ATE435933T1 - Verbesserte metallbandgalvanisierung - Google Patents

Verbesserte metallbandgalvanisierung

Info

Publication number
ATE435933T1
ATE435933T1 AT04804475T AT04804475T ATE435933T1 AT E435933 T1 ATE435933 T1 AT E435933T1 AT 04804475 T AT04804475 T AT 04804475T AT 04804475 T AT04804475 T AT 04804475T AT E435933 T1 ATE435933 T1 AT E435933T1
Authority
AT
Austria
Prior art keywords
strip
metal strip
improved metal
tin
electroplating solution
Prior art date
Application number
AT04804475T
Other languages
English (en)
Inventor
Kokkie Schnetz
Vreugd Daniel De
Eric Wijnbeek
Jacques Wijenberg
Original Assignee
Corus Staal Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corus Staal Bv filed Critical Corus Staal Bv
Application granted granted Critical
Publication of ATE435933T1 publication Critical patent/ATE435933T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
AT04804475T 2003-12-23 2004-12-23 Verbesserte metallbandgalvanisierung ATE435933T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03078988 2003-12-23
PCT/EP2004/014894 WO2005064043A2 (en) 2003-12-23 2004-12-23 Improved metal strip electroplating

Publications (1)

Publication Number Publication Date
ATE435933T1 true ATE435933T1 (de) 2009-07-15

Family

ID=34717202

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04804475T ATE435933T1 (de) 2003-12-23 2004-12-23 Verbesserte metallbandgalvanisierung

Country Status (15)

Country Link
US (1) US20070227632A1 (de)
EP (1) EP1699949B1 (de)
JP (1) JP2007515557A (de)
KR (1) KR20060127076A (de)
CN (1) CN1918328A (de)
AT (1) ATE435933T1 (de)
AU (1) AU2004309087B2 (de)
BR (1) BRPI0418111A (de)
CA (1) CA2551273A1 (de)
DE (1) DE602004021961D1 (de)
ES (1) ES2327239T3 (de)
MX (1) MXPA06007170A (de)
PT (1) PT1699949E (de)
RU (1) RU2374363C2 (de)
WO (1) WO2005064043A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4902346B2 (ja) * 2006-12-28 2012-03-21 Ｊｆｅスチール株式会社 Ｓｎメッキ用電極支持体及びその使用方法
FR2918674B1 (fr) * 2007-07-12 2010-10-01 Siemens Vai Metals Tech Sas Installation et procede pour l'etamage electrolytique de bandes d'acier mettant en oeuvre une anode soluble
JP5884169B2 (ja) * 2012-03-01 2016-03-15 Ｊｆｅスチール株式会社 電気めっき鋼板の製造ラインの自溶性電極の消費量自動監視システム及び方法
JP5900213B2 (ja) * 2012-07-18 2016-04-06 Ｊｆｅスチール株式会社 電気めっき鋼板の製造装置
JP6084112B2 (ja) * 2013-05-09 2017-02-22 株式会社荏原製作所 Ｓｎ合金めっき装置およびＳｎ合金めっき方法
WO2015011130A1 (en) * 2013-07-26 2015-01-29 Tata Steel Ijmuiden B.V. Anode system for use in an electroplating cell for the coating of a moving metal strip and a method using said anode system
JP6233334B2 (ja) * 2015-03-04 2017-11-22 Ｊｆｅスチール株式会社 方向性電磁鋼帯の連続電解エッチング方法および方向性電磁鋼帯の連続電解エッチング装置
CN105696059B (zh) * 2016-02-02 2018-03-06 上海大学 磁场下高强高导铜‑纳米碳管复合材料的制备方法及装置
CN107740173B (zh) * 2017-09-15 2020-12-15 首钢京唐钢铁联合有限责任公司 一种高锡量镀锡板的边部质量控制方法
EP3540098A3 (de) 2018-03-16 2019-11-06 Airbus Defence and Space GmbH Vorrichtung und verfahren zur kontinuierlichen metallisierung eines objekts
EP3763850A1 (de) 2019-07-10 2021-01-13 Tata Steel IJmuiden B.V. Anode und verfahren zur elektrolytischen abscheidung einer metallschicht auf ein metallsubstrat
CN214612819U (zh) * 2021-03-25 2021-11-05 宁德时代新能源科技股份有限公司 一种过滤机构及用于生产导电材料的设备
CN116516445A (zh) * 2022-11-28 2023-08-01 粤海中粤(中山)马口铁工业有限公司 可溶性阳极的边部屏蔽装置及方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE20788E (en) * 1930-02-04 1938-07-12 Method of plating steel
US2690424A (en) * 1950-11-20 1954-09-28 Nat Steel Corp Apparatus for reduction of heavy edge coating in electroplating
US2719820A (en) * 1951-01-26 1955-10-04 United States Steel Corp Method for coating steel strip
US3300396A (en) * 1965-11-24 1967-01-24 Charles T Walker Electroplating techniques and anode assemblies therefor
US4164454A (en) * 1977-11-01 1979-08-14 Borg-Warner Corporation Continuous line for plating on metal strip material
US4367125A (en) * 1979-03-21 1983-01-04 Republic Steel Corporation Apparatus and method for plating metallic strip
JPS62151593A (ja) * 1985-12-25 1987-07-06 Nippon Kokan Kk <Nkk> 金属ストリツプの連続電気メツキ装置
JPH01159400A (ja) * 1987-12-16 1989-06-22 Kawasaki Steel Corp 電気錫めっき装置
NL8801511A (nl) * 1988-06-14 1990-01-02 Hoogovens Groep Bv Werkwijze voor het elektrolytisch bekleden van een metalen substraat met een metalen bekledingslaag.
JPH0459997A (ja) * 1990-06-27 1992-02-26 Kawasaki Steel Corp 金属ストリップの電解処理装置および電解処理方法
US5454929A (en) * 1994-06-16 1995-10-03 National Semiconductor Corporation Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
FR2725215B1 (fr) * 1994-09-29 1996-11-22 Lorraine Laminage Cellule d'electrodeposition en continu d'alliages metalliques
JPH08313223A (ja) * 1995-05-16 1996-11-29 Ls Electro Galvanizing Co 移動ストリップを監視する方法と装置
US6280596B1 (en) * 1995-05-23 2001-08-28 Weirton Steel Corporation Electrolytic tinplating of steel substrate and apparatus
JPH0971894A (ja) * 1995-09-01 1997-03-18 Kawasaki Steel Corp 鋼帯の電気メッキ方法
JP3103753B2 (ja) * 1995-10-13 2000-10-30 株式会社イデヤ 帯状部材のめっき装置
US5804053A (en) * 1995-12-07 1998-09-08 Eltech Systems Corporation Continuously electroplated foam of improved weight distribution
JP3528453B2 (ja) * 1996-08-23 2004-05-17 Ｊｆｅスチール株式会社 金属ストリップの片面連続電気めっき装置
US5776327A (en) * 1996-10-16 1998-07-07 Mitsubishi Semiconuctor Americe, Inc. Method and apparatus using an anode basket for electroplating a workpiece

Also Published As

Publication number Publication date
EP1699949B1 (de) 2009-07-08
EP1699949A2 (de) 2006-09-13
DE602004021961D1 (de) 2009-08-20
WO2005064043A2 (en) 2005-07-14
RU2374363C2 (ru) 2009-11-27
RU2006126703A (ru) 2008-01-27
BRPI0418111A (pt) 2007-04-17
CN1918328A (zh) 2007-02-21
MXPA06007170A (es) 2006-09-04
KR20060127076A (ko) 2006-12-11
AU2004309087A1 (en) 2005-07-14
CA2551273A1 (en) 2005-07-14
JP2007515557A (ja) 2007-06-14
ES2327239T3 (es) 2009-10-27
WO2005064043A3 (en) 2005-09-09
US20070227632A1 (en) 2007-10-04
AU2004309087B2 (en) 2009-10-22
PT1699949E (pt) 2009-08-03

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