WO2015158008A1 - 一种屏蔽膜、屏蔽电路板及终端设备 - Google Patents

一种屏蔽膜、屏蔽电路板及终端设备 Download PDF

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Publication number
WO2015158008A1
WO2015158008A1 PCT/CN2014/075733 CN2014075733W WO2015158008A1 WO 2015158008 A1 WO2015158008 A1 WO 2015158008A1 CN 2014075733 W CN2014075733 W CN 2014075733W WO 2015158008 A1 WO2015158008 A1 WO 2015158008A1
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WO
WIPO (PCT)
Prior art keywords
insulating layer
shielding
circuit board
layer
shielding film
Prior art date
Application number
PCT/CN2014/075733
Other languages
English (en)
French (fr)
Inventor
沈晓兰
孙宁波
王玉忠
杨阳
狄伟
周静
Original Assignee
华为终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为终端有限公司 filed Critical 华为终端有限公司
Priority to PCT/CN2014/075733 priority Critical patent/WO2015158008A1/zh
Priority to CN201480005573.1A priority patent/CN104981347B/zh
Publication of WO2015158008A1 publication Critical patent/WO2015158008A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present invention relates to the field of electromagnetic shielding technology, and in particular to a shielding film, a shielding circuit board and a terminal device.
  • Electromagnetic shielding technology refers to the use of a shield made of magnetically or electrically conductive material to limit the electromagnetic interference energy to a certain range, to control the electric field, the magnetic field and the induction or radiation of electromagnetic waves from one region to another.
  • the shield is used to isolate the interference source of the electronic component, the circuit cable, or the entire system to prevent external electromagnetic field or interference electromagnetic field from spreading outward.
  • electronic components in electronic devices usually need to be mounted on a circuit board to form a fixed circuit, thereby meeting the needs of mass production and optimized layout.
  • a metal shield is usually required. As shown in FIG.
  • the electronic component 30 0 on the circuit board 200 is isolated from the outside by a metal shield 100, and then the metal shield 100 is connected to the ground pad 4 00 by crimping or soldering. , The metal shield 100 is grounded to achieve the function of electromagnetic shielding.
  • the prior art metal shield has the following drawbacks: First, when the crimping method is used to connect to the ground pad, the metal shield contacts the ground pad with a large area to facilitate connection using a connector such as a screw. The size of the metal shield and the ground pad is too large, which is not conducive to high-density mounting of electronic components on the board to reduce the thickness of the electronic product. When soldering to the ground pad, high flatness is ensured. It is necessary to provide a plurality of mutually spaced pins at the lower end of the metal shield and solder the ground pads through the pins. Since the soldering method is used, it is necessary to reserve sufficient space for the solder, which also causes the metal shield.
  • the size of the grounding pad is too large, which is not conducive to the high-density mounting of electronic components. There is a gap between the pins, which is easy to cause electromagnetic leakage and reduce the effect of electromagnetic shielding.
  • the metal shield is not insulated, in order to prevent the metal shield from short-circuiting the electronic component, the metal shield is usually interposed between the electronic components Keeping a certain distance increases the overall thickness of the board after the shield is installed. This makes it difficult to adapt to the ultra-thin design requirements of the end product.
  • Embodiments of the present invention provide a shielding film, a shielding circuit board, and a terminal device, which can reduce the thickness of the product.
  • an embodiment of the present invention provides a shielding film, including a first insulating layer and a shielding layer, wherein the shielding layer is disposed on the first insulating layer, and the first insulating layer is a flexible insulating material or each The conductive layer or the conductive material is bonded to the first aspect.
  • the second insulating layer is a flexible insulating material, and the second insulating layer is a flexible insulating material.
  • a shielding layer is between the first insulating layer and the second insulating layer.
  • the first insulating layer is made of polyimide, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid Any of polyester, anisotropic conductive paste.
  • the second insulating layer is made of polyimide, polyethylene terephthalate, polyvinyl chloride, poly Any one of ethylene naphthalate, polytetrafluoroethylene, aramid, and polyester.
  • the shielding layer is a metal foil or a metal coating.
  • the material of the shielding layer may be any one of elemental metal copper, nickel, chromium, aluminum, silver, gold, iron, tin, stainless steel, or Any alloy of the elemental metal composition.
  • the thickness of the shielding layer is between 1 _ 5 ⁇ .
  • the release paper is further included, and the release paper is attached to the second insulating layer.
  • an embodiment of the present invention further provides a shielding circuit board, including: a film, the shielding film includes a first insulating layer and a shielding layer, the shielding layer is disposed on the first insulating layer, and the first insulating layer is a flexible insulating material or an anisotropic conductive material, the shielding layer a conductive or magnetically conductive material; a circuit board, the shielding film covering an upper surface of the electronic component, the first insulating layer being adhered to an upper surface of the electronic component of the circuit board, the shielding film and the shielding layer The ground pad of the circuit board is connected, the shielding layer is electrically connected to the ground pad, and the electronic component is located in a shielding cavity formed by the shielding film, the circuit board and a ground pad of the circuit board.
  • the shielding film further includes a second insulating layer, the second insulating layer is a flexible insulating material, the shielding layer is located at the first insulating layer and Between the two insulation layers.
  • the first insulating layer is made of polyimide, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid Any of polyester, anisotropic conductive paste.
  • the second insulating layer is made of polyimide, polyethylene terephthalate, polyvinyl chloride, poly Any one of ethylene naphthalate, polytetrafluoroethylene, aramid, and polyester.
  • the material of the first insulating layer is polyimide, and the first insulating layer is provided with an opening at a position corresponding to the ground pad.
  • the shielding film is connected to the ground pad by a heat pressing method, and the shielding layer is electrically connected to the ground pad at the opening.
  • the shielding film completely covers an outer surface of the electronic component, and the first insulating layer is further The sides of the electronic component are attached.
  • the material of the first insulating layer is polyimide
  • the material of the second insulating layer is polyethylene terephthalate Glycol ester.
  • the first insulating layer has a thickness between 8 and 40 ⁇ m, and the second insulating layer has a thickness of 80 to 1 Between 2 0 ⁇ .
  • the material of the first insulating layer and the second insulating layer is polyimide.
  • the thickness of the first insulating layer and the second insulating layer are both between 8 and 15 ⁇ m.
  • the embodiment of the present invention further provides a terminal device, including the shield circuit board of any one of the second aspect to the ninth possible implementation manner of the second aspect.
  • the shielding film of the embodiment of the invention has a multi-layer structure, the first insulating layer is a flexible insulating material or an anisotropic conductive material, and the shielding layer is a conductive material, so that when the electronic component of the circuit board is shielded by the shielding film, The first insulating layer is attached to the upper surface of the electronic component to be shielded, and the first insulating layer is made of a flexible insulating material or an anisotropic conductive material, and has insulation properties, so that the first insulating layer and the upper surface of the electronic component are attached.
  • the electronic component is not short-circuited by the first insulating layer, thereby avoiding a gap between the electronic component and the shielding film to prevent the electronic component from being short-circuited. Therefore, the thickness of the board after the shield film is mounted can be reduced.
  • FIG. 1 is a schematic structural diagram of a shielded circuit board in the prior art
  • FIG. 2 is a schematic structural view of a shielding film according to Embodiment 1 of the present invention.
  • FIG. 5 is a structural diagram of a shielded circuit board according to a second embodiment of the present invention.
  • FIG. 6 is a structural diagram of a shielded circuit board according to a third embodiment of the present invention.
  • FIG. 7 is a structural diagram of a shielded circuit board according to Embodiment 4 of the present invention.
  • first and second are used for the description only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first”, “second” may explicitly or implicitly include one or more of the features.
  • multilayer means two or more layers unless otherwise stated.
  • FIG. 2 is a specific embodiment of a shielding film according to an embodiment of the present invention.
  • the shielding film 1 of the embodiment includes a first insulating layer 101 and a shielding layer 102.
  • the shielding layer 102 is disposed on the first insulating layer 101.
  • the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material
  • the shielding layer 102 is a conductive material or a magnetic conductive material.
  • the shielding film 1 of the embodiment has a multi-layer structure, the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material, and the shielding layer 102 is a conductive material, so that the electronic components of the circuit board are shielded by the shielding film 1.
  • the first insulating layer 101 may be attached to the surface of the electronic component to be shielded. Since the material of the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material, the first insulating layer 101 and the electron are insulated.
  • the electronic component is not short-circuited by the first insulating layer 101, thereby avoiding a gap between the electronic component and the shielding film 1 to prevent the electronic component from being short-circuited, thereby reducing the shielding of the circuit board.
  • the thickness of the film 1 in addition, since the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material, the shielding film 1 can be connected to the ground pad of the circuit board by heat pressing (ie, the shielding layer 102 can be The ground pad of the circuit board is connected to electrically connect the shielding layer 102 and the ground pad on the circuit board, so that the electronic component to be shielded is in the shielding film 1.
  • the shielding of the electronic component 3 is achieved in the shielded area formed by the circuit board and the ground pad on the circuit board.
  • the shielding film 1 is connected to the ground pad without an additional connection medium or a connecting member, and the shielding layer 102 is electrically connected to the ground pad 4, which simplifies the connection manner and avoids special
  • the dielectric or the connecting member is connected, so that the shielding film 1 can be connected to the ground pad in a narrow area, the grounding resistance is reduced, the shielding effect is improved, and the mutually spaced pins are disposed on the shielding film 1 to ensure Flatness, the electromagnetic leakage caused by the gap between the pins is prevented, and the electromagnetic shielding effect is improved.
  • the shielding film 1 can be directly Conducting heat to the outside enhances heat dissipation.
  • the shielding layer 102 is disposed on the first insulating layer 101 for the shielding film including the first insulating layer 101 and the shielding layer 102.
  • the first insulating layer 101 may be disposed on the shielding layer 102 by coating.
  • a second insulating layer 103 may be disposed on the shielding layer 102.
  • the shielding layer 102 is disposed between the first insulating layer 101 and the second insulating layer 103, and a flexible insulating material is selected as the material of the second insulating layer 103.
  • the shield layer 102 is prevented from directly contacting other electronic devices and causing a short circuit, thereby ensuring normal use of the electronic components.
  • the first insulating layer 101 may be disposed on the shielding layer 102 by coating, and the shielding layer 102 may be sputtered first.
  • a post plating method is formed on the second insulating layer 103.
  • the material of the first insulating layer 101 may be any one of polyimide, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester, and anisotropic conductive adhesive. .
  • the material of the second insulating layer 103 may be polyimide, polyethylene terephthalate, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester. Any of them.
  • the shielding layer 102 may be a metal foil separately formed by using a metal material, or the shielding layer 102 may also be a metal coating layer coated on the first insulating layer 101.
  • the material of the shielding layer 102 can be selected from various materials, for example: copper, nickel, chromium, aluminum, silver, gold, iron, tin, stainless steel, or copper, nickel, chromium, aluminum, silver, Any of an alloy of any combination of gold, iron, and tin.
  • copper since copper has a high conductivity, shielding against electromagnetic interference is good, and the cost is low, and molding is easy, copper is preferably used as the main material of the shielding layer 102.
  • the material of the shielding layer 102 is a metal material, if the thickness of the shielding layer 102 is too large, the rigidity of the shielding film 1 is increased, which is disadvantageous for the molding and manufacturing of the shielding film 1. If the thickness of the shielding film 1 is too small, the shielding may be caused. The strength of the film 1 is lowered, it is easily broken, and the electromagnetic shielding effect is weakened. Therefore, the thickness of the shield layer 102 can be set to be between 1-5 ⁇ m.
  • the shielding layer 102 is made flexible, so that the shielding film 1 adapted to the shape and size of the upper surface of the electronic component can be manufactured by using a thermoplastic molding technique; or the shielding can be performed by vacuuming
  • the film 1 is completely attached to the surface of the electronic component.
  • the selection of the shielding film 1 process is increased, and it is easy to install a shielding film on the circuit board.
  • the shielding film 1 may further include a release paper 104, and attach the release paper 104 to the second insulating layer. 103 on. Since the release paper is moisture-proof, oil-proof, and can isolate the product, the shielding film 1 can be protected before the shielding film 1 is installed, and after the shielding film 1 is installed, the release paper 104 can be removed to prevent The release paper 104 affects the normal use of the shielding film 1. Thereby, the shielding film 1 can be protected from contamination or scratching before the shielding film 1 is mounted on the circuit board, and the shielding film 1 can be prevented from sticking to other devices, thereby ensuring the normal use of the shielding film 1.
  • the shielding film 1 including the first insulating layer 101, the shielding layer 102, the second insulating layer 103 and the release paper 104
  • the thickness of the second insulating layer 103 when the thickness of the second insulating layer 103 is less than 50 ⁇ m, it can be on the release paper 104.
  • the first insulating layer 101 may be disposed on the shielding layer 102 by coating. Correct In the shielding film including the first insulating layer 101, the shielding layer 102 and the second insulating layer 103, the first insulating layer 101 may be disposed on the shielding layer 102 by coating, and the shielding layer 102 is plated by sputtering first. The method is formed on the second insulating layer 103.
  • the shielding effect of the shielding film 1 provided by the embodiment of the present invention is tested, and the shielding film 1 can be covered on the double-layer flexible circuit board, and the signal layer of the double-layer flexible circuit board is used to output the input of different frequencies with a power of -10 dBm. Signal, and then use the antenna probe with the spectrum analyzer to test the magnetic field strength above the shielding film at 0.1 mm. The magnetic field strength can reflect the shielding effect of the shielding film.
  • the test results are shown in Figure 3. From the test results, it can be seen at different frequencies.
  • the shielding film 1 provided by the embodiment of the invention can effectively shield the electromagnetic radiation by the magnetic field strength of the shielding film.
  • the grounding resistance of the shielding film 1 provided by the embodiment of the present invention is tested. Since the copper-exposed path (grounding pad) on the circuit board is related to the pressing force of the shielding film 1 on the exposed copper path, it can be separately performed on the circuit board. The shielding film is pressed on the exposed copper paths of different widths by different pressing forces, and the values of the grounding resistance in each case are respectively tested. As a result, as shown in FIG. 4, the grounding resistance of the shielding film 1 provided by the embodiment of the present invention is shown. Smaller, it facilitates the eddy current generated in the shielding layer to be guided through the exposed copper path, thereby enhancing the shielding effect.
  • FIG. 5 is a specific embodiment of a shielded circuit board according to an embodiment of the present invention.
  • the shielded circuit board of this embodiment includes:
  • the shielding film 1 includes a first insulating layer 101 and a shielding layer 102.
  • the shielding layer 102 is disposed on the first insulating layer 101, wherein the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material.
  • the shielding layer 102 is made of a conductive or magnetic conductive material; the circuit board 2 is provided with an electronic component 3 on the circuit board 2, and the shielding film 1 is overlaid on the electronic component 3.
  • the first insulating layer 101 can be on the electronic component 3 of the circuit board 2. Surface bonding, the shielding film 1 is connected to the ground pad 4 of the circuit board 2, and the shielding layer 102 is grounded.
  • the disk 4 is turned on, and the electronic component 3 is located in the shielding cavity formed by the shielding film 1, the circuit board 2, and the ground pad 4 of the circuit board 2.
  • the shielding circuit board provided in this embodiment adopts a shielding film 1 having a multi-layer structure, and the shielding film 1 is covered on the electronic component 3, the first insulating layer 101 of the shielding film 1 and the electronic component 3 of the circuit board 2
  • the surface of the shielding film 1 is connected to the grounding pad 4, and the shielding layer 102 is electrically connected to the grounding pad 4.
  • the first insulating layer 101 is made of a flexible insulating material or an anisotropic conductive material, it has insulation properties, so that the electronic component 3 is not short-circuited by the first insulating layer 101, so that the first insulating layer 101 is bonded to the upper surface of the electronic component 3 to eliminate the gap between the shielding film 1 and the upper surface of the electronic component 2 in order to prevent the electronic component 3 from being short-circuited. Thereby, the thickness of the entire shielded circuit board is reduced.
  • the shielding film 1 can be connected to the ground pad 4 by a heat pressing method, thereby making the shielding layer 102 and the ground pad on the circuit board 2 4 Turning on, the electronic component to be shielded is placed in the shielding area formed by the grounding pad of the shielding film 1, the circuit board and the circuit board, thereby shielding the electronic component 3.
  • the thermal compression method does not require an additional connection medium or a connecting member, the shielding film 1 can be completely connected to the ground pad 4, and the shielding layer 102 and the ground pad 4 are electrically connected, which simplifies the connection manner and is avoided.
  • the special connection medium or connector can avoid increasing the size of the shielding film 1 for easy installation of the mounting connector or the connecting medium, so that the shielding film 1 can be connected to the ground pad 4 in a narrow area, thereby reducing the grounding.
  • the resistors improve the shielding effect, and do not need to set the pins spaced apart to ensure the flatness of the contact of the shielding film 1, avoid electromagnetic leakage caused by the gap between the pins, and improve the electromagnetic shielding effect.
  • the shielding film 1 of the shielding circuit board can directly contact the electronic component 3, the heat generated by the electronic component 3 can be directly transmitted to the outside by the shielding film 1, thereby improving the heat dissipation effect and avoiding the heat dissipation caused by the heat dissipation hole. Electromagnetic leakage.
  • the area where the electronic component 3 is located may be a shielded area, and the ground pad 4 may be located on the circuit board 2 at a position corresponding to the edge of the shielded area.
  • the shielding film 1 further includes a second insulating layer 103.
  • the second insulating layer 103 is a flexible insulating material, and the shielding layer 102 is located between the first insulating layer 101 and the second insulating layer 103.
  • the material of the first insulating layer 101 may be any one of polyimide, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester, anisotropic conductive adhesive. .
  • the material of the second insulating layer 103 may be polyimide, polyethylene terephthalate, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester. Any of them.
  • the material of the shielding layer 102 may be any one of elemental metal copper, nickel, chromium, aluminum, silver, gold, iron, tin, stainless steel, or any alloy composed of the elemental metal.
  • the shielding layer 102 and the grounding pad 4 may be connected in various manners, for example, when the material of the first insulating layer 101 is made of polyimide, since the polyimide is an insulating material, in order to shield
  • the layer 102 is electrically connected to the ground pad, and an opening (not shown) is formed on the first insulating layer 101 at a position corresponding to the ground pad 4, and the shielding film 1 is connected to the ground pad 4 by heat pressing.
  • the shielding layer 102 can be electrically connected to the ground pad 4 at the opening;
  • the shielding film 1 can be connected to the ground pad 4 by heat pressing, and the first shielding is performed in the hot pressing region after the anisotropic conductive adhesive is hot pressed.
  • the layer 101 is electrically conductive in the thickness direction. Therefore, the shielding layer 102 can be electrically connected to the ground pad 4 through the anisotropic conductive paste of the first insulating layer 101, thereby realizing an electromagnetic shielding function, and at the same time, since the anisotropic conductive adhesive is It is insulated in a direction other than the thickness direction of the first shield layer 101, thereby avoiding short-circuiting of the electronic components 3 and affecting the normal use of the shielded circuit board.
  • the shielding film 1 can be manufactured by a molding process such as thermoforming, on the circuit board 2 and the electronic component 3.
  • the shielding film 1 of the electronic component 3 is formed, and the formed shielding film 1 is fixed in shape and is not easily deformed. Since the thermoplastic molding process can form the shielding film 1 into a shape conforming to the shape of the electronic component 3 at one time, it is not necessary to The shielding film 1 is processed again, which simplifies the production process and improves the production efficiency of the shielding film 1.
  • polyimide has high insulation and thermal stability, and can be made at a lower thickness.
  • the shielding layer 102 is isolated from the electronic component, which is advantageous for reducing the thickness of the shielding film 1. Therefore, the material of the first insulating layer 101 may be polyimide, and the material of the second insulating layer 103 may be polyethylene terephthalate. The glycol ester is advantageous for reducing the thickness of the product and for mounting the shielding film 1 on the circuit board 2.
  • copper has a high conductivity, a shielding effect against electromagnetic interference is good, and the cost is low, and molding is easy, copper is preferably used as a main material of the shield layer 102.
  • the material of the first insulating layer 101 is made of polyimide
  • the material of the second insulating layer 103 is made of polyethylene terephthalate
  • the material of the shielding layer 102 is made of copper
  • the thickness of the first insulating layer 101 is used. It can be set between 8-40 ⁇ m
  • the thickness of the second insulating layer 103 can be set between 80-120 ⁇ m
  • the thickness of the shielding layer 102 can be set between 1-5 ⁇ m.
  • the plasticity of the shielding film 1 is good, and it is advantageous to directly manufacture the shielding film 1 to which the electronic component 3 is bonded according to the outer dimensions of the electronic component 3 by a process such as thermoplastic molding.
  • the shielding film described in this embodiment may include any of the shielding films described in the first embodiment.
  • the shielding film described in the first embodiment may include any of the shielding films described in the first embodiment.
  • FIG. 6 is a specific embodiment of a shielded circuit board according to an embodiment of the present invention.
  • the shielded circuit board of this embodiment includes:
  • the shielding film 1 includes a first insulating layer 101 and a shielding layer 102.
  • the shielding layer 102 is disposed on the first insulating layer 101.
  • the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material.
  • 102 is a conductive or magnetically conductive material;
  • the circuit board 2 is provided with an electronic component 3 on the circuit board 2, and the shielding film 1 is covered on the electronic component 3.
  • the first insulating layer 101 can be bonded to the upper surface of the electronic component 3 of the circuit board 2, and the shielding film 1 and the circuit board
  • the ground pad 4 of 2 is connected, the shield layer 102 is electrically connected to the ground pad 4, and the electronic component 3 is located in the shield cavity formed by the shielding film 1, the circuit board 2, and the ground pad 4 of the circuit board 2.
  • the shielding film 1 can be completely covered on the outer surface of the electronic component 3, that is, the first insulating layer 101 and the upper surface of the electronic component 3 are bonded together with the electrons.
  • the sides of the component 3 are attached. Thereby eliminating the screen
  • the gap between the mask 1 and the side of the electronic component 3 can be separated from the different electronic components by the shielding film 1, so that the arrangement of the electronic components 3 on the circuit board 2 can be more compact, and the shielding of the circuit board 2 is further reduced.
  • the size after the film 1 is advantageous for miniaturization of the shielded circuit board.
  • the shielding film 1 further includes a second insulating layer 103.
  • the second insulating layer 103 is a flexible insulating material, and the shielding layer 102 is located between the first insulating layer 101 and the second insulating layer 103.
  • the material of the first insulating layer 101 may be any one of polyimide, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester, anisotropic conductive adhesive. .
  • the material of the second insulating layer 103 may be polyimide, polyethylene terephthalate, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester. Any of them.
  • the material of the shielding layer 102 may be any one of elemental metal copper, nickel, chromium, aluminum, silver, gold, iron, tin, stainless steel, or any alloy composed of the elemental metal.
  • the shielding layer 102 and the grounding pad 4 may be connected in various manners, for example, when the material of the first insulating layer 101 is made of polyimide, since the polyimide is an insulating material, in order to make the shielding layer 102
  • an opening (not shown) may be formed on the first insulating layer 101 at a position corresponding to the ground pad 4.
  • the shielding film 1 is connected to the ground pad 4 by heat pressing, and then shielded.
  • Layer 102 can be electrically connected to ground pad 4 at the opening.
  • the shielding film 1 can be connected to the ground pad 4 by heat pressing, and the first shielding is performed in the hot pressing region after the anisotropic conductive adhesive is hot pressed.
  • the layer 101 is electrically conductive in the thickness direction. Therefore, the shielding layer 102 can be electrically connected to the ground pad 4 through the anisotropic conductive paste of the first insulating layer 101, thereby realizing an electromagnetic shielding function, and at the same time, since the anisotropic conductive adhesive is It is insulated in a direction other than the thickness direction of the first shield layer 101, thereby avoiding short-circuiting of the electronic components 3 and affecting the normal use of the shielded circuit board.
  • the shielding layer 102 can be isolated from the electronic component at a low thickness, and the overall thickness of the shielding film 1 can be further reduced, and the flexibility is further improved. Therefore, the shielding film 1 can be attached to the surface of each electronic component 3 by vacuuming technology, so that the shielding film 1 and the electronic components 3 are more closely attached, and the vacuuming operation is simple. The high efficiency makes the installation efficiency of the shielding film 1 improved. Therefore, the material of the first insulating layer 101 and the second insulating layer 103 can be selected from polyimide.
  • copper has a high conductivity, a shielding effect against electromagnetic interference is good, and the cost is low, and molding is easy, copper is preferably used as a main material of the shield layer 102.
  • the first insulating layer 101 and the second insulating layer 103 can be made of polyimide material
  • the shielding layer 102 is made of copper
  • the first insulating layer 101 and the second insulating layer 103 are both 8-15 ⁇ m thick.
  • the thickness can be set between 1 - 5 ⁇ m. Within this thickness range, the overall thickness of the shielding film 1 is thin and flexible, which facilitates attaching the shielding film 1 to the surface of the electronic component 3 (i.e., the upper surface and the side surface of the electronic component 3) by vacuuming.
  • the shielding film described in this embodiment may include any of the shielding films described in the first embodiment.
  • the shielding film described in the first embodiment may include any of the shielding films described in the first embodiment.
  • FIG. 7 is a specific embodiment of a shielded circuit board according to an embodiment of the present invention.
  • the shielded circuit board of this embodiment includes:
  • the shielding film 1 includes a first insulating layer 101 and a shielding layer 102.
  • the shielding layer 102 is disposed on the first insulating layer 101.
  • the first insulating layer 101 is a flexible insulating material or an anisotropic conductive material.
  • 102 is a conductive or magnetically conductive material;
  • the circuit board 2 is provided with an electronic component 3 on the circuit board 2, and the shielding film 1 is covered on the electronic component 3.
  • the first insulating layer 101 can be bonded to the upper surface of the electronic component 3 of the circuit board 2, and the shielding film 1 and the circuit board
  • the ground pad 4 of 2 is connected, the shield layer 102 is electrically connected to the ground pad 4, and the electronic component 3 is located in the shield cavity formed by the shielding film 1, the circuit board 2, and the ground pad 4 of the circuit board 2.
  • the shielding film 1 further includes a second insulating layer 103, and the second insulating layer 103 As a flexible insulating material, the shielding layer 102 is located between the first insulating layer 101 and the second insulating layer 103.
  • the material of the first insulating layer 101 may be any one of polyimide, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester, anisotropic conductive adhesive. .
  • the material of the second insulating layer 103 may be polyimide, polyethylene terephthalate, polyvinyl chloride, polyethylene naphthalate, polytetrafluoroethylene, aramid, polyester. Any of them.
  • the material of the shielding layer 102 may be any one of elemental metal copper, nickel, chromium, aluminum, silver, gold, iron, tin, stainless steel, or any alloy composed of the elemental metal.
  • the shielding film 1 can be completely covered on the outer surface of the electronic component 3, that is, the first insulating layer 101 is bonded to the upper surface of the electronic component 3, and The sides of the electronic component 3 are attached. Thereby, the gap between the shielding film 1 and the side surface of the electronic component 3 can be eliminated, and the different electronic components can be separated by the shielding film 1, so that the arrangement of the electronic components 3 on the circuit board 2 can be more compact, and the circuit board can be further reduced. 2
  • the size after the installation of the shielding film 1 is advantageous for miniaturization of the shielded circuit board.
  • the shielding layer 102 and the grounding pad 4 may be connected in various manners, for example, when the material of the first insulating layer 101 is made of polyimide, since the polyimide is an insulating material, in order to make the shielding layer 102
  • an opening (not shown) may be formed on the first insulating layer 101 at a position corresponding to the ground pad 4.
  • the shielding film 1 is connected to the ground pad 4 by heat pressing, and then shielded.
  • Layer 102 can be electrically connected to ground pad 4 at the opening.
  • the shielding film 1 can be connected to the ground pad 4 by heat pressing, and the first shielding is performed in the hot pressing region after the anisotropic conductive adhesive is hot pressed.
  • the layer 101 is electrically conductive in the thickness direction. Therefore, the shielding layer 102 can be electrically connected to the ground pad 4 through the anisotropic conductive paste of the first insulating layer 101, thereby realizing an electromagnetic shielding function, and at the same time, since the anisotropic conductive adhesive is Along the first shield 101 is insulated in a direction other than the thickness direction, thereby avoiding short-circuiting of each electronic component 3 and affecting the normal use of the shielded circuit board.
  • the ground pad 4 is disposed at a position between the electronic components 3 on the circuit board 2.
  • the shielding film 1 can be completely covered on the outer surface of the electronic component 3. That is, the first insulating layer 101 is bonded to the upper surface of the electronic component 3 and also to the side surface of the electronic component 3.
  • the shielding film 1 can be connected to the ground pad 4 of the electronic component 3, and the shielding layer 102 is electrically connected to the ground pad 4, so that the shielding film 1, the circuit board 2 and the ground pad 4 can enclose a plurality of shielding cavities, and each electron
  • the components 3 are respectively located in the shielding cavities, which not only avoids electromagnetic interference between the electronic components 3 and the outside, but also shields electromagnetic interference between the electronic components 3. Thereby, the shielding effect is further improved.
  • an opening may be formed in the first insulating layer 101 corresponding to the ground pad 4 between the electronic components 3, and the shielding film 1 is connected to the ground pad 4 between the electronic components 3 by a heat pressing method.
  • the shield layer 102 is electrically connected to the ground pad 4.
  • the shielding layer 102 is electrically connected to the ground pad 4 between the electronic components 3 at each of the openings, so that the outer surface of each electronic component 3 is covered by the shielding film 1, so that the shielding film 1, the circuit board 2, and the grounding welding can be performed.
  • the disk 4 is surrounded by a plurality of shielding cavities, and each of the electronic components 3 is located in each shielding cavity, which not only avoids electromagnetic interference between the electronic component 3 and the outside, but also shields electromagnetic interference between the electronic components 3. Thereby, the shielding effect is further improved.
  • the material of the first insulating layer 101 is an anisotropic conductive paste
  • the anisotropic conductive paste is electrically conductive in the thickness direction of the first shielding layer 101 in the hot pressing region under hot pressing
  • An insulating layer 101 is connected to the ground pad 4 between the electronic components by a heat pressing method, and the shielding layer 102 and the ground pad 4 are passed through the anisotropic conductive paste of the first insulating layer 101 in the thickness direction of the shielding film 1.
  • each electronic component 3 is covered by the shielding film 1, so that a plurality of shielding cavities can be surrounded by the shielding film 1, the circuit board 2 and the ground pad 4, and the electronic components 3 are respectively located in the respective In the shielding cavity, it can not only avoid electromagnetic interference between the electronic component 3 and the outside, but also shield Electromagnetic interference between each electronic component 3. Thereby, the shielding effect is further improved.
  • the shielding layer 102 can be separated from the electronic component 3 at a lower thickness, and the overall thickness of the shielding film 1 can be further reduced and flexible. Further increasing, so that the shielding film 1 can be attached to the surface of each electronic component 3 by vacuuming technology, so that the shielding film 1 and the electronic components 3 are more closely attached, and the product can be further reduced.
  • the vacuuming technique is simple in operation and high in efficiency, so that the mounting efficiency of the shielding film 1 is improved. Therefore, the material of the first insulating layer 101 and the second insulating layer 103 can be selected from polyimide.
  • copper has a high conductivity, a shielding effect against electromagnetic interference is good, and the cost is low, and molding is easy, copper is preferably used as a main material of the shield layer 102.
  • the thickness of the first insulating layer 101 and the second insulating layer 103 are between 8 and 15 ⁇ m.
  • the thickness of the shielding layer 102 can be set between 1 -5 ⁇ m. Within this thickness range, the overall thickness of the shielding film 1 is thin and flexible, which facilitates the complete attachment of the shielding film 1 to the surface of the electronic component 3 by vacuuming.
  • the shielding film described in this embodiment may include any of the shielding films described in the first embodiment.
  • the shielding film described in the first embodiment may include any of the shielding films described in the first embodiment.
  • the embodiment of the invention further provides a terminal device, including a shielding circuit board.
  • a shielding circuit board for the shielding circuit board, reference may be made to the descriptions of Embodiment 2 to Embodiment 4.
  • the shielding film can be referred to the description of the first embodiment. Here, it will not be repeated.
  • the terminal device may be a terminal device that needs to shield the electronic component, such as a mobile phone, a wearable device, a glasses device, or a navigation device.

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  • Engineering & Computer Science (AREA)
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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)

Abstract

本发明实施例公开了一种屏蔽膜、屏蔽电路板及终端设备，涉及电磁屏蔽技术领域，可提高电磁屏蔽效果，减小产品厚度，改善散热性能。所述屏蔽膜包括第一绝缘层和屏蔽层，所述屏蔽层位于所述第一绝缘层上，所述第一绝缘层为柔性绝缘材质或各向异性导电材质，所述屏蔽层为导电或导磁材质。

Description

一种屏蔽膜、 屏蔽电路板及终端设备 技术领域
本发明涉及电磁屏蔽技术领域， 特别涉及一种屏蔽膜、 屏蔽电 路板及终端设备。
背景技术
电磁屏蔽技术是指用导磁或导电材料制成的屏蔽体将电磁干扰 能量限制在一定范围内， 用以控制电场、 磁场以及电磁波由一个区 域对另一个区域的感应或辐射。 具体的来说， 就是用屏蔽体将电子 元件、 电路电缆或整个系统的干扰源隔离起来， 防止受到外界电磁 场的影响或者是干扰电磁场向外扩散。 目前， 电子装置中的电子元 件通常需要安装在电路板上， 形成固定电路， 从而满足批量生产和 优化布局的需求， 在对于电路板上的电子元件进行电磁屏蔽时， 通 常需要使用金属屏蔽罩， 如图 1 所示， 用金属屏蔽罩 1 00将电路板 2 0 0上的电子元件 30 0与外界隔离， 再通过压接或焊接的方式将金 属屏蔽罩 1 0 0与接地焊盘 4 00连接， 使金属屏蔽罩 1 00接地， 从而 实现电磁屏蔽的功能。
现有技术的金属屏蔽罩具有以下缺陷： 首先， 在使用压接方式 与接地焊盘连接时， 金属屏蔽罩以较大的面积与接地焊盘接触， 以 便于使用螺钉等连接件进行连接， 这会导致金属屏蔽罩和接地焊盘 的尺寸过大， 不利于在电路板上高密度的安装电子元件， 以实现电 子产品的薄型化； 通过焊接方式与接地焊盘连接时， 为了保证高平 整度， 需要在金属屏蔽罩下端设置若干相互间隔的引脚， 并通过所 述引脚与接地焊盘焊接， 由于使用焊接方式时， 需要为焊料预留足 够的空间， 这同样会使导致金属屏蔽罩和接地焊盘的尺寸过大， 不 以利于电子元件的高密度安装， 其引脚间有空隙， 易造成电磁泄漏， 降低电磁屏蔽的效果。 其次， 由于所述金属屏蔽罩不绝缘， 为了避 免金属屏蔽罩使电子元件短路， 所述金属屏蔽罩通常与电子元件间 保持一定的距离， 这样就增加了电路板安装屏蔽罩后的整体厚度， 这样， 难以适应终端产品超薄设计要求。
发明内容
本发明实施例提供一种屏蔽膜、 屏蔽电路板及终端设备， 可以 减小产品厚度。
本发明的实施例采用如下技术方案：
第一方面， 本发明实施例提供了一种屏蔽膜， 包括第一绝缘层 和屏蔽层， 所述屏蔽层设置在所述第一绝缘层上， 所述第一绝缘层 为柔性绝缘材质或各向异性导电材质， 所述屏蔽层为导电或导磁材 结合第一方面， 在第一种可能的实现方式中， 还包括第二绝缘 层， 所述第二绝缘层为柔性绝缘材质， 所述屏蔽层位于所述第一绝 缘层和第二绝缘层之间。
结合第一方面， 在第二种可能的实现方式中， 所述第一绝缘层 的材质为聚酰亚胺、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶、 各向异性导电胶中的任一种。
结合第一方面的第一种可能， 在第三种可能的实现方式中， 所 述第二绝缘层的材质为聚酰亚胺、 聚对苯二曱酸乙二醇酯、 聚氯乙 烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
结合第一方面， 在第四种可能的实现方式中， 所述屏蔽层为金 属薄片或金属涂层。
结合第一方面， 在第五种可能的实现方式中， 所述屏蔽层的材 质可为单质金属铜、 镍、 铬、 铝、 银、 金、 铁、 锡中的任一种， 不 锈钢， 或者由所述单质金属组成的任一种合金。
结合第一方面的第五种可能， 在第六种可能的实现方式中， 所 述屏蔽层的厚度在 1 _ 5 μηι之间。
结合第一方面的第一种可能， 在第七种可能的实现方式中， 还 包括离型纸， 所述离型纸贴附于所述第二绝缘层上。
第二方面， 本发明实施例还提供一种屏蔽电路板， 包括： 屏蔽 膜， 所述屏蔽膜包括第一绝缘层和屏蔽层， 所述屏蔽层设置在所述 第一绝缘层上， 所述第一绝缘层为柔性绝缘材质或各向异性导电材 质， 所述屏蔽层为导电或导磁材质； 电路板， 所述屏蔽膜覆盖于所 述电子元件上表面， 所述第一绝缘层与所述电路板的电子元件的上 表面贴合， 所述屏蔽膜与所述电路板的接地焊盘连接， 所述屏蔽层 与所述接地焊盘导通， 所述电子元件位于所述屏蔽膜、 所述电路板 和所述电路板的接地焊盘形成的屏蔽腔内。
结合第二方面， 在第一种可能的实现方式中， 所述屏蔽膜还包 括第二绝缘层， 所述第二绝缘层为柔性绝缘材质， 所述屏蔽层位于 所述第一绝缘层和第二绝缘层之间。
结合第二方面， 在第二种可能的实现方式中， 所述第一绝缘层 的材质为聚酰亚胺、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶、 各向异性导电胶中的任一种。
结合第二方面的第一种可能， 在第三种可能的实现方式中， 所 述第二绝缘层的材质为聚酰亚胺、 聚对苯二曱酸乙二醇酯、 聚氯乙 烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
结合第二方面， 在第四种可能的实现方式中， 所述第一绝缘层 的材质为聚酰亚胺， 所述第一绝缘层上与所述接地焊盘对应的位置 开设有开口， 所述屏蔽膜通过热压方式与所述接地焊盘连接， 所述 屏蔽层在所述开口处所述接地焊盘导通。
结合第二方面至第二方面的前四种任一可能， 在第五种可能的 实现方式中， 所述屏蔽膜完全包覆所述电子元件的外表面， 且所述 第一绝缘层还与所述电子元件的侧面贴合。
结合第二方面的第一种可能， 在第六种可能的实现方式中， 所 述第一绝缘层的材质为聚酰亚胺， 所述第二绝缘层的材质为聚对苯 二曱酸乙二醇酯。
结合第二方面的第六种可能， 在第七种可能的实现方式中， 所 述第一绝缘层的厚度在 8 - 4 0 μηι 之间， 所述第二绝缘层的厚度在 8 0 - 1 2 0 μηι之间。 结合第二方面的第一种可能， 在第八种可能的实现方式中， 所 述第一绝缘层和所述第二绝缘层的材质为聚酰亚胺。
结合第二方面的第八种可能， 在第九种可能的实现方式中， 所 述第一绝缘层和所述第二绝缘层的厚度均在 8 - 1 5 μ m之间。
第三方面， 本发明实施例还提供了一种终端设备， 包括第二方 面至第二方面的第九种可能的实现方式中任一所述的屏蔽电路板。
本发明实施例所述屏蔽膜为多层结构， 第一绝缘层为柔性绝缘 材质或各向异性导电材质， 屏蔽层为导电材料， 使得在利用屏蔽膜 对电路板的电子元件进行屏蔽时， 可以将第一绝缘层贴在待屏蔽的 电子元件的上表面， 由于第一绝缘层的材质为柔性绝缘材质或各向 异性导电材质， 具有绝缘性， 使得第一绝缘层与电子元件的上表面 贴合后， 电子元件不会被第一绝缘层短路， 从而可避免在电子元件 和屏蔽膜间设置间隙来防止电子元件被短路。 因此， 可减小电路板 在安装屏蔽膜后的厚度。
附图说明
1 为现有技术中屏蔽电路板的结构示意图；
2为本发明的实施例一的屏蔽膜的结构示意图
3为本发明实施例 的屏蔽膜的屏蔽效果的测试结果图；
4为本发明实施例 的屏蔽膜的接地电阻的测试结果图；
5为本发明的实施例二的屏蔽电路板的结构示 图；
6为本发明的实施例三的屏蔽电路板的结构示 图；
7为本发明的实施例四的屏蔽电路板的结构示 具体实施方式
下面结合附图对本发明实施例一种屏蔽膜、 屏蔽电路板及终端 设备进行详细描述。 在本发明的描述中， 需要理解的是， 术语 "中心"、 "上"、 "下"、 "前"、 "后 "、 "左 "、 "右"、 "竖直"、 "水平 "、 "顶 "、 "底"、 "内 "、 "外" 等指示的方位或位置关系为基于附图所示的方位或位 置关系， 仅是为了便于描述本发明和简化描述， 而不是指示或暗示 所指的装置或元件必须具有特定的方位、 以特定的方位构造和操 作， 因此不能理解为对本发明的限制。
术语 "第一"、 "第二" 仅用于描述， 而不能理解为指示或暗示 相对重要性或者隐含指明所指示的技术特征的数量。 由此， 限定有 "第一"、 "第二" 的特征可以明示或者隐含地包括一个或者更多个 该特征。 在本发明的描述中， 除非另有说明， "多层" 的含义是两 层或两层以上。
实施例一
参照图 2, 图 2 为本发明实施例屏蔽膜的一个具体实施例， 本 实施例所述的屏蔽膜 1 包括第一绝缘层 101 和屏蔽层 102, 屏蔽层 102设置于第一绝缘层 101 上， 第一绝缘层 101 为柔性绝缘材质或 各向异性导电材质， 屏蔽层 102为导电材质或导磁材质。
本实施例所述屏蔽膜 1 为多层结构， 第一绝缘层 101 为柔性绝 缘材质或各向异性导电材质， 屏蔽层 102为导电材料， 使得在利用 屏蔽膜 1 对电路板的电子元件进行屏蔽时， 可以将第一绝缘层 101 贴在待屏蔽的电子元件的表面， 由于第一绝缘层 101 的材质为柔性 绝缘材质或各向异性导电材质， 具有绝缘性， 使得第一绝缘层 101 与电子元件的表面贴合后， 电子元件不会被第一绝缘层 101短路， 从而可避免在电子元件和屏蔽膜 1 间设置间隙来防止电子元件被短 路， 由此， 可减小电路板在安装屏蔽膜 1后的厚度； 另， 由于第一 绝缘层 101 为柔性绝缘材质或各向异性导电材质， 因此可通过热压 方式将屏蔽膜 1与电路板的接地焊盘连接 （即屏蔽层 102可以与电 路板的接地焊盘连接）， 从而将屏蔽层 102 与所述电路板上的接地 焊盘导通， 使待屏蔽的电子元件处于屏蔽膜 1、 电路板及电路板上 的接地焊盘形成的屏蔽区域内， 由此实现对电子元件 3的屏蔽。 由 于热压方式不需要额外的连接介质或连接件就可使屏蔽膜 1与所述 接地焊盘连接，使屏蔽层 102与接地焊盘 4导通， 可简化连接方式， 且由于避免了专门的连接介质或连接件， 使得可将屏蔽膜 1 以较窄 的面积与所述接地焊盘连接， 减小接地电阻， 提高屏蔽效果， 并且 避免了在屏蔽膜 1上设置相互间隔的引脚来保证平整度， 防止各引 脚间的空隙导致的电磁泄漏， 使电磁屏蔽效果得到提升， 此外， 由 于屏蔽膜 1 的第一绝缘层 101可贴合设置于电子元件表面， 从而可 以由屏蔽膜 1直接向外界传导热量， 提升了散热效果。
其中， 对于包括第一绝缘层 101 和屏蔽层 102 的屏蔽膜， 屏蔽 层 102设置于第一绝缘层 101上， 具体的， 可以采用涂布的方式将 第一绝缘层 101位于屏蔽层 102上。
由于屏蔽膜 1 在屏蔽电子元件时， 其上方可能还设有其他电子 装置， 若屏蔽层 102直接与其他电子装置接触， 可能会使该电子装 置短路， 影响电路板的电子元件的正常使用， 因此， 可在屏蔽层 102 上设置第二绝缘层 103, 所述屏蔽层 102位于第一绝缘层 101 和第 二绝缘层 103之间， 并选用柔性绝缘材质作为第二绝缘层 103的材 料， 从而可避免屏蔽层 102与其他电子装置直接接触并造成短路， 从而保证电子元件的正常使用。 其中， 对于包括第一绝缘层 101、 屏蔽层 102和第二绝缘层 103的屏蔽膜， 可以采用涂布的方式将第 一绝缘层 101位于屏蔽层 102上， 可以将屏蔽层 102通过先溅射后 电镀的方式形成于第二绝缘层 103上。
其中， 第一绝缘层 101 的材质可为聚酰亚胺、 聚氯乙烯、 聚萘 二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶、 各向异性导电胶中的 任一种。
其中， 第二绝缘层 103 的材质可为聚酰亚胺、 聚对苯二曱酸乙 二醇酯、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤 纶中的任一种。
屏蔽层 102可为利用金属材料独立成型出的金属薄片， 或者， 屏蔽层 102也可以为涂附在第一绝缘层 101上的一层金属涂层。 其中， 屏蔽层 102 的材质可选用多种材料， 例如： 铜、 镍、 铬、 铝、 银、 金、 铁、 锡中的任一种， 不锈钢， 或者由铜、 镍、 铬、 铝、 银、 金、 铁、 锡任意组合而成的合金中的任一种。 但由于铜的导电 率较高， 对电磁干扰的屏蔽作用较好， 且成本较低， 易于成型， 因 此， 优选铜作为屏蔽层 102 的主要材料。
由于屏蔽层 102 的材质为金属材料， 屏蔽层 102 的厚度过大， 会导致屏蔽膜 1 的刚性增加， 不利于对屏蔽膜 1 的成型和制造， 屏 蔽膜 1 的厚度过小， 则可能导致屏蔽膜 1 的强度降低， 容易破损， 且电磁屏蔽效果减弱， 因此， 可将屏蔽层 102 的厚度设置在 1-5μηι 之间。 从而在保证屏蔽效果的情况下， 使屏蔽层 102具有柔性， 从 而可利用热塑成型技术制造出与电子元件的上表面形状和尺寸相 适应的屏蔽膜 1; 或者可以通过抽真空方式， 将屏蔽膜 1 完全贴附 在电子元件的表面。 由此， 增加了屏蔽膜 1 工艺的选择范围， 便于 在电路板上安装屏蔽膜。
为了避免屏蔽膜 1在安装于电路板 2上以前被划伤和污染， 同 时避免与其他装置粘连， 屏蔽膜 1 可还包括离型纸 104, 并将离型 纸 104贴附于第二绝缘层 103上。 由于离型纸防潮、 防油、 并可起 到对产品的隔离作用， 因此可在安装屏蔽膜 1 前保护屏蔽膜 1, 并 且在屏蔽膜 1 安装完成后， 可将离型纸 104去除， 防止离型纸 104 影响屏蔽膜 1 的正常使用。 由此， 可在屏蔽膜 1安装于电路板前保 护屏蔽膜 1 不被污染或划伤， 防止屏蔽膜 1与其他设备发生粘连， 从而保证屏蔽膜 1 的正常使用。
其中， 对于包括第一绝缘层 101、 屏蔽层 102、 第二绝缘层 103 和离型纸 104的屏蔽膜 1, 当第二绝缘层 103的厚度小于 50 μ ηι时， 可在离型纸 104上涂布离型剂，再在离型剂上涂布第二绝缘层 103; 当第二绝缘层 103的厚度大于等于 50 μ ηι时， 可在离型纸 104上涂 布胶粘剂， 再将第二屏蔽层 103粘接于离型纸 104上。
可以理解的是， 对于包括第一绝缘层 101 和屏蔽层 102 的屏蔽 膜， 可以采用涂布的方式将第一绝缘层 101位于屏蔽层 102上。 对 于包括第一绝缘层 101、 屏蔽层 102和第二绝缘层 103 的屏蔽膜， 可以采用涂布的方式将第一绝缘层 101位于屏蔽层 102上， 将屏蔽 层 102通过先溅射后电镀的方式形成于第二绝缘层 103上。
以下提供对屏蔽膜 1 的屏蔽效果和接地电阻的测试方法和结 果：
对本发明实施例提供的屏蔽膜 1 的屏蔽效果进行测试， 可在双 层柔性电路板上覆盖屏蔽膜 1, 利用信号发生器对双层柔性电路板 的信号层以 -lOdBm功率发出不同频率的输入信号，再用天线探头配 合频谱仪测试屏蔽膜上方 0. 1mm处的磁场强度， 该磁场强度可反映 屏蔽膜的屏蔽效果， 测试结果如图 3所示， 由测试结果可看出， 在 不同频率输入信号的作用下， 在所述屏蔽膜上方 0. lmm处的磁场强 度均较低， 因此， 本发明实施例提供的屏蔽膜 1可有效屏蔽电磁辐 射。
对本发明实施例提供的屏蔽膜 1 的接地电阻进行测试， 由于在 电路板上露铜路径 （接地焊盘） 与屏蔽膜 1对露铜路径的压合力相 关， 因此， 可通过在电路板上分别用不同的压合力将屏蔽膜压合在 不同宽度的露铜路径上， 并分别测试每种情况下接地电阻的值， 结 果如图 4所示， 本发明实施例提供的屏蔽膜 1 的接地电阻较小， 便 于在屏蔽层内的产生的涡流通过露铜路径导向地， 从而可增强屏蔽 效果。
实施例二
参照图 5, 图 5为本发明实施例屏蔽电路板的一个具体实施例， 本实施例所述的屏蔽电路板包括：
屏蔽膜 1, 屏蔽膜 1 包括第一绝缘层 101和屏蔽层 102, 屏蔽层 102设置于第一绝缘层 101 上， 其中， 第一绝缘层 101 为柔性绝缘 材质或各向异性导电材质， 所述屏蔽层 102为导电或导磁材质； 电路板 2, 电路板 2上设有电子元件 3, 屏蔽膜 1覆盖于电子元 件 3上， 第一绝缘层 101可以与电路板 2的电子元件 3的上表面贴 合， 屏蔽膜 1与电路板 2 的接地焊盘 4连接， 屏蔽层 102与接地焊 盘 4导通， 电子元件 3位于屏蔽膜 1、 电路板 2和电路板 2 的接地 焊盘 4形成的屏蔽腔内。
本实施例提供的屏蔽电路板， 采用了具有多层结构的屏蔽膜 1, 将屏蔽膜 1覆盖于电子元件 3上， 屏蔽膜 1 的第一绝缘层 101与电 路板 2的电子元件 3的上表面贴合，且屏蔽膜 1与接地焊盘 4连接， 屏蔽层 102与接地焊盘 4导通， 由于第一绝缘层 101为柔性绝缘材 质或各向异性导电材质， 具有绝缘性， 使得电子元件 3不会被第一 绝缘层 101短路， 因此第一绝缘层 101与电子元件 3上表面贴合可 消除为防止电子元件 3被短路而在屏蔽膜 1与电子元件 2的上表面 间设置间隙， 从而减小了所述屏蔽电路板整体的厚度。 另， 由于第 一绝缘层 101为柔性绝缘材质或各向异性导电材质， 因此可通过热 压方式将屏蔽膜 1与接地焊盘 4连接， 从而使屏蔽层 102与电路板 2 上的接地焊盘 4 导通， 使待屏蔽的电子元件处于屏蔽膜 1、 电路 板及电路板上的接地焊盘形成的屏蔽区域内， 由此实现对电子元件 3 的屏蔽。 另， 由于热压方式不需要额外的连接介质或连接件就可 使屏蔽膜 1 完全与接地焊盘 4连接， 使屏蔽层 102与接地焊盘 4导 通， 可简化连接方式， 且由于避免了专门的连接介质或连接件， 可 避免为便于使用安装连接件或连接介质而增大屏蔽膜 1 的尺寸， 使 得可将屏蔽膜 1 以较窄的面积与接地焊盘 4连接， 从而减小接地电 阻， 提高屏蔽效果， 且不用设置相互间隔的引脚来保证屏蔽膜 1接 触的平整度， 避免引脚间空隙造成的电磁泄漏， 使电磁屏蔽效果得 到提升。 此外， 由于所述屏蔽电路板的屏蔽膜 1可以直接与电子元 件 3接触， 电子元件 3产生的热量可由屏蔽膜 1 直接向外界传导热 量，提升了散热效果， 且避免了利用散热孔散热时造成的电磁泄漏。
其中， 电子元件 3所在的区域可以为屏蔽区域， 接地焊盘 4可 以位于电路板 2上与所述屏蔽区域的边缘对应的位置。
进一步地， 屏蔽膜 1 还包括第二绝缘层 103, 第二绝缘层 103 为柔性绝缘材质，屏蔽层 102位于第一绝缘层 101和第二绝缘层 103 之间。 其中， 第一绝缘层 101 的材质可选用聚酰亚胺、 聚氯乙烯、 聚 萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶、 各向异性导电胶中 的任一种。
其中， 第二绝缘层 103 的材质可选用聚酰亚胺、 聚对苯二曱酸 乙二醇酯、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
其中， 屏蔽层 102 的材质可为单质金属铜、 镍、 铬、 铝、 银、 金、 铁、 锡中的任一种， 不锈钢， 或者由所述单质金属组成的任一 种合金。
其中， 屏蔽层 102与接地焊盘 4 的导通方式可为多种， 例如： 当第一绝缘层 101 的材料选用聚酰亚胺时， 由于聚酰亚胺为绝缘材 料， 因此， 为了使屏蔽层 102与接地焊盘导通， 可在第一绝缘层 101 上与接地焊盘 4 对应的位置开设开口 （ 图中未示出 ）， 将屏蔽膜 1 通过热压方式与接地焊盘 4连接后， 屏蔽层 102在所述开口处可与 接地焊盘 4导通；
当第一绝缘层 101 的材料为各向异性导电胶时， 可将屏蔽膜 1 通过热压方式与接地焊盘 4连接， 由于各向异性导电胶热压后， 在 热压区域沿第一屏蔽层 101 的厚度方向导电， 因此， 屏蔽层 102可 通过第一绝缘层 101 的各向异性导电胶与接地焊盘 4导通， 从而实 现电磁屏蔽功能， 同时， 由于所述各向异性导电胶在沿第一屏蔽层 101 的厚度方向以外的方向上均绝缘， 从而可避免使各电子元件 3 短路， 影响屏蔽电路板的正常使用。
优选地， 由于聚对苯二曱酸乙二醇酯具有较高的可塑性， 且化 学性质和尺寸稳定，使得屏蔽膜 1可通过热塑成型等成型工艺制造， 在电路板 2及电子元件 3上形成贴合电子元件 3 的屏蔽膜 1, 且形 成的屏蔽膜 1外形固定， 不易变形， 由于热塑成型工艺可一次性使 屏蔽膜 1形成与电子元件 3的外形相适应的外形， 不需要对屏蔽膜 1进行再次加工， 可简化生产过程， 提高屏蔽膜 1 的生产效率。 另， 聚酰亚胺具有较高的绝缘性和热稳定性， 可在厚度较低的情况下使 屏蔽层 102与电子元件隔离， 有利于减小屏蔽膜 1 的厚度， 因此， 第一绝缘层 101 的材质可选用聚酰亚胺， 第二绝缘层 103的材质可 选用聚对苯二曱酸乙二醇酯， 既有利于减小产品厚度， 又有利于在 电路板 2上安装屏蔽膜 1。
优选地， 由于铜的导电率较高， 对电磁干扰的屏蔽作用较好， 且成本较低， 易于成型， 因此， 优选铜作为屏蔽层 102 的主要材料。
具体地，第一绝缘层 101 的材质选用聚酰亚胺，第二绝缘层 103 的材质选用聚对苯二曱酸乙二醇酯， 屏蔽层 102 的材质选用铜， 第 一绝缘层 101 的厚度可设置在 8-40 μ m之间， 第二绝缘层 103的厚 度可设置在 80-120μηι之间， 屏蔽层 102 的厚度可设置在 1-5 μ m之 间。 在此厚度范围内， 屏蔽膜 1 的可塑性较好， 有利于通过热塑成 型等工艺根据电子元件 3的外形尺寸直接制造出贴合电子元件 3的 屏蔽膜 1。
当然， 本实施例中所述的屏蔽膜可以包括实施例一所述的任一 屏蔽膜， 具体可参考实施例一所述的屏蔽膜， 在此不再赘述。
实施例三
参照图 6, 图 6为本发明实施例屏蔽电路板的一个具体实施例， 本实施例所述的屏蔽电路板包括：
屏蔽膜 1, 屏蔽膜 1 包括第一绝缘层 101和屏蔽层 102, 屏蔽层 102设置于第一绝缘层 101 上， 第一绝缘层 101 为柔性绝缘材质或 各向异性导电材质， 所述屏蔽层 102为导电或导磁材质；
电路板 2, 电路板 2上设有电子元件 3, 屏蔽膜 1覆盖于电子元 件 3上， 第一绝缘层 101可以与电路板 2的电子元件 3的上表面贴 合， 屏蔽膜 1与电路板 2 的接地焊盘 4连接， 屏蔽层 102与接地焊 盘 4导通， 电子元件 3位于屏蔽膜 1、 电路板 2和电路板 2 的接地 焊盘 4形成的屏蔽腔内。
为了进一步减小电路板在安装屏蔽膜 1后的尺寸， 可将屏蔽膜 1 完全包覆于电子元件 3 的外表面， 即第一绝缘层 101 与电子元件 3上表面贴合的同时还与电子元件 3 的侧面贴合。 从而可消除在屏 蔽膜 1和电子元件 3的侧面间的间隙， 可通过屏蔽膜 1将不同的电 子元件隔离开， 使得电路板 2上的电子元件 3的排布可更加紧凑， 进一步缩小电路板 2在安装屏蔽膜 1后的尺寸， 有利于实现屏蔽电 路板的小型化。
进一步地， 屏蔽膜 1 还包括第二绝缘层 103, 第二绝缘层 103 为柔性绝缘材质，屏蔽层 102位于第一绝缘层 101和第二绝缘层 103 之间。
其中， 第一绝缘层 101 的材质可选用聚酰亚胺、 聚氯乙烯、 聚 萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶、 各向异性导电胶中 的任一种。
其中， 第二绝缘层 103 的材质可选用聚酰亚胺、 聚对苯二曱酸 乙二醇酯、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
其中， 屏蔽层 102 的材质可为单质金属铜、 镍、 铬、 铝、 银、 金、 铁、 锡中的任一种， 不锈钢， 或者由所述单质金属组成的任一 种合金。
屏蔽层 102与接地焊盘 4 的导通方式可为多种， 例如： 当第一 绝缘层 101 的材料选用聚酰亚胺时， 由于聚酰亚胺为绝缘材料， 因 此， 为了使屏蔽层 102与接地焊盘导通， 可在第一绝缘层 101上与 接地焊盘 4 对应的位置开设开口 （ 图中未示出 ）， 将屏蔽膜 1 通过 热压方式与接地焊盘 4连接后， 屏蔽层 102在所述开口处可与接地 焊盘 4导通。
当第一绝缘层 101 的材料为各向异性导电胶时， 可将屏蔽膜 1 通过热压方式与接地焊盘 4连接， 由于各向异性导电胶热压后， 在 热压区域沿第一屏蔽层 101 的厚度方向导电， 因此， 屏蔽层 102可 通过第一绝缘层 101 的各向异性导电胶与接地焊盘 4导通， 从而实 现电磁屏蔽功能， 同时， 由于所述各向异性导电胶在沿第一屏蔽层 101 的厚度方向以外的方向上均绝缘， 从而可避免使各电子元件 3 短路， 影响屏蔽电路板的正常使用。 优选地， 由于聚酰亚胺具有较高的绝缘性和热稳定性， 可在厚 度较低的情况下使屏蔽层 102与电子元件隔离， 可使屏蔽膜 1 的整 体厚度进一步减薄， 柔性进一步增大， 从而可通过抽真空技术， 将 屏蔽膜 1贴附在各电子元件 3的表面上， 使屏蔽膜 1与各电子元件 3 的贴合的更为紧密， 此外， 抽真空技术的操作简单， 效率较高， 使得屏蔽膜 1 的安装效率得以提升。 因此， 第一绝缘层 101 与第二 绝缘层 103的材质均可选用聚酰亚胺。
优选地， 由于铜的导电率较高， 对电磁干扰的屏蔽作用较好， 且成本较低， 易于成型， 因此， 优选铜作为屏蔽层 102 的主要材料。
具体地， 第一绝缘层 101和第二绝缘层 103均可选用聚酰亚胺 材质，屏蔽层 102的材质选用铜，第一绝缘层 101和第二绝缘层 103 厚度均在 8-15 μ m之间， 屏蔽层 102的厚度可设置在 1 -5 μ m之间。 在此厚度范围内， 屏蔽膜 1 的整体厚度较薄， 柔性较大， 有利于通 过抽真空技术将屏蔽膜 1 贴附在电子元件 3 的表面 （ 即电子元件 3 的上表面和侧面）。
当然， 本实施例中所述的屏蔽膜可以包括实施例一所述的任一 屏蔽膜， 具体可参考实施例一所述的屏蔽膜， 在此不再赘述。
实施例四
参照图 7, 图 7为本发明实施例屏蔽电路板的一个具体实施例， 本实施例所述的屏蔽电路板包括：
屏蔽膜 1, 屏蔽膜 1 包括第一绝缘层 101和屏蔽层 102, 屏蔽层 102设置于第一绝缘层 101 上， 第一绝缘层 101 为柔性绝缘材质或 各向异性导电材质， 所述屏蔽层 102为导电或导磁材质；
电路板 2, 电路板 2上设有电子元件 3, 屏蔽膜 1覆盖于电子元 件 3上， 第一绝缘层 101可以与电路板 2的电子元件 3的上表面贴 合， 屏蔽膜 1与电路板 2 的接地焊盘 4连接， 屏蔽层 102与接地焊 盘 4导通， 电子元件 3位于屏蔽膜 1、 电路板 2和电路板 2 的接地 焊盘 4形成的屏蔽腔内。
进一步地， 屏蔽膜 1 还包括第二绝缘层 103, 第二绝缘层 103 为柔性绝缘材质，屏蔽层 102位于第一绝缘层 101和第二绝缘层 103 之间。
其中， 第一绝缘层 101 的材质可选用聚酰亚胺、 聚氯乙烯、 聚 萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶、 各向异性导电胶中 的任一种。
其中， 第二绝缘层 103 的材质可选用聚酰亚胺、 聚对苯二曱酸 乙二醇酯、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
其中， 屏蔽层 102 的材质可为单质金属铜、 镍、 铬、 铝、 银、 金、 铁、 锡中的任一种， 不锈钢， 或者由所述单质金属组成的任一 种合金。
为了进一步减小电路板在安装屏蔽膜 1后的尺寸， 可将屏蔽膜 1 完全包覆于电子元件 3 的外表面， 即第一绝缘层 101 与电子元件 3 的上表面贴合的同时还与电子元件 3 的侧面贴合。 从而可消除在 屏蔽膜 1和电子元件 3的侧面间的间隙， 可通过屏蔽膜 1将不同的 电子元件隔离开，使得电路板 2上的电子元件 3的排布可更加紧凑， 进一步缩小电路板 2在安装屏蔽膜 1后的尺寸， 有利于实现屏蔽电 路板的小型化。
屏蔽层 102与接地焊盘 4 的导通方式可为多种， 例如： 当第一 绝缘层 101 的材料选用聚酰亚胺时， 由于聚酰亚胺为绝缘材料， 因 此， 为了使屏蔽层 102与接地焊盘导通， 可在第一绝缘层 101上与 接地焊盘 4 对应的位置开设开口 （ 图中未示出 ）， 将屏蔽膜 1 通过 热压方式与接地焊盘 4连接后， 屏蔽层 102在所述开口处可与接地 焊盘 4导通。
当第一绝缘层 101 的材料为各向异性导电胶时， 可将屏蔽膜 1 通过热压方式与接地焊盘 4连接， 由于各向异性导电胶热压后， 在 热压区域沿第一屏蔽层 101 的厚度方向导电， 因此， 屏蔽层 102可 通过第一绝缘层 101 的各向异性导电胶与接地焊盘 4导通， 从而实 现电磁屏蔽功能， 同时， 由于所述各向异性导电胶在沿第一屏蔽层 101 的厚度方向以外的方向上均绝缘， 从而可避免使各电子元件 3 短路， 影响屏蔽电路板的正常使用。
由于所述屏蔽电路板在使用过程中， 若电子元件 3有多个， 各 电子元件 3 与外界之间以及各电子元件 3 之间均可能产生电磁干 扰， 因此， 为了进一步提高电磁屏蔽效果， 可在电路板 2上各电子 元件 3之间的位置均设置接地焊盘 4, 当第一绝缘层 101 的材料选 用聚酰亚胺时， 可将屏蔽膜 1 完全包覆于电子元件 3的外表面， 即 第一绝缘层 101 与电子元件 3 的上表面贴合的同时还与电子元件 3 的侧面贴合。 屏蔽膜 1可以与电子元件 3件的接地焊盘 4连接， 屏 蔽层 102与接地焊盘 4导通， 这样屏蔽膜 1、 电路板 2及接地焊盘 4 可以围成多个屏蔽腔， 各电子元件 3分别位于各屏蔽腔内， 不仅 可避免电子元件 3与外界的电磁干扰， 同时还可屏蔽各电子元件 3 间的电磁干扰。 由此， 进一步提高了屏蔽效果。
具体的， 第一绝缘层 101上与各电子元件 3 间的接地焊盘 4对 应的位置可以均开设有开口， 将屏蔽膜 1通过热压方式与各电子元 件 3 间的接地焊盘 4连接， 屏蔽层 102与接地焊盘 4导通。 屏蔽层 102在各所述开口处与各电子元件 3 间的接地焊盘 4导通， 使得各 电子元件 3 的外表面被屏蔽膜 1 包覆， 从而可由屏蔽膜 1、 电路板 2及接地焊盘 4 围成多个屏蔽腔， 各电子元件 3分别位于各屏蔽腔 内， 不仅可避免电子元件 3与外界的电磁干扰， 同时还可屏蔽各电 子元件 3 间的电磁干扰。 由此， 进一步提高了屏蔽效果。
当第一绝缘层 101 的材料为各向异性导电胶时， 由于各向异性 导电胶在热压的情况下， 在热压区域沿第一屏蔽层 101 的厚度方向 上导电， 因此， 可将第一绝缘层 101通过热压方式与各电子元件间 的接地焊盘 4连接，在屏蔽膜 1 的厚度方向上，通过第一绝缘层 101 的各向异性导电胶将屏蔽层 102与接地焊盘 4导通， 同样可使得各 电子元件 3 的外表面被屏蔽膜 1 包覆， 从而可由屏蔽膜 1、 电路板 2及接地焊盘 4 围成多个屏蔽腔， 各电子元件 3分别位于各所述屏 蔽腔内， 不仅可避免电子元件 3与外界的电磁干扰， 同时还可屏蔽 各电子元件 3 间的电磁干扰。 由此， 进一步提高了屏蔽效果。
优选地， 由于聚酰亚胺具有较高的绝缘性和热稳定性， 可在厚 度较低的情况先使屏蔽层 102与电子元件 3隔离， 可使屏蔽膜 1 的 整体厚度进一步减薄， 柔性进一步增大， 从而使得可通过抽真空技 术， 将屏蔽膜 1贴附在各电子元件 3的表面上， 使屏蔽膜 1与各电 子元件 3的贴合的更为紧密， 可进一步减小产品的厚度， 此外， 抽 真空技术的操作简单， 效率较高， 使得屏蔽膜 1 的安装效率得以提 升。 因此， 第一绝缘层 101与第二绝缘层 103的材质均可选用聚酰 亚胺。
优选地， 由于铜的导电率较高， 对电磁干扰的屏蔽作用较好， 且成本较低， 易于成型， 因此， 优选铜作为屏蔽层 102 的主要材料。
当第一绝缘层 101 和第二绝缘层 103均为聚酰亚胺材质， 屏蔽 层 102 的材质选用铜时， 第一绝缘层 101和第二绝缘层 103厚度均 在 8- 15 μ m之间， 屏蔽层 102 的厚度可设置在 1 -5 μ m之间。 在此 厚度范围内， 屏蔽膜 1 的整体厚度较薄， 柔性较大， 有利于通过抽 真空技术将屏蔽膜 1 完全贴附在电子元件 3的表面。
当然， 本实施例中所述的屏蔽膜可以包括实施例一所述的任一 屏蔽膜， 具体可参考实施例一所述的屏蔽膜， 在此不再赘述。
本发明实施例还提供了一种终端设备， 包括屏蔽电路板。 其中 屏蔽电路板可以参考实施例二至实施例四的描述。 屏蔽膜可以参考 实施例一的描述。 在此， 不再重述。
其中， 终端设备可以为手机、 穿戴式设备、 眼镜设备或导航设 备等需要对电子元件进行屏蔽的终端设备。
在本说明书的描述中， 具体特征、 结构、 材料或者特点可以在 任何的一个或多个实施例或示例中以合适的方式结合。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围 并不局限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技 术范围内， 可轻易想到变化或替换， 都应涵盖在本发明的保护范围 之内。

Claims

权 利 要 求 书
1、 一种屏蔽膜， 其特征在于， 包括第一绝缘层和屏蔽层， 所述 屏蔽层设置在所述第一绝缘层上， 所述第一绝缘层为柔性绝缘材质 或各向异性导电材质， 所述屏蔽层为导电或导磁材质。
2、 根据权利要求 1 所述的屏蔽膜， 其特征在于， 还包括第二绝 缘层， 所述第二绝缘层为柔性绝缘材质， 所述屏蔽层位于所述第一 绝缘层和第二绝缘层之间。
3、 根据权利要求 1 所述的屏蔽膜， 其特征在于， 所述第一绝缘 层的材质为聚酰亚胺、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙 烯、 芳纶、 涤纶、 各向异性导电胶中的任一种。
4、 根据权利要求 2所述的屏蔽膜， 其特征在于， 所述第二绝缘 层的材质为聚酰亚胺、 聚对苯二曱酸乙二醇酯、 聚氯乙烯、 聚萘二 曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
5、 根据权利要求 1 所述的屏蔽膜， 其特征在于， 所述屏蔽层为 金属薄片或金属涂层。
6、 根据权利要求 1 所述的屏蔽膜， 其特征在于， 所述屏蔽层的 材质可为单质金属铜、 镍、 铬、 铝、 银、 金、 铁、 锡中的任一种， 不锈钢， 或者由所述单质金属组成的任一种合金。
7、 根据权利要求 6所述的屏蔽膜， 其特征在于， 所述屏蔽层的 厚度在 1 _ 5 μηι之间。
8、 根据权利要求 2所述的屏蔽膜， 其特征在于， 还包括离型纸， 所述离型纸贴附于所述第二绝缘层上。
9、 一种屏蔽电路板， 其特征在于， 包括：
屏蔽膜， 所述屏蔽膜包括第一绝缘层和屏蔽层， 所述屏蔽层设置 在所述第一绝缘层上， 所述第一绝缘层为柔性绝缘材质或各向异性 导电材质， 所述屏蔽层为导电或导磁材质；
电路板， 所述电路板上设有电子元件， 所述屏蔽膜覆盖于所述电 子元件的上表面， 所述第一绝缘层与所述电路板的电子元件的上表 面贴合， 所述屏蔽膜与所述电路板的接地焊盘连接， 所述屏蔽层与 所述接地焊盘导通， 所述电子元件位于所述屏蔽膜、 所述电路板和 所述电路板的接地焊盘形成的屏蔽腔内。
10、 根据权利要求 9所述的屏蔽电路板， 其特征在于， 所述屏蔽 膜还包括第二绝缘层， 所述第二绝缘层为柔性绝缘材质， 所述屏蔽 层位于所述第一绝缘层和第二绝缘层之间。
11、 根据权利要求 9所述的屏蔽电路板， 其特征在于， 所述第一 绝缘层的材质为聚酰亚胺、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四 氟乙烯、 芳纶、 涤纶、 各向异性导电胶中的任一种。
12、 根据权利要求 10所述的屏蔽电路板， 其特征在于， 所述第 二绝缘层的材质为聚酰亚胺、 聚对苯二曱酸乙二醇酯、 聚氯乙烯、 聚萘二曱酸乙二醇酯、 聚四氟乙烯、 芳纶、 涤纶中的任一种。
13、 根据权利要求 9所述的屏蔽电路板， 其特征在于， 所述第一 绝缘层的材质为聚酰亚胺， 所述第一绝缘层上与所述接地焊盘对应 的位置开设有开口， 所述屏蔽膜通过热压方式与所述接地焊盘连接， 所述屏蔽层在所述开口处与所述接地焊盘导通。
14、 根据权利要求 9-13 中任一项所述的屏蔽电路板， 其特征在 于， 所述第一绝缘层还与所述电子元件的侧面贴合。
15、 根据权利要求 10所述的屏蔽电路板， 其特征在于， 所述第 一绝缘层的材质为聚酰亚胺， 所述第二绝缘层的材质为聚对苯二曱 酸乙二醇酯。
16、 根据权利要求 15所述的屏蔽电路板， 其特征在于， 所述第一绝 缘层的厚度在 8-40 μ m之间， 所述第二绝缘层的厚度在 80-120 μ m之 间。
17、 根据权利要求 10所述的屏蔽电路板， 其特征在于， 所述第 一绝缘层和所述第二绝缘层的材质为聚酰亚胺。
18、 根据权利要求 17所述的屏蔽电路板， 其特征在于， 所述第 一绝缘层和所述第二绝缘层的厚度均在 8-15 μ m之间。
19、 一种终端设备， 其特征在于， 包括权利要求 9-18任一所述 的屏蔽电路板。
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