ATE443266T1 - Stromsensor - Google Patents

Stromsensor

Info

Publication number
ATE443266T1
ATE443266T1 AT06770974T AT06770974T ATE443266T1 AT E443266 T1 ATE443266 T1 AT E443266T1 AT 06770974 T AT06770974 T AT 06770974T AT 06770974 T AT06770974 T AT 06770974T AT E443266 T1 ATE443266 T1 AT E443266T1
Authority
AT
Austria
Prior art keywords
substrate
conductor portion
current conductor
current sensor
integrated circuit
Prior art date
Application number
AT06770974T
Other languages
English (en)
Inventor
William P Taylor
Michael C Doogue
Nirmal Sharma
Jay Gagnon
Vijay Mangtani
Richard Dickinson
Andreas Friedrich
Original Assignee
Allegro Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/140,250 external-priority patent/US6995315B2/en
Priority claimed from US11/144,970 external-priority patent/US7166807B2/en
Priority claimed from US11/336,602 external-priority patent/US7075287B1/en
Priority claimed from US11/401,160 external-priority patent/US7476816B2/en
Application filed by Allegro Microsystems Inc filed Critical Allegro Microsystems Inc
Application granted granted Critical
Publication of ATE443266T1 publication Critical patent/ATE443266T1/de

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207Constructional details independent of the type of device used
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/202Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/41Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00Hall-effect devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/18Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/37099Material
    • H01L2224/371Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147Copper [Cu] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/3754Coating
    • H01L2224/37599Material
    • H01L2224/37686Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/3754Coating
    • H01L2224/37599Material
    • H01L2224/3769Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005Shape
    • H01L2224/4009Loop shape
    • H01L2224/40095Kinked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826Connecting between the body and an opposite side of the item with respect to the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73215Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73221Strap and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01024Chromium [Cr]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Hall/Mr Elements (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Fluid Pressure (AREA)
AT06770974T 2005-05-27 2006-05-23 Stromsensor ATE443266T1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/140,250 US6995315B2 (en) 2003-08-26 2005-05-27 Current sensor
US11/144,970 US7166807B2 (en) 2003-08-26 2005-06-03 Current sensor
US11/336,602 US7075287B1 (en) 2003-08-26 2006-01-20 Current sensor
US11/401,160 US7476816B2 (en) 2003-08-26 2006-04-10 Current sensor
US11/383,021 US20060219436A1 (en) 2003-08-26 2006-05-12 Current sensor
PCT/US2006/019953 WO2006130393A1 (en) 2005-05-27 2006-05-23 Current sensor

Publications (1)

Publication Number Publication Date
ATE443266T1 true ATE443266T1 (de) 2009-10-15

Family

ID=36955377

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06770974T ATE443266T1 (de) 2005-05-27 2006-05-23 Stromsensor

Country Status (7)

Country Link
US (2) US20060219436A1 (de)
EP (5) EP1891452B1 (de)
JP (1) JP5468776B2 (de)
KR (1) KR101231830B1 (de)
AT (1) ATE443266T1 (de)
DE (1) DE602006009256D1 (de)
WO (1) WO2006130393A1 (de)

Families Citing this family (176)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853178B2 (en) * 2000-06-19 2005-02-08 Texas Instruments Incorporated Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
US20060219436A1 (en) * 2003-08-26 2006-10-05 Taylor William P Current sensor
US7768083B2 (en) 2006-01-20 2010-08-03 Allegro Microsystems, Inc. Arrangements for an integrated sensor
US7573112B2 (en) * 2006-04-14 2009-08-11 Allegro Microsystems, Inc. Methods and apparatus for sensor having capacitor on chip
US7687882B2 (en) * 2006-04-14 2010-03-30 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
US20070279053A1 (en) * 2006-05-12 2007-12-06 Taylor William P Integrated current sensor
US20080013298A1 (en) 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US7936164B2 (en) * 2008-07-03 2011-05-03 Allegro Microsystems, Inc. Folding current sensor
US8093670B2 (en) 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US8063634B2 (en) * 2008-07-31 2011-11-22 Allegro Microsystems, Inc. Electronic circuit and method for resetting a magnetoresistance element
US20100052424A1 (en) * 2008-08-26 2010-03-04 Taylor William P Methods and apparatus for integrated circuit having integrated energy storage device
US9222992B2 (en) 2008-12-18 2015-12-29 Infineon Technologies Ag Magnetic field current sensors
US20110006763A1 (en) * 2009-07-07 2011-01-13 Anthonius Bakker Hall effect current sensor system and associated flip-chip packaging
EP2634592B1 (de) * 2009-07-22 2015-01-14 Allegro Microsystems, LLC Schaltungen und Verfahren zur Herstellung eines diagnostischen Betriebsmodus bei einem Magnetfeldsensor
CH702193A2 (de) * 2009-11-05 2011-05-13 Polycontact Ag Positionsmeldeeinrichtung.
JP5500956B2 (ja) * 2009-11-26 2014-05-21 本田技研工業株式会社 電流検出装置
DE102009047235A1 (de) * 2009-11-27 2011-06-01 Robert Bosch Gmbh Schaltungseinrichtung und Leistungsschaltkreis mit der Schaltungseinrichtung
US20110133732A1 (en) * 2009-12-03 2011-06-09 Allegro Microsystems, Inc. Methods and apparatus for enhanced frequency response of magnetic sensors
US8717016B2 (en) 2010-02-24 2014-05-06 Infineon Technologies Ag Current sensors and methods
US10111333B2 (en) * 2010-03-16 2018-10-23 Intersil Americas Inc. Molded power-supply module with bridge inductor over other components
US9013890B2 (en) 2010-03-26 2015-04-21 Infineon Technologies Ag Semiconductor packages and methods for producing the same
US8760149B2 (en) 2010-04-08 2014-06-24 Infineon Technologies Ag Magnetic field current sensors
US8461824B2 (en) * 2010-06-07 2013-06-11 Infineon Technologies Ag Current sensor
US8680843B2 (en) * 2010-06-10 2014-03-25 Infineon Technologies Ag Magnetic field current sensors
US8283742B2 (en) 2010-08-31 2012-10-09 Infineon Technologies, A.G. Thin-wafer current sensors
US9723766B2 (en) 2010-09-10 2017-08-01 Intersil Americas LLC Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides
RU2453853C2 (ru) * 2010-09-27 2012-06-20 Федеральное Государственное Унитарное Предприятие "Государственный научно-производственный ракетно-космический центр "ЦСКБ-Прогресс" (ФГУП "ГНПРКЦ "ЦСКБ-Прогресс") Способ измерения силы тока в проводнике и устройство для его осуществления
CH703903B1 (de) 2010-10-01 2014-04-30 Melexis Tessenderlo Nv Stromsensor.
JP5556603B2 (ja) * 2010-11-10 2014-07-23 三菱電機株式会社 磁気アイソレータ
US9103853B2 (en) 2010-11-18 2015-08-11 Infineon Technologies Ag Current sensor
US8878531B2 (en) 2010-11-18 2014-11-04 Infineon Technologies Ag Current sensor
US9476915B2 (en) 2010-12-09 2016-10-25 Infineon Technologies Ag Magnetic field current sensors
US8975889B2 (en) 2011-01-24 2015-03-10 Infineon Technologies Ag Current difference sensors, systems and methods
US8963536B2 (en) 2011-04-14 2015-02-24 Infineon Technologies Ag Current sensors, systems and methods for sensing current in a conductor
US8113412B1 (en) * 2011-05-13 2012-02-14 Taiwan Semiconductor Manufacturing Company, Ltd Methods for detecting defect connections between metal bumps
US8604777B2 (en) 2011-07-13 2013-12-10 Allegro Microsystems, Llc Current sensor with calibration for a current divider configuration
KR101503224B1 (ko) 2011-07-13 2015-03-16 아사히 가세이 일렉트로닉스 가부시끼가이샤 전류 센서용 기판 및 전류 센서
US8907437B2 (en) 2011-07-22 2014-12-09 Allegro Microsystems, Llc Reinforced isolation for current sensor with magnetic field transducer
JP5793059B2 (ja) * 2011-10-31 2015-10-14 旭化成エレクトロニクス株式会社 磁気センサ
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9000761B2 (en) * 2012-01-19 2015-04-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Hall-effect sensor isolator
TWI458992B (zh) 2012-02-02 2014-11-01 Delta Electronics Inc 整合式電流感測裝置
US9201122B2 (en) 2012-02-16 2015-12-01 Allegro Microsystems, Llc Circuits and methods using adjustable feedback for self-calibrating or self-testing a magnetic field sensor with an adjustable time constant
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9666788B2 (en) * 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
JP6256819B2 (ja) * 2012-03-29 2018-01-10 マレクシス テクノロジーズ エヌヴィー 電流センサ及び電流測定装置
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
JP6017182B2 (ja) * 2012-05-23 2016-10-26 旭化成エレクトロニクス株式会社 電流センサ
JP5911065B2 (ja) * 2012-06-12 2016-04-27 公立大学法人大阪市立大学 漏電検出装置
DE102012012759A1 (de) * 2012-06-27 2014-01-02 Sensitec Gmbh Anordnung zur Strommessung
US20150218722A1 (en) * 2012-08-28 2015-08-06 Hatch Pty Ltd Magnetic shielding for measuring a plurality of input and/or output currents to an electrolytic cell
US8860153B2 (en) 2012-11-30 2014-10-14 Infineon Technologies Ag Semiconductor packages, systems, and methods of formation thereof
US9482700B2 (en) * 2013-01-20 2016-11-01 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Current detector to sense current without being in series with conductor
US9176203B2 (en) * 2013-02-05 2015-11-03 Texas Instruments Incorporated Apparatus and method for in situ current measurement in a conductor
CH707687B1 (de) * 2013-03-08 2016-09-15 Melexis Technologies Nv Stromsensor.
US9190606B2 (en) 2013-03-15 2015-11-17 Allegro Micosystems, LLC Packaging for an electronic device
US10345343B2 (en) 2013-03-15 2019-07-09 Allegro Microsystems, Llc Current sensor isolation
US9523720B2 (en) 2013-03-15 2016-12-20 Infineon Technologies Ag Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
CH708052B1 (de) 2013-05-07 2016-09-15 Melexis Technologies Nv Vorrichtung zur Strommessung.
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
TWI504904B (zh) * 2013-07-30 2015-10-21 Asahi Kasei Microdevices Corp Current sensor
US10247759B2 (en) 2013-09-05 2019-04-02 Asahi Kasei Microdevices Corporation Current sensor
EP2884289A1 (de) 2013-12-10 2015-06-17 ams AG Chip-Stromsensorpaket und Herstellungsverfahren eines Stromsensorpakets
US9846180B2 (en) * 2013-12-11 2017-12-19 Eaton Corporation Current sensing assembly employing magnetic sensors
EP2905626B1 (de) 2014-02-05 2019-09-11 ams AG Integriertes Stromsensorsystem und Verfahren zur Herstellung eines integrierten Stromsensorsystems
US9645220B2 (en) 2014-04-17 2017-05-09 Allegro Microsystems, Llc Circuits and methods for self-calibrating or self-testing a magnetic field sensor using phase discrimination
US9735773B2 (en) 2014-04-29 2017-08-15 Allegro Microsystems, Llc Systems and methods for sensing current through a low-side field effect transistor
EP3163312B1 (de) * 2014-06-27 2019-05-22 Asahi Kasei Microdevices Corporation Stromsensor
USD812001S1 (en) 2014-08-27 2018-03-06 Lem Intellectual Property Sa Current transducer
USD766180S1 (en) * 2014-08-27 2016-09-13 Lem Intellectual Property Sa Current transducer
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9322887B1 (en) 2014-12-01 2016-04-26 Allegro Microsystems, Llc Magnetic field sensor with magnetoresistance elements and conductive-trace magnetic source
GB2533570A (en) * 2014-12-19 2016-06-29 Hall Element Devices Ltd Apparatus for measure of quantity and associated method of manufacturing
DE102015100991B4 (de) * 2015-01-23 2019-08-14 Infineon Technologies Ag Sensoranordnung, Schaltungsanordnung und Verfahren zum Herstellen einer Sensoranordnung
US9857398B2 (en) 2015-01-30 2018-01-02 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Inter-circuit board connector with current sensor
US9638764B2 (en) 2015-04-08 2017-05-02 Allegro Microsystems, Llc Electronic circuit for driving a hall effect element with a current compensated for substrate stress
JP6533101B2 (ja) * 2015-06-04 2019-06-19 アルプスアルパイン株式会社 電流センサ
US9470765B1 (en) 2015-08-07 2016-10-18 Allegro Microsystems, Llc Magnetic sensor having enhanced linearization by applied field angle rotation
US10411498B2 (en) 2015-10-21 2019-09-10 Allegro Microsystems, Llc Apparatus and methods for extending sensor integrated circuit operation through a power disturbance
JP6659350B2 (ja) * 2015-12-18 2020-03-04 旭化成エレクトロニクス株式会社 センサ装置および電流センサ
US9810721B2 (en) * 2015-12-23 2017-11-07 Melexis Technologies Sa Method of making a current sensor and current sensor
US10283699B2 (en) 2016-01-29 2019-05-07 Avago Technologies International Sales Pte. Limited Hall-effect sensor isolator
US10107873B2 (en) 2016-03-10 2018-10-23 Allegro Microsystems, Llc Electronic circuit for compensating a sensitivity drift of a hall effect element due to stress
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10162017B2 (en) 2016-07-12 2018-12-25 Allegro Microsystems, Llc Systems and methods for reducing high order hall plate sensitivity temperature coefficients
WO2018016510A1 (ja) 2016-07-22 2018-01-25 旭化成エレクトロニクス株式会社 電流センサ
US10247758B2 (en) 2016-08-08 2019-04-02 Allegro Microsystems, Llc Current sensor
US10114044B2 (en) 2016-08-08 2018-10-30 Allegro Microsystems, Llc Current sensor
JP6650045B2 (ja) * 2016-09-14 2020-02-19 旭化成エレクトロニクス株式会社 電流センサ
US10352969B2 (en) 2016-11-29 2019-07-16 Allegro Microsystems, Llc Systems and methods for integrated shielding in a current sensor
US10156614B2 (en) 2016-11-29 2018-12-18 Allegro Microsystems, Llc Systems and methods for sensing a voltage transient in a magnetic field sensor integrated circuit
JP7049102B2 (ja) * 2016-12-07 2022-04-06 旭化成エレクトロニクス株式会社 電流センサ
US10128434B2 (en) * 2016-12-09 2018-11-13 Rohm Co., Ltd. Hall element module
US10290554B2 (en) 2016-12-12 2019-05-14 Melexis Technologies Sa Current sensor and method of making a current sensor
CN106653999A (zh) * 2016-12-22 2017-05-10 上海南麟电子股份有限公司 一种单芯片霍尔电流传感器及其制备方法
US10481181B2 (en) * 2017-04-25 2019-11-19 Allegro Microsystems, Llc Systems and methods for current sensing
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US10557873B2 (en) 2017-07-19 2020-02-11 Allegro Microsystems, Llc Systems and methods for closed loop current sensing
US10520559B2 (en) 2017-08-14 2019-12-31 Allegro Microsystems, Llc Arrangements for Hall effect elements and vertical epi resistors upon a substrate
US10074713B1 (en) 2017-09-15 2018-09-11 Allegro Microsystems, Llc Signal isolator integrated circuit package
US11619658B2 (en) 2017-12-08 2023-04-04 Texas Instruments Incorporated Semiconductor integrated fluxgate device shielded by discrete magnetic plate
EP3508863B1 (de) * 2018-01-05 2023-06-07 Melexis Technologies SA Offsetstromsensorstruktur
US11525701B2 (en) 2018-01-22 2022-12-13 Melexis Technologies Sa Inductive position sensor
EP3514502B1 (de) 2018-01-22 2021-07-14 Melexis Technologies SA Induktiver positionssensor
EP3514559B1 (de) 2018-01-22 2021-08-25 Melexis Technologies SA Sensorpaket
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US10978897B2 (en) 2018-04-02 2021-04-13 Allegro Microsystems, Llc Systems and methods for suppressing undesirable voltage supply artifacts
DE102018207308B4 (de) * 2018-05-09 2020-07-02 Infineon Technologies Ag Halbleiterbauteil mit integriertem shunt-widerstand und verfahren zu dessen herstellung
JP7387706B2 (ja) * 2018-07-11 2023-11-28 レム・インターナショナル・エスエイ 一次導体が一体化された電流変換器
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10935612B2 (en) 2018-08-20 2021-03-02 Allegro Microsystems, Llc Current sensor having multiple sensitivity ranges
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
CN111487446B (zh) * 2019-01-25 2024-05-17 福禄克公司 电子测量设备
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US11131727B2 (en) * 2019-03-11 2021-09-28 Tdk Corporation Magnetic sensor device
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
US11047928B2 (en) 2019-07-15 2021-06-29 Allegro Microsystems, Llc Methods and apparatus for frequency effect compensation in magnetic field current sensors
US11029373B2 (en) 2019-07-16 2021-06-08 Allegro Microsystems, Llc Magnetic field sensors having a magnetic anti-aliasing filter
US10914765B1 (en) 2019-07-31 2021-02-09 Allegro Microsystems, Llc Multi-die integrated current sensor
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
WO2021039264A1 (ja) * 2019-08-26 2021-03-04 株式会社村田製作所 電流センサ
US11289406B2 (en) 2019-09-18 2022-03-29 Allegro Microsystems, Llc Signal isolator having enhanced creepage characteristics
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11024576B1 (en) * 2019-12-31 2021-06-01 Texas Instruments Incorporated Semiconductor package with underfill between a sensor coil and a semiconductor die
US11561112B2 (en) 2020-03-13 2023-01-24 Allegro Microsystems, Llc Current sensor having stray field immunity
US11169223B2 (en) 2020-03-23 2021-11-09 Allegro Microsystems, Llc Hall element signal calibrating in angle sensor
DE102020108880B4 (de) 2020-03-31 2024-05-08 Infineon Technologies Ag Sensorvorrichtungen mit Bypassstrompfad und zugehörige Herstellungsverfahren
GB2594294B (en) * 2020-04-21 2022-08-10 Paragraf Ltd Apparatus
WO2021220620A1 (ja) * 2020-04-30 2021-11-04 株式会社村田製作所 電流センサ
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11800813B2 (en) 2020-05-29 2023-10-24 Allegro Microsystems, Llc High isolation current sensor
EP3943952A1 (de) * 2020-07-24 2022-01-26 LEM International SA Stromwandler
US11519941B2 (en) * 2020-07-27 2022-12-06 Analog Devices International Unlimited Company Current sensing device having an integrated electrical shield
US11320466B1 (en) * 2020-10-29 2022-05-03 Allegro Microsystems, Llc Differential current sensor
JP7367657B2 (ja) 2020-11-10 2023-10-24 Tdk株式会社 電流センサ及び電気制御装置
US11366141B1 (en) * 2021-01-28 2022-06-21 Allegro Microsystems, Llc Multipath wide bandwidth current sensor
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11402409B1 (en) 2021-03-22 2022-08-02 Allegro Microsystems, Llc Differential current sensor package
US11567108B2 (en) 2021-03-31 2023-01-31 Allegro Microsystems, Llc Multi-gain channels for multi-range sensor
US11630130B2 (en) 2021-03-31 2023-04-18 Allegro Microsystems, Llc Channel sensitivity matching
US11768229B2 (en) 2021-08-23 2023-09-26 Allegro Microsystems, Llc Packaged current sensor integrated circuit
US11519946B1 (en) 2021-08-23 2022-12-06 Allegro Microsystems, Llc Packaged current sensor integrated circuit
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
CN113866475A (zh) * 2021-09-30 2021-12-31 意瑞半导体(上海)有限公司 电流传感器的引线框架及电流传感器
US11644485B2 (en) 2021-10-07 2023-05-09 Allegro Microsystems, Llc Current sensor integrated circuits
CN114137280A (zh) * 2021-11-26 2022-03-04 成都芯进电子有限公司 一种霍尔效应电流传感器
US11892476B2 (en) 2022-02-15 2024-02-06 Allegro Microsystems, Llc Current sensor package
US11821924B2 (en) 2022-03-02 2023-11-21 Globalfoundries Singapore Pte. Ltd. On-chip current sensor
WO2023172314A1 (en) * 2022-03-10 2023-09-14 Allegro Microsystems, Llc Packaged current sensor integrated circuit
US12112865B2 (en) 2022-03-15 2024-10-08 Allegro Microsystems, Llc Multiple branch bus bar for coreless current sensing application
US11768230B1 (en) 2022-03-30 2023-09-26 Allegro Microsystems, Llc Current sensor integrated circuit with a dual gauge lead frame
US11940470B2 (en) 2022-05-31 2024-03-26 Allegro Microsystems, Llc Current sensor system
US12078662B2 (en) 2022-06-27 2024-09-03 Allegro Microsystems, Llc Techniques for reducing an eddy current in a ground plane of a coreless sensor
JP7328429B1 (ja) 2022-10-04 2023-08-16 旭化成エレクトロニクス株式会社 電流センサ
JP7328430B1 (ja) 2022-10-04 2023-08-16 旭化成エレクトロニクス株式会社 電流センサ
EP4375678A1 (de) 2022-11-28 2024-05-29 LEM International SA Stromwandler mit integrierter schaltung
WO2024184224A1 (en) * 2023-03-09 2024-09-12 Lem International Sa Magnetic field gradient transducer and current transducer therewith

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425596A (en) * 1980-09-26 1984-01-10 Tokyo Shibaura Denki Kabushiki Kaisha Electric circuit breaker
JPS58501284A (ja) * 1981-08-20 1983-08-04 キヤタピラ− インコ−ポレ−テツド 流体制御装置
US4548366A (en) * 1982-05-17 1985-10-22 Rieter Machine Works, Ltd. Chuck drive system
DE3370152D1 (en) * 1982-12-07 1987-04-16 Asahi Chemical Ind Process for producing diphenylmethane dicarbamates
JPS6171649A (ja) 1984-09-17 1986-04-12 Seiko Instr & Electronics Ltd Icパツケ−ジ
JPS63191069A (ja) * 1986-12-12 1988-08-08 Mitsubishi Electric Corp 電流検出器
US5041780A (en) * 1988-09-13 1991-08-20 California Institute Of Technology Integrable current sensors
US4893073A (en) * 1989-01-30 1990-01-09 General Motors Corporation Electric circuit board current sensor
US5124642A (en) * 1989-12-21 1992-06-23 Sigma Instruments, Inc. Power line post insulator with dual inductor current sensor
JPH04364472A (ja) 1991-06-12 1992-12-16 Fuji Electric Co Ltd 磁電変換装置
EP0537419A1 (de) * 1991-10-09 1993-04-21 Landis & Gyr Business Support AG Anordnung mit einem integrierten Magnetfeldsensor sowie einem ferromagnetischen ersten und zweiten Magnetfluss-Konzentrator und Verfahren zum Einbau einer Vielzahl von Anordnungen in je einem Kunststoffgehäuse
JPH05126865A (ja) 1991-10-22 1993-05-21 Hitachi Ltd 電流検出装置あるいは電流検出方法
DE4141386C2 (de) * 1991-12-16 1995-06-29 Itt Ind Gmbh Deutsche Hallsensor
US5442228A (en) 1992-04-06 1995-08-15 Motorola, Inc. Monolithic shielded integrated circuit
JP3007553B2 (ja) * 1995-03-24 2000-02-07 日本レム株式会社 電流センサ
US5615075A (en) * 1995-05-30 1997-03-25 General Electric Company AC/DC current sensor for a circuit breaker
JPH10267965A (ja) 1997-03-24 1998-10-09 Nana Electron Kk 電流センサ
EP0944839B1 (de) * 1997-09-15 2006-03-29 AMS International AG Eine stromüberwachungseinrichtung und ein verfahren zu ihrer herstellung
US6150714A (en) 1997-09-19 2000-11-21 Texas Instruments Incorporated Current sense element incorporated into integrated circuit package lead frame
JPH11265649A (ja) * 1998-03-18 1999-09-28 Mitsubishi Electric Corp 電流検出器及び電流検出器を備えた電力開閉器
US6545456B1 (en) * 1998-08-12 2003-04-08 Rockwell Automation Technologies, Inc. Hall effect current sensor package for sensing electrical current in an electrical conductor
US6424018B1 (en) 1998-10-02 2002-07-23 Sanken Electric Co., Ltd. Semiconductor device having a hall-effect element
JP2000174357A (ja) 1998-10-02 2000-06-23 Sanken Electric Co Ltd ホ―ル効果素子を有する半導体装置
TW434411B (en) 1998-10-14 2001-05-16 Tdk Corp Magnetic sensor apparatus, current sensor apparatus and magnetic sensing element
TW534999B (en) 1998-12-15 2003-06-01 Tdk Corp Magnetic sensor apparatus and current sensor apparatus
CN1165770C (zh) 1999-01-21 2004-09-08 Tdk株式会社 电流传感装置
US6445171B2 (en) 1999-10-29 2002-09-03 Honeywell Inc. Closed-loop magnetoresistive current sensor system having active offset nulling
JP3852554B2 (ja) 1999-12-09 2006-11-29 サンケン電気株式会社 ホール素子を備えた電流検出装置
JP2001165963A (ja) * 1999-12-09 2001-06-22 Sanken Electric Co Ltd ホール素子を備えた電流検出装置
JP4164615B2 (ja) 1999-12-20 2008-10-15 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
JP3230580B2 (ja) 2000-02-04 2001-11-19 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
DE10007868B4 (de) 2000-02-21 2010-02-18 Robert Bosch Gmbh Elektronische Steuerschaltung
US6468891B2 (en) 2000-02-24 2002-10-22 Micron Technology, Inc. Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
JP3553457B2 (ja) 2000-03-31 2004-08-11 シャープ株式会社 半導体装置およびその製造方法
JP2001339109A (ja) 2000-05-26 2001-12-07 Sanken Electric Co Ltd ホ−ル素子を備えた電流検出装置
US6853178B2 (en) * 2000-06-19 2005-02-08 Texas Instruments Incorporated Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
JP2002026419A (ja) 2000-07-07 2002-01-25 Sanken Electric Co Ltd 磁電変換装置
JP2002131342A (ja) 2000-10-19 2002-05-09 Canon Electronics Inc 電流センサ
JP2002202327A (ja) 2000-10-23 2002-07-19 Sanken Electric Co Ltd ホール素子を備えた電流検出装置
JP4164629B2 (ja) 2000-10-23 2008-10-15 サンケン電気株式会社 ホール素子を備えた電流検出装置
EP1267173A3 (de) * 2001-06-15 2005-03-23 Sanken Electric Co., Ltd. Hall-Effektstromdetektor
JP4164626B2 (ja) 2001-06-15 2008-10-15 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
EP1281974B1 (de) * 2001-07-06 2007-04-18 Sanken Electric Co., Ltd. Hall-Effekt-Stromdetektor
US6667682B2 (en) 2001-12-26 2003-12-23 Honeywell International Inc. System and method for using magneto-resistive sensors as dual purpose sensors
DE10236175B4 (de) 2002-08-07 2005-05-19 Dornier Medtech Systems Gmbh Lasersystem mit fasergebundener Kommunikation
US6781359B2 (en) * 2002-09-20 2004-08-24 Allegro Microsystems, Inc. Integrated current sensor
JP3896590B2 (ja) * 2002-10-28 2007-03-22 サンケン電気株式会社 電流検出装置
JP2004207477A (ja) * 2002-12-25 2004-07-22 Sanken Electric Co Ltd ホール素子を有する半導体装置
US7259545B2 (en) * 2003-02-11 2007-08-21 Allegro Microsystems, Inc. Integrated sensor
US7075287B1 (en) * 2003-08-26 2006-07-11 Allegro Microsystems, Inc. Current sensor
US7476816B2 (en) * 2003-08-26 2009-01-13 Allegro Microsystems, Inc. Current sensor
US7709754B2 (en) * 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US6995315B2 (en) * 2003-08-26 2006-02-07 Allegro Microsystems, Inc. Current sensor
US7166807B2 (en) * 2003-08-26 2007-01-23 Allegro Microsystems, Inc. Current sensor
US20060219436A1 (en) 2003-08-26 2006-10-05 Taylor William P Current sensor
US6867573B1 (en) 2003-11-07 2005-03-15 National Semiconductor Corporation Temperature calibrated over-current protection circuit for linear voltage regulators
KR100565636B1 (ko) 2003-12-02 2006-03-30 엘지전자 주식회사 유기 el 소자 및 그의 제조방법
JP4433820B2 (ja) 2004-02-20 2010-03-17 Tdk株式会社 磁気検出素子およびその形成方法ならびに磁気センサ、電流計
KR101053864B1 (ko) * 2004-06-23 2011-08-03 엘지디스플레이 주식회사 백라이트 유닛과 이를 이용한 액정표시장치
JP4360998B2 (ja) 2004-10-01 2009-11-11 Tdk株式会社 電流センサ
JP4105142B2 (ja) 2004-10-28 2008-06-25 Tdk株式会社 電流センサ
JP4105145B2 (ja) 2004-11-30 2008-06-25 Tdk株式会社 電流センサ
JP4105147B2 (ja) 2004-12-06 2008-06-25 Tdk株式会社 電流センサ
JP4131869B2 (ja) 2005-01-31 2008-08-13 Tdk株式会社 電流センサ
US7358724B2 (en) * 2005-05-16 2008-04-15 Allegro Microsystems, Inc. Integrated magnetic flux concentrator
JP4466487B2 (ja) 2005-06-27 2010-05-26 Tdk株式会社 磁気センサおよび電流センサ
JP2007064851A (ja) 2005-08-31 2007-03-15 Tdk Corp コイル、コイルモジュールおよびその製造方法、ならびに電流センサおよびその製造方法
JP4415923B2 (ja) 2005-09-30 2010-02-17 Tdk株式会社 電流センサ
JP4298691B2 (ja) 2005-09-30 2009-07-22 Tdk株式会社 電流センサおよびその製造方法
KR100756237B1 (ko) * 2005-10-04 2007-09-07 삼성전자주식회사 헤드 짐벌 어셈블리 및 하드디스크 드라이브
JP4224483B2 (ja) 2005-10-14 2009-02-12 Tdk株式会社 電流センサ
JP2007218700A (ja) 2006-02-15 2007-08-30 Tdk Corp 磁気センサおよび電流センサ
US20070279053A1 (en) * 2006-05-12 2007-12-06 Taylor William P Integrated current sensor

Also Published As

Publication number Publication date
KR101231830B1 (ko) 2013-02-08
US20080297138A1 (en) 2008-12-04
DE602006009256D1 (de) 2009-10-29
EP2295993B1 (de) 2014-03-05
EP1891452B1 (de) 2009-09-16
EP2295993A1 (de) 2011-03-16
EP2163908A1 (de) 2010-03-17
EP2157436A1 (de) 2010-02-24
EP2402770A1 (de) 2012-01-04
US7598601B2 (en) 2009-10-06
EP2163908B1 (de) 2012-05-16
KR20080012938A (ko) 2008-02-12
EP1891452A1 (de) 2008-02-27
WO2006130393A1 (en) 2006-12-07
US20060219436A1 (en) 2006-10-05
EP2402770B1 (de) 2014-03-12
JP2008545964A (ja) 2008-12-18
JP5468776B2 (ja) 2014-04-09
EP2157436B1 (de) 2014-06-11

Similar Documents

Publication Publication Date Title
ATE443266T1 (de) Stromsensor
ATE469356T1 (de) Stromsensor
ATE550673T1 (de) Anordnungen für einen integrierten sensor
DE602005003777D1 (de) Oberflächenmontierter integrierter Stromsensor
ATE453360T1 (de) Sensor und führungsdraht zur intravaskulären druckmessung
EP1662564A4 (de) Halbleiterkapselung und herstellungsverfahren dafür
DE60234135D1 (de) Halbleiteranordnung mit Temperaturkompensationsschaltung
HK1122906A1 (en) Antenna structure of an integrated circuit
TW200721558A (en) Magnetic tunnel junction temperature sensors
WO2007004137A3 (en) Electronic device
DK1581111T3 (da) Sensormodul til måling af overflader
AU2003293715A1 (en) Integrated electronic circuit comprising field effect sensors for detecting biomolecules
TW200725880A (en) Semiconductor piezoresistive sensor and operation method thereof
TW200515610A (en) Infrared sensing IC, infrared sensor and method for producing the same
EP1909326A4 (de) Halbleiterelement und elektrische einrichtung
TW200726972A (en) Reference pH sensor, the preparation and application thereof
TW200746474A (en) Semiconductor device and semiconductor device fabrication method
WO2008008581A3 (en) An electronics package with an integrated circuit device having post wafer fabrication integrated passive components
WO2007053340A3 (en) Magnetic tunnel junction current sensors
WO2007038144A3 (en) Radiation sensor device and method
WO2007038649A3 (en) Power supply with current limiting circuits
ATE549633T1 (de) Integriertes sensorarray mit versatzverringerung
EP2026082A3 (de) Doppelseitiger integrierter Verarbeitungs- und Erfassungschip
ATE490474T1 (de) Sensorpaket
DE602004031698D1 (de) Integrierte Halbleiterschaltung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties