ATE54341T1 - Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren. - Google Patents
Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren.Info
- Publication number
- ATE54341T1 ATE54341T1 AT86104253T AT86104253T ATE54341T1 AT E54341 T1 ATE54341 T1 AT E54341T1 AT 86104253 T AT86104253 T AT 86104253T AT 86104253 T AT86104253 T AT 86104253T AT E54341 T1 ATE54341 T1 AT E54341T1
- Authority
- AT
- Austria
- Prior art keywords
- members
- microwave energy
- photoconductive
- semiconductor parts
- layer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000151 deposition Methods 0.000 abstract 5
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 3
- 230000000903 blocking effect Effects 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 239000012495 reaction gas Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 150000001793 charged compounds Chemical class 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000010849 ion bombardment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/02—Charge-receiving layers
- G03G5/04—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
- G03G5/08—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
- G03G5/082—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
- G03G5/08214—Silicon-based
- G03G5/08235—Silicon-based comprising three or four silicon-based layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/02—Charge-receiving layers
- G03G5/04—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
- G03G5/08—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
- G03G5/082—Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
- G03G5/08214—Silicon-based
- G03G5/08278—Depositing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/095—Devices sensitive to infrared, visible or ultraviolet radiation comprising amorphous semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Photoreceptors In Electrophotography (AREA)
- Photovoltaic Devices (AREA)
- Electronic Switches (AREA)
- Light Receiving Elements (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Electrodes Of Semiconductors (AREA)
- Conductive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/734,576 US4619729A (en) | 1984-02-14 | 1985-05-15 | Microwave method of making semiconductor members |
EP86104253A EP0204907B1 (de) | 1985-05-15 | 1986-03-27 | Mikrowellenvorrichtung und Verfahren zur Herstellung von Halbleiterteilen und Halbleiterteile nach diesem Verfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE54341T1 true ATE54341T1 (de) | 1990-07-15 |
Family
ID=24952243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT86104253T ATE54341T1 (de) | 1985-05-15 | 1986-03-27 | Mikrowellenvorrichtung und verfahren zur herstellung von halbleiterteilen und halbleiterteile nach diesem verfahren. |
Country Status (12)
Country | Link |
---|---|
US (1) | US4619729A (de) |
EP (1) | EP0204907B1 (de) |
JP (1) | JPH0693431B2 (de) |
AT (1) | ATE54341T1 (de) |
AU (1) | AU572395B2 (de) |
BR (1) | BR8602112A (de) |
CA (1) | CA1244964A (de) |
DE (1) | DE3672398D1 (de) |
IE (1) | IE57299B1 (de) |
IN (1) | IN166431B (de) |
MX (1) | MX167077B (de) |
ZA (1) | ZA862694B (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756924A (en) * | 1984-11-05 | 1988-07-12 | Energy Conversion Devices, Inc. | Method for the microwave fabrication of boron doped semiconductor materials |
US4808555A (en) * | 1986-07-10 | 1989-02-28 | Motorola, Inc. | Multiple step formation of conductive material layers |
JPS63293167A (ja) * | 1987-05-26 | 1988-11-30 | Canon Inc | マイクロ波プラズマcvd法による機能性堆積膜形成法 |
US4891330A (en) * | 1987-07-27 | 1990-01-02 | Energy Conversion Devices, Inc. | Method of fabricating n-type and p-type microcrystalline semiconductor alloy material including band gap widening elements |
US5016565A (en) * | 1988-09-01 | 1991-05-21 | Canon Kabushiki Kaisha | Microwave plasma chemical vapor deposition apparatus for forming functional deposited film with means for stabilizing plasma discharge |
US5129359A (en) * | 1988-11-15 | 1992-07-14 | Canon Kabushiki Kaisha | Microwave plasma CVD apparatus for the formation of functional deposited film with discharge space provided with gas feed device capable of applying bias voltage between the gas feed device and substrate |
US5114770A (en) * | 1989-06-28 | 1992-05-19 | Canon Kabushiki Kaisha | Method for continuously forming functional deposited films with a large area by a microwave plasma cvd method |
US5130170A (en) * | 1989-06-28 | 1992-07-14 | Canon Kabushiki Kaisha | Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation |
JP2824808B2 (ja) * | 1990-11-16 | 1998-11-18 | キヤノン株式会社 | マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する装置 |
JP2841243B2 (ja) * | 1990-11-19 | 1998-12-24 | キヤノン株式会社 | マイクロ波プラズマcvd法による堆積膜形成装置 |
US5629054A (en) * | 1990-11-20 | 1997-05-13 | Canon Kabushiki Kaisha | Method for continuously forming a functional deposit film of large area by micro-wave plasma CVD method |
US5314780A (en) | 1991-02-28 | 1994-05-24 | Canon Kabushiki Kaisha | Method for treating metal substrate for electro-photographic photosensitive member and method for manufacturing electrophotographic photosensitive member |
US5204272A (en) * | 1991-12-13 | 1993-04-20 | United Solar Systems Corporation | Semiconductor device and microwave process for its manufacture |
US5256576A (en) * | 1992-02-14 | 1993-10-26 | United Solar Systems Corporation | Method of making pin junction semiconductor device with RF deposited intrinsic buffer layer |
JP3102722B2 (ja) * | 1993-03-23 | 2000-10-23 | キヤノン株式会社 | アモルファスシリコン系電子写真用感光体の製造方法 |
JP3102721B2 (ja) * | 1993-03-23 | 2000-10-23 | キヤノン株式会社 | 電子写真感光体の製造方法 |
JP3563789B2 (ja) | 1993-12-22 | 2004-09-08 | キヤノン株式会社 | 電子写真感光体の製造方法及び該製造方法に用いられる治具 |
JP3630831B2 (ja) * | 1995-04-03 | 2005-03-23 | キヤノン株式会社 | 堆積膜の形成方法 |
US6096389A (en) * | 1995-09-14 | 2000-08-01 | Canon Kabushiki Kaisha | Method and apparatus for forming a deposited film using a microwave CVD process |
US6316111B1 (en) * | 1996-03-01 | 2001-11-13 | Cardinal Cg Company | Heat-emperable coated glass article |
US6231999B1 (en) * | 1996-06-21 | 2001-05-15 | Cardinal Ig Company | Heat temperable transparent coated glass article |
US6435130B1 (en) | 1996-08-22 | 2002-08-20 | Canon Kabushiki Kaisha | Plasma CVD apparatus and plasma processing method |
FR2764309B1 (fr) * | 1997-06-06 | 1999-08-27 | Corning Inc | Procede de creation d'une couche de silicium sur une surface |
US6156472A (en) * | 1997-11-06 | 2000-12-05 | Canon Kabushiki Kaisha | Method of manufacturing electrophotographic photosensitive member |
US6406554B1 (en) | 1997-12-26 | 2002-06-18 | Canon Kabushiki Kaisha | Method and apparatus for producing electrophotographic photosensitive member |
JP3890153B2 (ja) * | 1997-12-26 | 2007-03-07 | キヤノン株式会社 | 電子写真感光体の製造方法及び製造装置 |
JP2000162789A (ja) | 1997-12-26 | 2000-06-16 | Canon Inc | 基体の洗浄方法および洗浄装置 |
JP3658257B2 (ja) | 1998-12-24 | 2005-06-08 | キヤノン株式会社 | 洗浄方法及び洗浄装置及び電子写真感光体及び電子写真感光体の製造方法 |
EP1754691B1 (de) | 1999-12-02 | 2009-02-11 | Cardinal CG Company | Gegen Anlaufen beständiges durchsichtiges Beschichtungssystem |
JP3477148B2 (ja) | 1999-12-02 | 2003-12-10 | カーディナル・シージー・カンパニー | 耐曇り性透明フィルム積層体 |
WO2003074442A1 (en) * | 2002-03-01 | 2003-09-12 | Cardinal Cg Company | Thin film coating having transparent base layer |
US6919133B2 (en) | 2002-03-01 | 2005-07-19 | Cardinal Cg Company | Thin film coating having transparent base layer |
US7557364B2 (en) * | 2004-05-25 | 2009-07-07 | Panasonic Corporation | Charge neutralizing device |
ATE460271T1 (de) * | 2005-03-31 | 2010-03-15 | Cardinal Cg Co | Gegen anlaufen beständige beschichtungen mit geringem emissionsvermögen |
EP1899040A2 (de) * | 2005-06-22 | 2008-03-19 | Advanced Technology Materials, Inc. | Vorrichtung und verfahren zur integrierten gasmischung |
CN103170447B (zh) | 2005-08-30 | 2015-02-18 | 先进科技材料公司 | 使用替代的氟化含硼前驱体的硼离子注入和用于注入的大氢化硼的形成 |
US7342716B2 (en) | 2005-10-11 | 2008-03-11 | Cardinal Cg Company | Multiple cavity low-emissivity coatings |
US7572511B2 (en) * | 2005-10-11 | 2009-08-11 | Cardinal Cg Company | High infrared reflection coatings |
US7339728B2 (en) * | 2005-10-11 | 2008-03-04 | Cardinal Cg Company | Low-emissivity coatings having high visible transmission and low solar heat gain coefficient |
SG188150A1 (en) | 2008-02-11 | 2013-03-28 | Advanced Tech Materials | Ion source cleaning in semiconductor processing systems |
US20110021011A1 (en) | 2009-07-23 | 2011-01-27 | Advanced Technology Materials, Inc. | Carbon materials for carbon implantation |
US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
WO2013109582A1 (en) | 2012-01-17 | 2013-07-25 | Cardinal Cg Company | Low solar transmittance coatings |
US9469566B2 (en) | 2015-03-20 | 2016-10-18 | Cardinal Cg Company | Nickel-aluminum blocker film low-emissivity coatings |
US9752377B2 (en) | 2015-03-20 | 2017-09-05 | Cardinal Cg Company | Nickel-aluminum blocker film controlled transmission coating |
US9745792B2 (en) | 2015-03-20 | 2017-08-29 | Cardinal Cg Company | Nickel-aluminum blocker film multiple cavity controlled transmission coating |
KR20210120732A (ko) * | 2020-03-27 | 2021-10-07 | (주)포인트엔지니어링 | 양극산화막 구조체 및 이를 포함하는 프로브 헤드 및 이를 포함하는 프로브 카드 |
KR20210131691A (ko) * | 2020-04-24 | 2021-11-03 | (주)포인트엔지니어링 | 적층형 양극산화막 구조체 및 이를 이용한 프로브 카드의 가이드 플레이트 및 이를 구비하는 프로브 카드 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217374A (en) | 1978-03-08 | 1980-08-12 | Energy Conversion Devices, Inc. | Amorphous semiconductors equivalent to crystalline semiconductors |
US4226898A (en) | 1978-03-16 | 1980-10-07 | Energy Conversion Devices, Inc. | Amorphous semiconductors equivalent to crystalline semiconductors produced by a glow discharge process |
US4363828A (en) * | 1979-12-12 | 1982-12-14 | International Business Machines Corp. | Method for depositing silicon films and related materials by a glow discharge in a disiland or higher order silane gas |
US4464415A (en) * | 1980-03-03 | 1984-08-07 | Shunpei Yamazaki | Photoelectric conversion semiconductor manufacturing method |
JPS574053A (en) * | 1980-06-09 | 1982-01-09 | Canon Inc | Photoconductive member |
US4394425A (en) * | 1980-09-12 | 1983-07-19 | Canon Kabushiki Kaisha | Photoconductive member with α-Si(C) barrier layer |
US4394426A (en) * | 1980-09-25 | 1983-07-19 | Canon Kabushiki Kaisha | Photoconductive member with α-Si(N) barrier layer |
JPS5779621A (en) * | 1980-11-05 | 1982-05-18 | Mitsubishi Electric Corp | Plasma processing device |
US4443488A (en) * | 1981-10-19 | 1984-04-17 | Spire Corporation | Plasma ion deposition process |
US4483911A (en) * | 1981-12-28 | 1984-11-20 | Canon Kabushiki Kaisha | Photoconductive member with amorphous silicon-carbon surface layer |
US4439463A (en) * | 1982-02-18 | 1984-03-27 | Atlantic Richfield Company | Plasma assisted deposition system |
JPH0635323B2 (ja) * | 1982-06-25 | 1994-05-11 | 株式会社日立製作所 | 表面処理方法 |
US4517223A (en) * | 1982-09-24 | 1985-05-14 | Sovonics Solar Systems | Method of making amorphous semiconductor alloys and devices using microwave energy |
US4515107A (en) | 1982-11-12 | 1985-05-07 | Sovonics Solar Systems | Apparatus for the manufacture of photovoltaic devices |
JPS59172716A (ja) * | 1983-03-23 | 1984-09-29 | Oki Electric Ind Co Ltd | 半導体製造方法 |
US4533564A (en) * | 1983-09-07 | 1985-08-06 | Oki Electric Industry Co., Ltd. | Method of manufacturing an electrophotographic photoreceptor |
EP0151754B1 (de) * | 1984-02-14 | 1991-12-18 | Energy Conversion Devices, Inc. | Verfahren zur Herstellung eines fotoleitfähigen Elementes |
JPH0652716B2 (ja) * | 1984-08-24 | 1994-07-06 | 日本電信電話株式会社 | 半導体結晶性膜製造装置 |
-
1985
- 1985-05-15 US US06/734,576 patent/US4619729A/en not_active Expired - Lifetime
-
1986
- 1986-03-27 EP EP86104253A patent/EP0204907B1/de not_active Expired - Lifetime
- 1986-03-27 DE DE8686104253T patent/DE3672398D1/de not_active Expired - Fee Related
- 1986-03-27 AT AT86104253T patent/ATE54341T1/de not_active IP Right Cessation
- 1986-04-02 CA CA000505668A patent/CA1244964A/en not_active Expired
- 1986-04-02 IE IE863/86A patent/IE57299B1/en unknown
- 1986-04-03 IN IN309/DEL/86A patent/IN166431B/en unknown
- 1986-04-10 ZA ZA862694A patent/ZA862694B/xx unknown
- 1986-05-08 AU AU57257/86A patent/AU572395B2/en not_active Ceased
- 1986-05-12 BR BR8602112A patent/BR8602112A/pt not_active IP Right Cessation
- 1986-05-15 JP JP61111781A patent/JPH0693431B2/ja not_active Expired - Lifetime
- 1986-05-15 MX MX002467A patent/MX167077B/es unknown
Also Published As
Publication number | Publication date |
---|---|
DE3672398D1 (de) | 1990-08-09 |
CA1244964A (en) | 1988-11-15 |
IE57299B1 (en) | 1992-07-15 |
JPS61283116A (ja) | 1986-12-13 |
JPH0693431B2 (ja) | 1994-11-16 |
EP0204907A2 (de) | 1986-12-17 |
BR8602112A (pt) | 1987-01-13 |
US4619729A (en) | 1986-10-28 |
IN166431B (de) | 1990-05-05 |
EP0204907A3 (en) | 1987-08-26 |
ZA862694B (en) | 1986-12-30 |
MX167077B (es) | 1993-03-02 |
EP0204907B1 (de) | 1990-07-04 |
AU572395B2 (en) | 1988-05-05 |
AU5725786A (en) | 1986-11-20 |
IE860863L (en) | 1986-11-15 |
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