ATE523803T1 - Herstellungsverfahren für eine optoelektrische hybridplatte - Google Patents

Herstellungsverfahren für eine optoelektrische hybridplatte

Info

Publication number
ATE523803T1
ATE523803T1 AT09158611T AT09158611T ATE523803T1 AT E523803 T1 ATE523803 T1 AT E523803T1 AT 09158611 T AT09158611 T AT 09158611T AT 09158611 T AT09158611 T AT 09158611T AT E523803 T1 ATE523803 T1 AT E523803T1
Authority
AT
Austria
Prior art keywords
core
optical waveguide
production method
optical element
optical
Prior art date
Application number
AT09158611T
Other languages
English (en)
Inventor
Masayuki Hodono
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE523803T1 publication Critical patent/ATE523803T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Structure Of Printed Boards (AREA)
AT09158611T 2008-04-24 2009-04-23 Herstellungsverfahren für eine optoelektrische hybridplatte ATE523803T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008114329A JP5055193B2 (ja) 2008-04-24 2008-04-24 光電気混載基板の製造方法

Publications (1)

Publication Number Publication Date
ATE523803T1 true ATE523803T1 (de) 2011-09-15

Family

ID=40901955

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09158611T ATE523803T1 (de) 2008-04-24 2009-04-23 Herstellungsverfahren für eine optoelektrische hybridplatte

Country Status (6)

Country Link
US (1) US8142672B2 (de)
EP (1) EP2112534B1 (de)
JP (1) JP5055193B2 (de)
KR (1) KR101560404B1 (de)
CN (1) CN101566706B (de)
AT (1) ATE523803T1 (de)

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JP4796615B2 (ja) * 2008-11-26 2011-10-19 日東電工株式会社 光電気混載基板およびその製造方法
JP5653745B2 (ja) * 2010-12-22 2015-01-14 日東電工株式会社 光導波路の製法
JP2012155215A (ja) * 2011-01-27 2012-08-16 Nitto Denko Corp 光導波路の製法およびそれに用いられる光導波路体
JP5696538B2 (ja) * 2011-03-15 2015-04-08 住友ベークライト株式会社 光電気混載基板の製造方法
JP2012208306A (ja) * 2011-03-29 2012-10-25 Nitto Denko Corp 光電気混載基板およびその製法
WO2013095426A1 (en) 2011-12-21 2013-06-27 Intel Corporation Fabrication of planar light-wave circuits (plcs) for optical i/o
WO2013101112A1 (en) 2011-12-29 2013-07-04 Intel Corporation Two-dimensional, high-density optical connector
US9507086B2 (en) 2011-12-30 2016-11-29 Intel Corporation Optical I/O system using planar light-wave integrated circuit
JP5840988B2 (ja) 2012-03-16 2016-01-06 日東電工株式会社 光電気混載基板およびその製法
JP5840989B2 (ja) 2012-03-16 2016-01-06 日東電工株式会社 光電気混載基板およびその製法
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CN103389546B (zh) * 2012-05-08 2016-12-07 鸿富锦精密工业（深圳）有限公司 光纤模组
JP6081086B2 (ja) * 2012-06-14 2017-02-15 Tdk株式会社 光電素子用実装装置及び実装方法
JP6045829B2 (ja) * 2012-07-13 2016-12-14 日東電工株式会社 光電気混載基板
JP6202662B2 (ja) 2012-11-27 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP6048241B2 (ja) * 2013-03-18 2016-12-21 富士通株式会社 光伝送装置の製造方法及び製造装置、並びに光伝送装置
CN104101958B (zh) * 2013-04-03 2017-10-03 赛恩倍吉科技顾问（深圳）有限公司 光通讯装置
JP2014216377A (ja) * 2013-04-23 2014-11-17 イビデン株式会社 電子部品とその製造方法及び多層プリント配線板の製造方法
TWI572933B (zh) * 2013-05-20 2017-03-01 鴻海精密工業股份有限公司 光通訊裝置
JP6245569B2 (ja) 2013-06-06 2017-12-13 日東電工株式会社 光電気混載基板
AT514599B1 (de) * 2013-07-05 2015-02-15 Melecs Ews Gmbh & Co Kg Verfahren zur Bestückung elektronischer Leiterplatten mit optischen Bauelementen
JP6202566B2 (ja) 2013-10-29 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
US10634325B2 (en) 2014-08-04 2020-04-28 Fuji Corporation Mounting device
JP6525240B2 (ja) * 2014-10-24 2019-06-05 日東電工株式会社 光電気混載基板およびその製法
JP6460515B2 (ja) 2014-10-24 2019-01-30 日東電工株式会社 光電気混載基板およびその製法
JP6460516B2 (ja) 2014-10-28 2019-01-30 日東電工株式会社 光電気混載基板
JP6653857B2 (ja) 2014-11-25 2020-02-26 日東電工株式会社 光電気混載基板およびその製法
CN104698552B (zh) * 2015-03-16 2016-05-11 中国航天科技集团公司第九研究院第七七一研究所 一种用于航天器和军用计算机上的光互连基板及其制造方法
DE102015207709A1 (de) * 2015-04-27 2016-10-27 Automotive Lighting Reutlingen Gmbh Verfahren und Vorrichtung zur Anordnung eines Schaltungsträgers mit einer Halbleiterlichtquelle in einer bestimmten Lage relativ zu einem optischen System einer Beleuchtungseinrichtung
JP6649076B2 (ja) * 2015-10-26 2020-02-19 京セラ株式会社 光回路基板の製造方法
US9739942B2 (en) * 2015-10-26 2017-08-22 Kyocera Corporation Method for manufacturing optical circuit board
JP7002886B2 (ja) * 2017-08-22 2022-01-20 日東電工株式会社 光導波路、光電気混載基板、および光電気混載モジュール
JP6677232B2 (ja) * 2017-09-29 2020-04-08 日亜化学工業株式会社 発光装置の製造方法
JP7489756B2 (ja) 2018-07-25 2024-05-24 日東電工株式会社 光学素子装置およびその製造方法
US10775573B1 (en) * 2019-04-03 2020-09-15 International Business Machines Corporation Embedding mirror with metal particle coating
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Also Published As

Publication number Publication date
EP2112534B1 (de) 2011-09-07
KR101560404B1 (ko) 2015-10-14
US20090269704A1 (en) 2009-10-29
KR20090112585A (ko) 2009-10-28
JP2009265342A (ja) 2009-11-12
CN101566706A (zh) 2009-10-28
JP5055193B2 (ja) 2012-10-24
US8142672B2 (en) 2012-03-27
EP2112534A1 (de) 2009-10-28
CN101566706B (zh) 2012-10-10

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Legal Events

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