ATE365758T1 - Nichtfliessende unterfüllungszusammensetzung - Google Patents

Nichtfliessende unterfüllungszusammensetzung

Info

Publication number
ATE365758T1
ATE365758T1 AT03734967T AT03734967T ATE365758T1 AT E365758 T1 ATE365758 T1 AT E365758T1 AT 03734967 T AT03734967 T AT 03734967T AT 03734967 T AT03734967 T AT 03734967T AT E365758 T1 ATE365758 T1 AT E365758T1
Authority
AT
Austria
Prior art keywords
phenol
underfill composition
flow
composition
flowing underfill
Prior art date
Application number
AT03734967T
Other languages
German (de)
English (en)
Inventor
Yue Xiao
Quinn Tong
Paul Morganelli
Jayesh Shah
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of ATE365758T1 publication Critical patent/ATE365758T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
  • Medicinal Preparation (AREA)
AT03734967T 2002-01-31 2003-01-21 Nichtfliessende unterfüllungszusammensetzung ATE365758T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/062,902 US20030162911A1 (en) 2002-01-31 2002-01-31 No flow underfill composition

Publications (1)

Publication Number Publication Date
ATE365758T1 true ATE365758T1 (de) 2007-07-15

Family

ID=27658617

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03734967T ATE365758T1 (de) 2002-01-31 2003-01-21 Nichtfliessende unterfüllungszusammensetzung

Country Status (8)

Country Link
US (1) US20030162911A1 (https=)
EP (1) EP1470176B1 (https=)
JP (1) JP4481651B2 (https=)
KR (1) KR100953579B1 (https=)
CN (1) CN100586980C (https=)
AT (1) ATE365758T1 (https=)
DE (1) DE60314596T2 (https=)
WO (1) WO2003064493A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US7026376B2 (en) * 2003-06-30 2006-04-11 Intel Corporation Fluxing agent for underfill materials
JP4426526B2 (ja) 2003-07-17 2010-03-03 ハネウエル・インターナシヨナル・インコーポレーテツド 最新式のマイクロエレクトロニクス用途およびデバイス用の平坦化膜およびそれらの製造方法
JP4402718B2 (ja) * 2005-05-17 2010-01-20 パナソニック株式会社 フリップチップ実装方法
KR101117757B1 (ko) * 2009-02-26 2012-03-15 도레이첨단소재 주식회사 비유동성 언더필용 수지조성물 및 이를 이용한 비유동성 언더필 필름
JP6155261B2 (ja) 2011-07-15 2017-06-28 スリーエム イノベイティブ プロパティズ カンパニー 半導体パッケージ樹脂組成物及びその使用方法
CN102382625A (zh) * 2011-09-22 2012-03-21 长春工业大学 一种改性二氧化双环戊二烯环氧树脂灌封料及其制法
CN102516963B (zh) * 2011-10-17 2013-07-31 中国石油天然气股份有限公司 用于油水井套管修复的化学复合树脂封固剂
US9607916B2 (en) 2012-04-05 2017-03-28 Mektec Manufacturing Corporation (Thailand) Ltd Encapsulant materials and a method of making thereof
JP2014091744A (ja) 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
CN104650788A (zh) * 2015-02-04 2015-05-27 江苏大力士投资有限公司 一种具有良好伸缩性的勾缝胶及其制备方法
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6836740B2 (ja) * 2016-10-13 2021-03-03 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
CN107459608B (zh) * 2017-09-14 2020-03-24 中国林业科学研究院林产化学工业研究所 一种丙烯酸松香基高分子表面活性剂及其制备方法和用途
CN110591622B (zh) * 2019-09-12 2022-11-22 深圳市百丽春粘胶实业有限公司 一种高耐候的低温热固环氧模组胶及其制备方法
CN111394053B (zh) * 2020-03-03 2021-10-26 华南理工大学 一种带助焊功能非流动底部填充胶及其制备方法
TW202216834A (zh) * 2020-06-01 2022-05-01 德商漢高智慧財產控股公司 用於低間隙底部填充應用之與助熔劑相容的環氧樹脂-酸酐黏著劑組合物
CN112280509B (zh) * 2020-09-14 2023-07-25 深圳市安伯斯科技有限公司 一种单组份环氧树脂封装透明胶及其应用
CN113072100B (zh) * 2021-03-26 2022-07-29 天津市捷威动力工业有限公司 一种高镍锂离子电池正极材料的制备方法
CN115746262B (zh) * 2022-11-22 2025-02-07 中国林业科学研究院林产化学工业研究所 一种松香基苯并环丁烯单体改性环氧树脂及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4877000A (https=) * 1972-01-17 1973-10-16
JPS63251420A (ja) * 1987-04-07 1988-10-18 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPH04248827A (ja) * 1991-01-08 1992-09-04 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JP3139333B2 (ja) * 1995-07-24 2001-02-26 信越化学工業株式会社 エポキシ樹脂組成物
EP0780435A1 (en) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Flexible epoxy adhesives with low bleeding tendency
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6833629B2 (en) * 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level

Also Published As

Publication number Publication date
KR20040082402A (ko) 2004-09-24
JP4481651B2 (ja) 2010-06-16
CN100586980C (zh) 2010-02-03
CN1643023A (zh) 2005-07-20
DE60314596D1 (de) 2007-08-09
KR100953579B1 (ko) 2010-04-21
EP1470176A1 (en) 2004-10-27
US20030162911A1 (en) 2003-08-28
DE60314596T2 (de) 2008-03-13
WO2003064493A1 (en) 2003-08-07
EP1470176B1 (en) 2007-06-27
JP2005516090A (ja) 2005-06-02

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