ATE499460T1 - Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung - Google Patents

Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung

Info

Publication number
ATE499460T1
ATE499460T1 AT03736007T AT03736007T ATE499460T1 AT E499460 T1 ATE499460 T1 AT E499460T1 AT 03736007 T AT03736007 T AT 03736007T AT 03736007 T AT03736007 T AT 03736007T AT E499460 T1 ATE499460 T1 AT E499460T1
Authority
AT
Austria
Prior art keywords
copper
tin alloy
bath
pyrophosphoric acid
acid bath
Prior art date
Application number
AT03736007T
Other languages
English (en)
Inventor
Kazuya Urata
Kunio Tachibana
Naoyuki Oniwa
Mikiya Tajima
Yukio Ogawa
Original Assignee
Nihon New Chrome Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon New Chrome Co Ltd filed Critical Nihon New Chrome Co Ltd
Application granted granted Critical
Publication of ATE499460T1 publication Critical patent/ATE499460T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
AT03736007T 2002-07-05 2003-05-20 Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung ATE499460T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002197597A JP4249438B2 (ja) 2002-07-05 2002-07-05 銅―錫合金めっき用ピロリン酸浴
PCT/JP2003/006262 WO2004005528A2 (en) 2002-07-05 2003-05-20 Pyrophosphoric acid bath for use in copper-tin alloy plating

Publications (1)

Publication Number Publication Date
ATE499460T1 true ATE499460T1 (de) 2011-03-15

Family

ID=30112404

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03736007T ATE499460T1 (de) 2002-07-05 2003-05-20 Pyrophosphorsäurebad zur verwendung bei der galvanisierung mit kupfer-zinn-legierung

Country Status (12)

Country Link
US (1) US7150781B2 (de)
EP (1) EP1540043B1 (de)
JP (1) JP4249438B2 (de)
KR (1) KR100883131B1 (de)
CN (1) CN100480434C (de)
AT (1) ATE499460T1 (de)
AU (1) AU2003237637A1 (de)
BR (1) BR0312416B1 (de)
DE (1) DE60336145D1 (de)
ES (1) ES2363703T3 (de)
TW (1) TWI308938B (de)
WO (1) WO2004005528A2 (de)

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US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
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CN102953098B (zh) * 2012-11-20 2016-06-01 广东致卓精密金属科技有限公司 一种碱性溶液电镀白铜锡电镀液及工艺
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US9611560B2 (en) * 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
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CN109989076A (zh) * 2017-12-29 2019-07-09 广东东硕科技有限公司 一种整平剂
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Also Published As

Publication number Publication date
CN100480434C (zh) 2009-04-22
WO2004005528A3 (en) 2005-04-14
DE60336145D1 (de) 2011-04-07
BR0312416A (pt) 2007-06-19
TW200413577A (en) 2004-08-01
TWI308938B (en) 2009-04-21
CN1665965A (zh) 2005-09-07
AU2003237637A8 (en) 2004-01-23
BR0312416B1 (pt) 2012-09-18
KR20050016622A (ko) 2005-02-21
US7150781B2 (en) 2006-12-19
US20050166790A1 (en) 2005-08-04
KR100883131B1 (ko) 2009-02-10
AU2003237637A1 (en) 2004-01-23
EP1540043A2 (de) 2005-06-15
EP1540043B1 (de) 2011-02-23
JP2004035980A (ja) 2004-02-05
HK1081239A1 (zh) 2006-05-12
ES2363703T3 (es) 2011-08-12
JP4249438B2 (ja) 2009-04-02
WO2004005528A2 (en) 2004-01-15

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