ATE407235T1 - Elektrolytische kupferfolie - Google Patents

Elektrolytische kupferfolie

Info

Publication number
ATE407235T1
ATE407235T1 AT00977944T AT00977944T ATE407235T1 AT E407235 T1 ATE407235 T1 AT E407235T1 AT 00977944 T AT00977944 T AT 00977944T AT 00977944 T AT00977944 T AT 00977944T AT E407235 T1 ATE407235 T1 AT E407235T1
Authority
AT
Austria
Prior art keywords
copper foil
copper
foil
drum
producing
Prior art date
Application number
AT00977944T
Other languages
English (en)
Inventor
Osamu Nakano
Takashi Kataoka
Sakiko Taenaka
Naohito Uchida
Noriko Hanzawa
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE407235T1 publication Critical patent/ATE407235T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
AT00977944T 1999-12-28 2000-11-27 Elektrolytische kupferfolie ATE407235T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37256399A JP3250994B2 (ja) 1999-12-28 1999-12-28 電解銅箔

Publications (1)

Publication Number Publication Date
ATE407235T1 true ATE407235T1 (de) 2008-09-15

Family

ID=18500659

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00977944T ATE407235T1 (de) 1999-12-28 2000-11-27 Elektrolytische kupferfolie

Country Status (10)

Country Link
US (1) US6544663B1 (de)
EP (1) EP1167580B1 (de)
JP (1) JP3250994B2 (de)
KR (1) KR100435298B1 (de)
CN (2) CN1247821C (de)
AT (1) ATE407235T1 (de)
DE (1) DE60040141D1 (de)
HK (1) HK1044970A1 (de)
TW (1) TW483292B (de)
WO (1) WO2001048272A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4441642B2 (ja) * 2000-12-27 2010-03-31 三井金属鉱業株式会社 電解銅箔製造用のチタン製カソード電極、そのチタン製カソード電極を用いた回転陰極ドラム、チタン製カソード電極に用いるチタン材の製造方法及びチタン製カソード電極用チタン材の矯正加工方法
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
GB2444710B (en) * 2006-12-14 2011-04-13 Advanced Composites Group Ltd Metallic coating of composite materials
KR100822092B1 (ko) * 2007-02-07 2008-04-15 엘에스전선 주식회사 미세 회로용 동박 제조 방법 및 장치, 이를 이용하여제조된 동박
JPWO2009116432A1 (ja) * 2008-03-17 2011-07-21 Jx日鉱日石金属株式会社 電解銅箔製造用の電解液
KR101255548B1 (ko) 2011-02-24 2013-04-17 한양대학교 에리카산학협력단 나노쌍정 구조가 형성된 구리재료의 형성방법
CN102220602A (zh) * 2011-06-10 2011-10-19 广东嘉元科技股份有限公司 一种从生产铜箔的废液中提取铜的方法
TWI432613B (zh) 2011-11-16 2014-04-01 Univ Nat Chiao Tung 電鍍沉積之奈米雙晶銅金屬層及其製備方法
WO2013150640A1 (ja) * 2012-04-06 2013-10-10 Jx日鉱日石金属株式会社 電解銅箔及びその製造方法
TWI454422B (zh) * 2012-04-12 2014-10-01 Nat Univ Tsing Hua 具高密度雙晶的奈米銅導線製造方法
WO2014002997A1 (ja) * 2012-06-27 2014-01-03 古河電気工業株式会社 電解銅箔とその製造方法、リチウムイオン二次電池の負極電極、およびリチウムイオン二次電池
KR20140017043A (ko) * 2012-07-24 2014-02-11 삼성에스디아이 주식회사 전류차단장치와 이를 구비하는 배터리 팩
TWM465986U (zh) * 2013-05-02 2013-11-21 Chung Shan Inst Of Science 卷對卷電化學拋光裝置
CN103320813B (zh) * 2013-06-09 2015-07-15 东江环保股份有限公司 旋流电积槽装置及其应用
US10619262B1 (en) * 2019-06-27 2020-04-14 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil
TWI760249B (zh) * 2021-06-16 2022-04-01 長春石油化學股份有限公司 電解銅箔及銅箔基板
KR102517417B1 (ko) 2021-07-09 2023-04-03 주식회사 다이브 반도체용 동박의 제조방법 및 이를 이용한 반도체용 동박

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649958B2 (ja) * 1987-06-15 1994-06-29 日本電解株式会社 電解銅箔の製造方法
JPH0631461B2 (ja) * 1987-06-15 1994-04-27 日本電解株式会社 電解銅箔の製造方法
DK165415C (da) * 1988-11-02 1993-04-13 Unoplast A S Genstand med en ved befugtning friktionsnedsaettende overfladebelaegning, fremgangsmaade til fremstilling af samme og belaegningsmiddel til brug ved fremgangsmaaden
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
JPH0826470B2 (ja) * 1990-07-30 1996-03-13 日本電解株式会社 銅メッキ液とこれを用いる電解銅箔の製造方法
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
JPH06300714A (ja) * 1993-04-13 1994-10-28 Japan Energy Corp 銅箔の評価方法
TW289900B (de) * 1994-04-22 1996-11-01 Gould Electronics Inc
JP3115982B2 (ja) * 1995-02-16 2000-12-11 株式会社ナイカイアーキット 電着ドラム用チタンリングの製造方法
JPH1036991A (ja) * 1996-07-19 1998-02-10 Japan Energy Corp 電解銅箔の製造方法
JP3623621B2 (ja) * 1996-12-10 2005-02-23 福田金属箔粉工業株式会社 銅箔の表面処理方法
JPH10330983A (ja) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
JP3500072B2 (ja) * 1998-07-27 2004-02-23 新日本製鐵株式会社 電解金属箔製造ドラム用チタン材およびその製造方法
JP3859384B2 (ja) * 1999-03-08 2006-12-20 日鉱金属株式会社 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001011685A (ja) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法

Also Published As

Publication number Publication date
DE60040141D1 (de) 2008-10-16
KR20010108078A (ko) 2001-12-07
HK1044970A1 (zh) 2002-11-08
CN1831203A (zh) 2006-09-13
TW483292B (en) 2002-04-11
CN1247821C (zh) 2006-03-29
US6544663B1 (en) 2003-04-08
JP3250994B2 (ja) 2002-01-28
WO2001048272A1 (fr) 2001-07-05
EP1167580A1 (de) 2002-01-02
KR100435298B1 (ko) 2004-06-10
JP2001181886A (ja) 2001-07-03
EP1167580B1 (de) 2008-09-03
EP1167580A4 (de) 2005-12-07
CN1341164A (zh) 2002-03-20

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