DE60320488D1 - Halbleitervorrichtung mit eingebautem Kontaktsensor - Google Patents
Halbleitervorrichtung mit eingebautem KontaktsensorInfo
- Publication number
- DE60320488D1 DE60320488D1 DE60320488T DE60320488T DE60320488D1 DE 60320488 D1 DE60320488 D1 DE 60320488D1 DE 60320488 T DE60320488 T DE 60320488T DE 60320488 T DE60320488 T DE 60320488T DE 60320488 D1 DE60320488 D1 DE 60320488D1
- Authority
- DE
- Germany
- Prior art keywords
- built
- semiconductor device
- contact sensor
- sensor
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Wire Bonding (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002201384 | 2002-07-10 | ||
JP2002201384A JP3971674B2 (ja) | 2002-07-10 | 2002-07-10 | 接触型センサ内蔵半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60320488D1 true DE60320488D1 (de) | 2008-06-05 |
DE60320488T2 DE60320488T2 (de) | 2008-09-18 |
Family
ID=29728463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60320488T Expired - Lifetime DE60320488T2 (de) | 2002-07-10 | 2003-06-19 | Halbleitervorrichtung mit eingebautem Sensor vom Kontakttyp und Herstellungsverfahren solch einer Halbleitervorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6765274B2 (de) |
EP (1) | EP1380985B1 (de) |
JP (1) | JP3971674B2 (de) |
KR (1) | KR100922529B1 (de) |
DE (1) | DE60320488T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO315017B1 (no) * | 2000-06-09 | 2003-06-23 | Idex Asa | Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate |
JP2004163262A (ja) * | 2002-11-13 | 2004-06-10 | Touch Panel Systems Kk | 音響波型接触検出装置 |
JP4090329B2 (ja) * | 2002-11-13 | 2008-05-28 | タッチパネル・システムズ株式会社 | 音響波型接触検出装置 |
JP2005340780A (ja) * | 2004-04-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | 電子部品装着装置および電子部品装着方法 |
JP5045028B2 (ja) * | 2006-08-16 | 2012-10-10 | 富士通セミコンダクター株式会社 | 表面形状センサとその製造方法 |
US20080049980A1 (en) * | 2006-08-28 | 2008-02-28 | Motorola, Inc. | Button with integrated biometric sensor |
KR100919300B1 (ko) * | 2007-04-16 | 2009-10-01 | (주)멜파스 | 접촉 센서 모듈 및 그 제조 방법 |
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
EP2583218A1 (de) | 2010-06-18 | 2013-04-24 | Authentec, Inc. | Fingersensor mit verkapselungsschicht über dem abtastbereich und zugehörige verfahren |
NO20131423A1 (no) | 2013-02-22 | 2014-08-25 | Idex Asa | Integrert fingeravtrykksensor |
US10095906B2 (en) | 2014-02-21 | 2018-10-09 | Idex Asa | Sensor employing overlapping grid lines and conductive probes for extending a sensing surface from the grid lines |
US9385099B2 (en) * | 2014-03-28 | 2016-07-05 | Nxp, B.V. | Die interconnect |
JP6401066B2 (ja) * | 2015-01-27 | 2018-10-03 | 京セラ株式会社 | サーマルヘッドおよびこれを備えるサーマルプリンタ |
JP7027108B2 (ja) | 2017-10-12 | 2022-03-01 | Fcnt株式会社 | 電子機器 |
CN111126351B (zh) * | 2020-01-21 | 2024-02-09 | 北京京东方光电科技有限公司 | 指纹识别模组 |
JP7395364B2 (ja) * | 2020-01-22 | 2023-12-11 | 株式会社ジャパンディスプレイ | 指紋読み取り装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE669572C (de) * | 1938-12-29 | Braeuning & Co G M B H | Einfassschiene fuer Laeufer und Teppiche | |
JP4024335B2 (ja) * | 1996-01-26 | 2007-12-19 | ハリス コーポレイション | 集積回路のダイを露出させる開口部を有する集積回路装置とその製造方法 |
UA47538C2 (uk) * | 1998-05-19 | 2002-07-15 | Інфінеон Текнолоджіз Аг | Сенсорний пристрій для сприймання біометричних ознак, зокрема відбитків пальців |
JP2001141411A (ja) * | 1999-11-12 | 2001-05-25 | Sony Corp | 指紋認識用半導体装置 |
WO2001048830A1 (en) * | 1999-12-24 | 2001-07-05 | Koninklijke Philips Electronics N.V. | ELECTRO-OPTICAL DEVICE HAVING AN ITO LAYER, A SiN LAYER AND AN INTERMEDIATE SILICON OXIDE LAYER |
JP2001208509A (ja) * | 2000-01-24 | 2001-08-03 | Sony Corp | 表面形状認識用半導体装置およびその製造方法 |
JP2003282791A (ja) * | 2002-03-20 | 2003-10-03 | Fujitsu Ltd | 接触型センサ内蔵半導体装置及びその製造方法 |
-
2002
- 2002-07-10 JP JP2002201384A patent/JP3971674B2/ja not_active Expired - Fee Related
-
2003
- 2003-06-19 DE DE60320488T patent/DE60320488T2/de not_active Expired - Lifetime
- 2003-06-19 EP EP03013875A patent/EP1380985B1/de not_active Expired - Lifetime
- 2003-06-25 US US10/602,674 patent/US6765274B2/en not_active Expired - Lifetime
- 2003-07-01 KR KR1020030044200A patent/KR100922529B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2004047623A (ja) | 2004-02-12 |
EP1380985B1 (de) | 2008-04-23 |
DE60320488T2 (de) | 2008-09-18 |
EP1380985A2 (de) | 2004-01-14 |
JP3971674B2 (ja) | 2007-09-05 |
EP1380985A3 (de) | 2004-11-17 |
US20040065915A1 (en) | 2004-04-08 |
US6765274B2 (en) | 2004-07-20 |
KR100922529B1 (ko) | 2009-10-21 |
KR20040014196A (ko) | 2004-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJITSU MICROELECTRONICS LTD., TOKYO, JP |
|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJITSU SEMICONDUCTOR LTD., YOKOHAMA, KANAGAWA, JP |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE |