ATE499460T1 - Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung - Google Patents

Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung

Info

Publication number
ATE499460T1
ATE499460T1 AT03736007T AT03736007T ATE499460T1 AT E499460 T1 ATE499460 T1 AT E499460T1 AT 03736007 T AT03736007 T AT 03736007T AT 03736007 T AT03736007 T AT 03736007T AT E499460 T1 ATE499460 T1 AT E499460T1
Authority
AT
Austria
Prior art keywords
copper
tin alloy
bath
pyrophosphoric acid
acid bath
Prior art date
Application number
AT03736007T
Other languages
English (en)
Inventor
Kazuya Urata
Kunio Tachibana
Naoyuki Oniwa
Mikiya Tajima
Yukio Ogawa
Original Assignee
Nihon New Chrome Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon New Chrome Co Ltd filed Critical Nihon New Chrome Co Ltd
Application granted granted Critical
Publication of ATE499460T1 publication Critical patent/ATE499460T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
AT03736007T 2002-07-05 2003-05-20 Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung ATE499460T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002197597A JP4249438B2 (ja) 2002-07-05 2002-07-05 銅―錫合金めっき用ピロリン酸浴
PCT/JP2003/006262 WO2004005528A2 (en) 2002-07-05 2003-05-20 Pyrophosphoric acid bath for use in copper-tin alloy plating

Publications (1)

Publication Number Publication Date
ATE499460T1 true ATE499460T1 (de) 2011-03-15

Family

ID=30112404

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03736007T ATE499460T1 (de) 2002-07-05 2003-05-20 Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung

Country Status (13)

Country Link
US (1) US7150781B2 (de)
EP (1) EP1540043B1 (de)
JP (1) JP4249438B2 (de)
KR (1) KR100883131B1 (de)
CN (1) CN100480434C (de)
AT (1) ATE499460T1 (de)
AU (1) AU2003237637A1 (de)
BR (1) BR0312416B1 (de)
DE (1) DE60336145D1 (de)
ES (1) ES2363703T3 (de)
HK (1) HK1081239A1 (de)
TW (1) TWI308938B (de)
WO (1) WO2004005528A2 (de)

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CN102220610B (zh) * 2011-07-29 2012-12-05 福州大学 一种无氰型铜锡合金电镀液
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JP5505392B2 (ja) 2011-10-04 2014-05-28 株式会社デンソー 複合材料、及びこれを用いた電気接点電極、電気接点皮膜、導電性フィラー、電気接点構造、並びに複合材料の製造方法
US20130178726A1 (en) * 2012-01-05 2013-07-11 Medtronic Minimed, Inc. Stabilized polymers for use with analyte sensors and methods for making and using them
JP6119053B2 (ja) * 2012-04-19 2017-04-26 ディップソール株式会社 銅−ニッケル合金電気めっき浴及びめっき方法
CN103668359B (zh) * 2012-09-06 2016-03-02 上海造币有限公司 一种多层无氰电镀铜-锡合金镀层的电镀液、电镀工艺及其硬币
CN102953098B (zh) * 2012-11-20 2016-06-01 广东致卓精密金属科技有限公司 一种碱性溶液电镀白铜锡电镀液及工艺
JP6101510B2 (ja) * 2013-02-18 2017-03-22 株式会社シミズ 非シアン銅−錫合金めっき浴
KR101583913B1 (ko) * 2014-03-21 2016-01-11 (주)쎄론트 내변색성이 우수한 도금액 조성물
CN104152955A (zh) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 碱性溶液电镀光亮白铜锡电镀液及工艺
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US9725816B2 (en) * 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
KR101994248B1 (ko) * 2015-04-28 2019-06-28 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 전기 도금욕에 대한 첨가제로서 모노아민 및 비스안하이드라이드의 반응 생성물과 디아민의 반응 생성물
JP6621169B2 (ja) * 2015-04-28 2019-12-18 オーエム産業株式会社 めっき品の製造方法
EP3141633B1 (de) * 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Kupferplattierungsbadzusammensetzung
CN107278058A (zh) * 2016-04-08 2017-10-20 东莞市斯坦得电子材料有限公司 一种用于印制线路板埋孔、盲孔填孔镀铜的工艺
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CN106544707B (zh) * 2016-12-09 2018-10-02 济南大学 钢芯酸性亚铜亚锡电镀阶梯仿金青铜
CN109989076A (zh) * 2017-12-29 2019-07-09 广东东硕科技有限公司 一种整平剂
KR20220101895A (ko) 2021-01-12 2022-07-19 강원대학교산학협력단 항균성 향상을 위한 구리주석 합금 도금액 조성물
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Also Published As

Publication number Publication date
AU2003237637A8 (en) 2004-01-23
US20050166790A1 (en) 2005-08-04
TW200413577A (en) 2004-08-01
CN100480434C (zh) 2009-04-22
AU2003237637A1 (en) 2004-01-23
JP2004035980A (ja) 2004-02-05
HK1081239A1 (en) 2006-05-12
US7150781B2 (en) 2006-12-19
CN1665965A (zh) 2005-09-07
WO2004005528A2 (en) 2004-01-15
BR0312416A (pt) 2007-06-19
WO2004005528A3 (en) 2005-04-14
DE60336145D1 (de) 2011-04-07
EP1540043A2 (de) 2005-06-15
KR100883131B1 (ko) 2009-02-10
JP4249438B2 (ja) 2009-04-02
KR20050016622A (ko) 2005-02-21
ES2363703T3 (es) 2011-08-12
BR0312416B1 (pt) 2012-09-18
EP1540043B1 (de) 2011-02-23
TWI308938B (en) 2009-04-21

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