ATE343665T1 - Verfahren zur herstellung elektrolytisch abgeschiedener kupferfolie, elektrolytisch abgeschiedene kupfer-folie, kupferkaschiertes laminat und leiterplatte - Google Patents

Verfahren zur herstellung elektrolytisch abgeschiedener kupferfolie, elektrolytisch abgeschiedene kupfer-folie, kupferkaschiertes laminat und leiterplatte

Info

Publication number
ATE343665T1
ATE343665T1 AT00304865T AT00304865T ATE343665T1 AT E343665 T1 ATE343665 T1 AT E343665T1 AT 00304865 T AT00304865 T AT 00304865T AT 00304865 T AT00304865 T AT 00304865T AT E343665 T1 ATE343665 T1 AT E343665T1
Authority
AT
Austria
Prior art keywords
copper foil
electrolyte
electrolytically
lead
copper
Prior art date
Application number
AT00304865T
Other languages
English (en)
Inventor
Nobuyuki Imada
Yutaka Hirasawa
Yasuji Hara
Naoya Matsushita
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11161644A external-priority patent/JP3046301B1/ja
Priority claimed from JP2000113655A external-priority patent/JP3466987B2/ja
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE343665T1 publication Critical patent/ATE343665T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT00304865T 1999-06-08 2000-06-08 Verfahren zur herstellung elektrolytisch abgeschiedener kupferfolie, elektrolytisch abgeschiedene kupfer-folie, kupferkaschiertes laminat und leiterplatte ATE343665T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11161644A JP3046301B1 (ja) 1999-06-08 1999-06-08 電解銅箔の製造方法、電解銅箔、銅張り積層板およびプリント配線板
JP2000113655A JP3466987B2 (ja) 2000-04-14 2000-04-14 電解銅箔の製造方法

Publications (1)

Publication Number Publication Date
ATE343665T1 true ATE343665T1 (de) 2006-11-15

Family

ID=26487708

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00304865T ATE343665T1 (de) 1999-06-08 2000-06-08 Verfahren zur herstellung elektrolytisch abgeschiedener kupferfolie, elektrolytisch abgeschiedene kupfer-folie, kupferkaschiertes laminat und leiterplatte

Country Status (7)

Country Link
US (1) US6444112B1 (de)
EP (1) EP1059367B1 (de)
CN (1) CN1163638C (de)
AT (1) ATE343665T1 (de)
DE (1) DE60031479T2 (de)
MY (1) MY124018A (de)
TW (1) TWI229152B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3794613B2 (ja) * 2000-05-18 2006-07-05 三井金属鉱業株式会社 電解銅箔の電解装置
JP2004269950A (ja) * 2003-03-07 2004-09-30 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法
KR100941219B1 (ko) * 2005-03-31 2010-02-10 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용하여 얻어진 표면 처리 전해 동박, 그 표면 처리 전해 동박을 이용한 동장 적층판 및 프린트 배선판
CN1972557A (zh) * 2005-10-14 2007-05-30 三井金属矿业株式会社 挠性覆铜层压板和薄膜载带及其制造方法、以及挠性印刷电路板、半导体装置
KR20070044774A (ko) * 2005-10-25 2007-04-30 미쓰이 긴조꾸 고교 가부시키가이샤 2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법
SG192717A1 (en) * 2011-03-07 2013-09-30 Jx Nippon Mining & Metals Corp Copper or copper alloy, bonding wire, method of producing the copper, method of producing the copper alloy, and method of producing the bonding wire.
CN103060882B (zh) * 2013-01-21 2015-11-04 福建清景铜箔有限公司 一种硫酸铜溶液逆向流动生产电解铜箔的方法及系统
CN103233249A (zh) * 2013-05-09 2013-08-07 南京顺捷机械设备有限公司 一种上进液式铜箔一体机设备
TWI539032B (zh) * 2013-08-01 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method
KR101449342B1 (ko) * 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
CN105002550A (zh) * 2015-07-14 2015-10-28 灵宝华鑫铜箔有限责任公司 一种降低电解铜箔电解液中铅离子浓度的装置及工艺
CN105908221B (zh) * 2016-06-17 2017-12-19 泉州师范学院 一种电解铜箔的制造工艺
CN110257865A (zh) * 2019-06-11 2019-09-20 九江明阳电路科技有限公司 电镀装置和电镀方法
TWI705160B (zh) * 2019-12-09 2020-09-21 長春石油化學股份有限公司 電解銅箔、包含其的電極和覆銅積層板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU966034A1 (ru) * 1981-01-12 1982-10-15 Предприятие П/Я А-7815 Способ очистки сточных вод от ионов свинца
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
JP3124847B2 (ja) 1992-11-06 2001-01-15 ペルメレック電極株式会社 金属箔の電解による製造方法
JP3124848B2 (ja) * 1992-11-11 2001-01-15 ペルメレック電極株式会社 金属箔の電解による製造方法

Also Published As

Publication number Publication date
EP1059367A3 (de) 2002-11-27
MY124018A (en) 2006-06-30
US6444112B1 (en) 2002-09-03
EP1059367A2 (de) 2000-12-13
DE60031479T2 (de) 2007-09-13
CN1163638C (zh) 2004-08-25
EP1059367B1 (de) 2006-10-25
TWI229152B (en) 2005-03-11
DE60031479D1 (de) 2006-12-07
CN1276442A (zh) 2000-12-13

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