KR100953579B1 - 비유동성 언더필 조성물 - Google Patents

비유동성 언더필 조성물 Download PDF

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Publication number
KR100953579B1
KR100953579B1 KR1020047011760A KR20047011760A KR100953579B1 KR 100953579 B1 KR100953579 B1 KR 100953579B1 KR 1020047011760 A KR1020047011760 A KR 1020047011760A KR 20047011760 A KR20047011760 A KR 20047011760A KR 100953579 B1 KR100953579 B1 KR 100953579B1
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KR
South Korea
Prior art keywords
epoxy
anhydride
imidazole
encapsulant
phenol
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020047011760A
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English (en)
Korean (ko)
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KR20040082402A (ko
Inventor
샤오유에
통퀸케이.
모르가넬리폴
샤자예쉬
Original Assignee
내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
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Publication of KR20040082402A publication Critical patent/KR20040082402A/ko
Application granted granted Critical
Publication of KR100953579B1 publication Critical patent/KR100953579B1/ko
Assigned to 헨켈 코포레이션 reassignment 헨켈 코포레이션 권리의 전부이전등록 Assignors: 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
Assigned to 헨켈 아게 운트 코. 카게아아 reassignment 헨켈 아게 운트 코. 카게아아 권리의 전부이전등록 Assignors: 헨켈 코포레이션
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Sealing Material Composition (AREA)
  • Medicinal Preparation (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
KR1020047011760A 2002-01-31 2003-01-21 비유동성 언더필 조성물 Expired - Fee Related KR100953579B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/062,902 2002-01-31
US10/062,902 US20030162911A1 (en) 2002-01-31 2002-01-31 No flow underfill composition
PCT/US2003/001676 WO2003064493A1 (en) 2002-01-31 2003-01-21 No flow underfill composition

Publications (2)

Publication Number Publication Date
KR20040082402A KR20040082402A (ko) 2004-09-24
KR100953579B1 true KR100953579B1 (ko) 2010-04-21

Family

ID=27658617

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047011760A Expired - Fee Related KR100953579B1 (ko) 2002-01-31 2003-01-21 비유동성 언더필 조성물

Country Status (8)

Country Link
US (1) US20030162911A1 (https=)
EP (1) EP1470176B1 (https=)
JP (1) JP4481651B2 (https=)
KR (1) KR100953579B1 (https=)
CN (1) CN100586980C (https=)
AT (1) ATE365758T1 (https=)
DE (1) DE60314596T2 (https=)
WO (1) WO2003064493A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US7026376B2 (en) * 2003-06-30 2006-04-11 Intel Corporation Fluxing agent for underfill materials
EP1649322A4 (en) 2003-07-17 2007-09-19 Honeywell Int Inc PLANARIZATION FILMS FOR ADVANCED MICRO-ELECTRONIC APPLICATIONS AND EQUIPMENT AND METHOD FOR THE PRODUCTION THEREOF
WO2006123554A1 (ja) * 2005-05-17 2006-11-23 Matsushita Electric Industrial Co., Ltd. フリップチップ実装体およびフリップチップ実装方法
KR101117757B1 (ko) * 2009-02-26 2012-03-15 도레이첨단소재 주식회사 비유동성 언더필용 수지조성물 및 이를 이용한 비유동성 언더필 필름
JP6155261B2 (ja) 2011-07-15 2017-06-28 スリーエム イノベイティブ プロパティズ カンパニー 半導体パッケージ樹脂組成物及びその使用方法
CN102382625A (zh) * 2011-09-22 2012-03-21 长春工业大学 一种改性二氧化双环戊二烯环氧树脂灌封料及其制法
CN102516963B (zh) * 2011-10-17 2013-07-31 中国石油天然气股份有限公司 用于油水井套管修复的化学复合树脂封固剂
US9607916B2 (en) 2012-04-05 2017-03-28 Mektec Manufacturing Corporation (Thailand) Ltd Encapsulant materials and a method of making thereof
JP2014091744A (ja) 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
CN104650788A (zh) * 2015-02-04 2015-05-27 江苏大力士投资有限公司 一种具有良好伸缩性的勾缝胶及其制备方法
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6836740B2 (ja) * 2016-10-13 2021-03-03 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
CN107459608B (zh) * 2017-09-14 2020-03-24 中国林业科学研究院林产化学工业研究所 一种丙烯酸松香基高分子表面活性剂及其制备方法和用途
CN110591622B (zh) * 2019-09-12 2022-11-22 深圳市百丽春粘胶实业有限公司 一种高耐候的低温热固环氧模组胶及其制备方法
CN111394053B (zh) * 2020-03-03 2021-10-26 华南理工大学 一种带助焊功能非流动底部填充胶及其制备方法
TW202216834A (zh) * 2020-06-01 2022-05-01 德商漢高智慧財產控股公司 用於低間隙底部填充應用之與助熔劑相容的環氧樹脂-酸酐黏著劑組合物
CN112280509B (zh) * 2020-09-14 2023-07-25 深圳市安伯斯科技有限公司 一种单组份环氧树脂封装透明胶及其应用
CN113072100B (zh) * 2021-03-26 2022-07-29 天津市捷威动力工业有限公司 一种高镍锂离子电池正极材料的制备方法
CN115746262B (zh) * 2022-11-22 2025-02-07 中国林业科学研究院林产化学工业研究所 一种松香基苯并环丁烯单体改性环氧树脂及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998037134A1 (en) * 1997-02-19 1998-08-27 Georgia Tech Research Corporation Low-cost high-performance no-flow underfills for flip-chip applications

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JPS4877000A (https=) * 1972-01-17 1973-10-16
JPS63251420A (ja) * 1987-04-07 1988-10-18 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPH04248827A (ja) * 1991-01-08 1992-09-04 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JP3139333B2 (ja) * 1995-07-24 2001-02-26 信越化学工業株式会社 エポキシ樹脂組成物
EP0780435A1 (en) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Flexible epoxy adhesives with low bleeding tendency
US6833629B2 (en) * 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998037134A1 (en) * 1997-02-19 1998-08-27 Georgia Tech Research Corporation Low-cost high-performance no-flow underfills for flip-chip applications

Also Published As

Publication number Publication date
JP2005516090A (ja) 2005-06-02
DE60314596D1 (de) 2007-08-09
CN1643023A (zh) 2005-07-20
EP1470176B1 (en) 2007-06-27
ATE365758T1 (de) 2007-07-15
KR20040082402A (ko) 2004-09-24
US20030162911A1 (en) 2003-08-28
JP4481651B2 (ja) 2010-06-16
DE60314596T2 (de) 2008-03-13
CN100586980C (zh) 2010-02-03
WO2003064493A1 (en) 2003-08-07
EP1470176A1 (en) 2004-10-27

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