JP6460515B2 - 光電気混載基板およびその製法 - Google Patents
光電気混載基板およびその製法 Download PDFInfo
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- JP6460515B2 JP6460515B2 JP2014217132A JP2014217132A JP6460515B2 JP 6460515 B2 JP6460515 B2 JP 6460515B2 JP 2014217132 A JP2014217132 A JP 2014217132A JP 2014217132 A JP2014217132 A JP 2014217132A JP 6460515 B2 JP6460515 B2 JP 6460515B2
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- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
<アンダークラッド層6、オーバークラッド層8、第2の補強層20(下部20a+上部20b)の形成材料>
脂環骨格を含むエポキシ樹脂(ダイセル化学工業社製、EHPE3150) 20重量部
液状長鎖二官能半脂肪族エポキシ樹脂(DIC社製、EXA−4816) 80重量部
光酸発生剤(ADEKA社製、SP170) 2重量部
乳酸エチル(武蔵野化学研究所社製) 40重量部
<コア7の形成材料>
o−クレゾールノボラックグリシジルエーテル(新日鐵住金化学社製、YDCN−700−10) 50重量部
ビスフェノキシエタノールフルオレンジグリシジルエーテル(大阪ガスケミカル社製、オグゾールEG) 50重量部
光酸発生剤(ADEKA社製、SP170) 1重量部
乳酸エチル(武蔵野化学研究所社製) 50重量部
W 光導波路
1 絶縁層
2 電気配線
9 金属補強層
10 光電気混載基板
20 第2の補強層
Claims (6)
- 絶縁層の表面に電気配線が形成された電気回路基板と、上記電気回路基板の裏面側に部分的に形成された金属補強層と、同じく上記電気回路基板の裏面側と部分的に重なる配置で設けられた光導波路とを備えた光電気混載基板であって、上記電気回路基板裏面側の、上記光導波路が形成されていない部分を利用して、第2の補強層が、上記光導波路の外面と上記第2の補強層との間に隙間がある配置で形成されていることを特徴とする光電気混載基板。
- 上記第2の補強層が、光導波路のクラッド層と同一材料で形成されている請求項1記載の光電気混載基板。
- 上記第2の補強層が、金属板もしくは繊維強化樹脂板で形成されている請求項1記載の光電気混載基板。
- 請求項1記載の光電気混載基板の製法であって、金属補強層の表面に絶縁層を形成し、この絶縁層の表面に電気配線を形成して電気回路基板を得る工程と、上記金属補強層の不用な部分を除去し、その除去部から電気回路基板の裏面を部分的に露呈させる工程と、上記電気回路基板の裏面側と部分的に重なる配置で光導波路を形成する工程と、上記電気回路基板裏面側の、上記光導波路が形成されていない部分を利用して、第2の補強層を、上記光導波路の外面と上記第2の補強層との間に隙間がある配置で形成する工程とを備えたことを特徴とする光電気混載基板の製法。
- 上記光導波路を形成する工程が、アンダークラッド層とコア層とオーバークラッド層とをこの順で形成して積層する工程であり、上記アンダークラッド層の形成時に、上記電気回路基板裏面側に、上記アンダークラッド層と同一材料を用いて第2の補強層の下部を形成し、上記オーバークラッド層の形成時に、上記第2の補強層の下部の上に、上記オーバークラッド層と同一材料を用いて第2の補強層の上部を形成することにより、第2の補強層を得るようにした請求項4記載の光電気混載基板の製法。
- 上記光導波路を形成する工程終了後、上記電気回路基板裏面側に、金属板もしくは繊維強化樹脂板を貼付することにより、第2の補強層を得るようにした請求項4記載の光電気混載基板の製法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014217132A JP6460515B2 (ja) | 2014-10-24 | 2014-10-24 | 光電気混載基板およびその製法 |
TW104133249A TWI670536B (zh) | 2014-10-24 | 2015-10-08 | 光電混合基板及其製法 |
KR1020177008697A KR102523319B1 (ko) | 2014-10-24 | 2015-10-09 | 광전기 혼재 기판 및 그 제법 |
PCT/JP2015/078819 WO2016063751A1 (ja) | 2014-10-24 | 2015-10-09 | 光電気混載基板およびその製法 |
US15/516,737 US10353161B2 (en) | 2014-10-24 | 2015-10-09 | Opto-electric hybrid board and method of manufacturing same |
CN201580053229.4A CN107076925B (zh) | 2014-10-24 | 2015-10-09 | 光电混载基板及其制造方法 |
Applications Claiming Priority (1)
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JP2014217132A JP6460515B2 (ja) | 2014-10-24 | 2014-10-24 | 光電気混載基板およびその製法 |
Publications (2)
Publication Number | Publication Date |
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JP2016085314A JP2016085314A (ja) | 2016-05-19 |
JP6460515B2 true JP6460515B2 (ja) | 2019-01-30 |
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JP2014217132A Active JP6460515B2 (ja) | 2014-10-24 | 2014-10-24 | 光電気混載基板およびその製法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10353161B2 (ja) |
JP (1) | JP6460515B2 (ja) |
KR (1) | KR102523319B1 (ja) |
CN (1) | CN107076925B (ja) |
TW (1) | TWI670536B (ja) |
WO (1) | WO2016063751A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7002886B2 (ja) * | 2017-08-22 | 2022-01-20 | 日東電工株式会社 | 光導波路、光電気混載基板、および光電気混載モジュール |
JP7258486B2 (ja) * | 2018-07-25 | 2023-04-17 | 日東電工株式会社 | 光導波路部材コネクタおよびその製造方法 |
JP2021028664A (ja) * | 2019-08-09 | 2021-02-25 | 日東電工株式会社 | 光電気複合伝送モジュール |
JPWO2021161915A1 (ja) * | 2020-02-12 | 2021-08-19 | ||
WO2021235192A1 (ja) * | 2020-05-22 | 2021-11-25 | 日東電工株式会社 | 光電気混載基板 |
JPWO2021261428A1 (ja) * | 2020-06-22 | 2021-12-30 | ||
TWI750755B (zh) | 2020-07-31 | 2021-12-21 | 頎邦科技股份有限公司 | 軟性電路板之佈線結構 |
Family Cites Families (19)
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JPH05281428A (ja) * | 1992-03-30 | 1993-10-29 | Nippon Telegr & Teleph Corp <Ntt> | 光インターコネクションボード及び光導波路 |
JP5055193B2 (ja) | 2008-04-24 | 2012-10-24 | 日東電工株式会社 | 光電気混載基板の製造方法 |
JP5281428B2 (ja) | 2009-02-05 | 2013-09-04 | 株式会社オーディオテクニカ | マイクロホン |
JP5271141B2 (ja) * | 2009-04-06 | 2013-08-21 | 日東電工株式会社 | 光電気混載モジュールの製造方法およびそれによって得られた光電気混載モジュール |
JP2010266598A (ja) * | 2009-05-13 | 2010-11-25 | Hitachi Cable Ltd | 光配線部材 |
JP2010276676A (ja) * | 2009-05-26 | 2010-12-09 | Hitachi Cable Ltd | 複合配線部材 |
JP2010286777A (ja) | 2009-06-15 | 2010-12-24 | Toshiba Corp | 光電気配線フィルム及び光電気配線モジュール |
JP5313849B2 (ja) * | 2009-11-30 | 2013-10-09 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
JP2011192851A (ja) * | 2010-03-15 | 2011-09-29 | Omron Corp | 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法 |
US9149188B2 (en) * | 2010-07-01 | 2015-10-06 | Shenzhen Mindray Bio-Medical Electronics Co. Ltd. | Systems and methods for synchronizing data received from multiple sensor modules in a patient monitor system |
JP2012042731A (ja) * | 2010-08-19 | 2012-03-01 | Toshiba Corp | フレキシブル光電配線板及びフレキシブル光電配線モジュール |
JP5664905B2 (ja) | 2011-01-18 | 2015-02-04 | 日立金属株式会社 | 光電変換モジュール |
JP5614725B2 (ja) * | 2011-02-04 | 2014-10-29 | 日立金属株式会社 | 光モジュール |
JP2012194401A (ja) | 2011-03-16 | 2012-10-11 | Nitto Denko Corp | 光電気混載基板およびその製法 |
US9304268B2 (en) * | 2012-01-12 | 2016-04-05 | Tyco Electronics Corporation | Optical interposer with ninety degree light bending |
JP5840988B2 (ja) | 2012-03-16 | 2016-01-06 | 日東電工株式会社 | 光電気混載基板およびその製法 |
JP5840989B2 (ja) * | 2012-03-16 | 2016-01-06 | 日東電工株式会社 | 光電気混載基板およびその製法 |
JP5877749B2 (ja) * | 2012-03-29 | 2016-03-08 | 日東電工株式会社 | 光電気混載基板の製法 |
JP6202662B2 (ja) * | 2012-11-27 | 2017-09-27 | 日東電工株式会社 | 光電気混載基板およびその製法 |
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2014
- 2014-10-24 JP JP2014217132A patent/JP6460515B2/ja active Active
-
2015
- 2015-10-08 TW TW104133249A patent/TWI670536B/zh active
- 2015-10-09 CN CN201580053229.4A patent/CN107076925B/zh active Active
- 2015-10-09 KR KR1020177008697A patent/KR102523319B1/ko active IP Right Grant
- 2015-10-09 WO PCT/JP2015/078819 patent/WO2016063751A1/ja active Application Filing
- 2015-10-09 US US15/516,737 patent/US10353161B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI670536B (zh) | 2019-09-01 |
KR20170076655A (ko) | 2017-07-04 |
JP2016085314A (ja) | 2016-05-19 |
TW201626015A (zh) | 2016-07-16 |
CN107076925A (zh) | 2017-08-18 |
US20170285284A1 (en) | 2017-10-05 |
CN107076925B (zh) | 2020-05-22 |
WO2016063751A1 (ja) | 2016-04-28 |
US10353161B2 (en) | 2019-07-16 |
KR102523319B1 (ko) | 2023-04-18 |
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