水、防電磁波功能之電路板及其製造方法
US10775856B1 (en) 2019-12-02 2020-09-15 Management Services Group, Inc. Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same
EP3840412A1 (en) 2019-12-19 2021-06-23 GN Hearing A/S Encapsulation of electronic components on substrate for hearing device
FR3133199A1 (fr) * 2022-03-04 2023-09-08 Jet Metal Technologies Procede de fabrication d’un article tridimensionnel a motif(s) metallique(s)
CN116046254A (zh) * 2022-12-29 2023-05-02 北京自动化控制设备研究所 气压传感器的集成式隔离防护结构

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1070792A (en) * 1976-07-26 1980-01-29 Earl A. Cooper Electrical connector and frequency shielding means therefor and method of making same
US4489116A (en) * 1982-12-21 1984-12-18 Flood James R Skin packaging technique providing paint masking
DE3248147A1 (de) * 1982-12-27 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Metallisierte formteile aus kunststoff fuer technische gehaeuse zur abschirmung gegenueber elektromagnetischen stoerfeldern
US4973514A (en) * 1984-06-11 1990-11-27 The Dow Chemical Company EMI shielding composites
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4714905A (en) * 1986-10-08 1987-12-22 K & L Microwave SMC filter and method of manufacture thereof
US5047260A (en) * 1987-02-06 1991-09-10 Key-Tech, Inc. Method for producing a shielded plastic enclosure to house electronic equipment
US4933060A (en) * 1987-03-02 1990-06-12 The Standard Oil Company Surface modification of fluoropolymers by reactive gas plasmas
JPS6426435A (en) * 1987-07-22 1989-01-27 Chisso Corp Conductive polypropylene sheet
JPH062317Y2 (ja) * 1988-08-09 1994-01-19 株式会社東芝 筐体構造
US5028490A (en) * 1988-11-14 1991-07-02 Minnesota Mining And Manufacturing Co. Metal/polymer composites
US5226210A (en) * 1989-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method of forming metal fiber mat/polymer composite
US5017419A (en) * 1989-04-13 1991-05-21 Chomerics, Inc. Non-moire shielded window
US5250342A (en) * 1989-05-24 1993-10-05 United Technologies Corporation Composite EMI shield having clean, highly conductive surfaces for conductive bonding
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US4988550A (en) * 1989-07-28 1991-01-29 Chomerics, Inc. Conductive masking laminate
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
US5071519A (en) * 1989-11-03 1991-12-10 Amp Incorporated Method of plating a flexible dielectric member
US5170009A (en) * 1990-03-22 1992-12-08 Canon Kabushiki Kaisha Electrically conductive covers and electrically conductive covers of electronic equipment
US5235492A (en) * 1990-04-24 1993-08-10 Motorola, Inc. Electromagnetic shielding apparatus for cellular telephones
US5191544A (en) * 1990-06-15 1993-03-02 International Business Machines Corp. Personal computer enclosure with shielding
US5270488A (en) * 1990-07-27 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Shield construction for electrical devices
US6058000A (en) * 1990-07-31 2000-05-02 Intermec Ip Corp. Method and apparatus for electromagnetic shielding and electrostatic discharge protection
US5180639A (en) * 1990-10-26 1993-01-19 General Electric Company Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5206796A (en) * 1991-03-11 1993-04-27 John Fluke Mfg. Co. Inc. Electronic instrument with emi/esd shielding system
US5225629A (en) * 1991-12-13 1993-07-06 Dell Usa L.P. Snap-in EMI contact associated with a digital computer
US5214242A (en) * 1992-01-07 1993-05-25 International Business Machines Corp. Electromagnetic interference/radio frequency interference conducting strip
US5598034A (en) * 1992-07-22 1997-01-28 Vlsi Packaging Corporation Plastic packaging of microelectronic circuit devices
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
JPH0745982A (ja) * 1993-07-28 1995-02-14 Toshiba Corp シールドケースとプリント配線板との接続構造
CA2129073C (en) * 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US5436803A (en) * 1993-12-16 1995-07-25 Schlegel Corporation Emi shielding having flexible conductive envelope
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5405000A (en) * 1994-02-28 1995-04-11 Hagedon; Bryan D. Protective suspension package
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
US5559677A (en) * 1994-04-29 1996-09-24 Motorola, Inc. Method of forming a device by selectively thermal spraying a metallic conductive material thereon
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
EP0727932B1 (en) * 1994-11-28 1999-04-07 Kabushiki Kaisha Toshiba Electromagnetic shielded casing
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
CA2151331A1 (en) * 1995-06-08 1996-12-09 Henry W. C. Mok Emi shield
JP3385163B2 (ja) * 1995-09-04 2003-03-10 吉野電化工業株式会社 電磁波シールド及びその形成方法
US5550713A (en) * 1995-09-06 1996-08-27 Aironet Wireless Communications, Inc. Electromagnetic shielding assembly for printed circuit board
US5968600A (en) * 1995-09-15 1999-10-19 Egyptian Lacquer Mfg. Co. EMI/RFI-shielding coating
US5825634A (en) * 1995-12-22 1998-10-20 Bfgoodrich Avionics Systems, Inc. Circuit board having an EMI shielded area
US6018125A (en) * 1996-11-15 2000-01-25 Collins; Pat Eliot High frequency EMI shield with air flow for electronic device enclosure
US5847317A (en) * 1997-04-30 1998-12-08 Ericsson Inc. Plated rubber gasket for RF shielding
US5872332A (en) * 1997-06-27 1999-02-16 Delco Electronics Corp. Molded housing with EMI shield
US6140575A (en) * 1997-10-28 2000-10-31 3Com Corporation Shielded electronic circuit assembly
US6127038A (en) * 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
US5969418A (en) * 1997-12-22 1999-10-19 Ford Motor Company Method of attaching a chip to a flexible substrate
US6180876B1 (en) * 1997-12-29 2001-01-30 Research In Motion Limited Apparatus and method for RF shielding of a printed circuit board
US6275683B1 (en) * 1998-01-12 2001-08-14 Ericsson Inc. Interchangeable shield for a radio communication device
US6090728A (en) * 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures
US6088231A (en) * 1999-03-03 2000-07-11 Methode Electronics, Inc. RF and EMI shield

Also Published As

Publication number Publication date
WO2001082672A1 (en) 2001-11-01
US20010033478A1 (en) 2001-10-25
CN1442033A (zh) 2003-09-10
CN100403864C (zh) 2008-07-16

Similar Documents

Publication Publication Date Title
AU2001247879A1 (en) Emi and rfi shielding for printed circuit boards
WO2004114731A3 (en) Emi absorbing shielding for a printed circuit board
AU3506200A (en) Circuit board component shielding enclosure and assembly
AU6483199A (en) Electronic circuit board
SG74731A1 (en) Electromagnetic shielding system for printed circuit board
AU2002319480A1 (en) Emi shielding for electronic packages
AU3492395A (en) Printed circuit board inductor
AU2003290878A1 (en) Connector and printed circuit board for reducing cross-talk
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
GB2351183B (en) Shielding can for a printed circuit board
HK1048666A1 (en) Printed circuit boards
AU2002210947A1 (en) Circuit board unit and electronic equipment
GB0024401D0 (en) Printed circuit board
AU9450298A (en) Printed circuit boards
GB2361695B (en) Electroconductive composition and printed circuit board using the same
TWM292873U (en) Printed circuit board and mask for screen-printing such circuit boards
SG91842A1 (en) Printed circuit board with shielded circuitry
GB2337862B (en) Printed circuit board
AU2001252401A1 (en) Printed circuit boards
AU2002220163A1 (en) Electromagnetic shielding and cooling device for printed circuit board
AU2001217873A1 (en) Emi/rfi shielding device for electronic products
AU2002245188A1 (en) Printed circuit board ejector system with improved emi shielding
EP1042092A4 (en) COMPONENT OF A BOARD
AU2001251751A1 (en) Component of printed circuit board
AU2001225957A1 (en) Emi and rfi containment enclosure for electronic devices