AU2001242793A1 - Semiconductor device and fabrication method therefor - Google Patents

Semiconductor device and fabrication method therefor

Info

Publication number
AU2001242793A1
AU2001242793A1 AU2001242793A AU4279301A AU2001242793A1 AU 2001242793 A1 AU2001242793 A1 AU 2001242793A1 AU 2001242793 A AU2001242793 A AU 2001242793A AU 4279301 A AU4279301 A AU 4279301A AU 2001242793 A1 AU2001242793 A1 AU 2001242793A1
Authority
AU
Australia
Prior art keywords
semiconductor device
method therefor
fabrication method
fabrication
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001242793A
Other languages
English (en)
Inventor
Shinji Ohsawa
Hiroaki Okamoto
Kinji Saijo
Tadatomo Suga
Kazuo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Publication of AU2001242793A1 publication Critical patent/AU2001242793A1/en
Abandoned legal-status Critical Current

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    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
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AU2001242793A 2000-04-19 2001-03-27 Semiconductor device and fabrication method therefor Abandoned AU2001242793A1 (en)

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PCT/JP2001/002437 WO2001080299A1 (fr) 2000-04-19 2001-03-27 Dispositif semi-conducteur et son procede de fabrication

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CN1425191A (zh) 2003-06-18
EP1291906A4 (en) 2005-08-31
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CN1194394C (zh) 2005-03-23
DE60140362D1 (de) 2009-12-17
US7183190B2 (en) 2007-02-27
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US20030155662A1 (en) 2003-08-21

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