ATE350753T1 - Dielektrische zusammensetzung - Google Patents

Dielektrische zusammensetzung

Info

Publication number
ATE350753T1
ATE350753T1 AT00307985T AT00307985T ATE350753T1 AT E350753 T1 ATE350753 T1 AT E350753T1 AT 00307985 T AT00307985 T AT 00307985T AT 00307985 T AT00307985 T AT 00307985T AT E350753 T1 ATE350753 T1 AT E350753T1
Authority
AT
Austria
Prior art keywords
dielectric composition
disclosed
low voc
dielectric compositions
dielectric
Prior art date
Application number
AT00307985T
Other languages
English (en)
Inventor
James G Shelnut
Wade Sonnenberg
James L Aubry
Jennifer Patricia Canlas
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Application granted granted Critical
Publication of ATE350753T1 publication Critical patent/ATE350753T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Organic Insulating Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
AT00307985T 1999-09-15 2000-09-14 Dielektrische zusammensetzung ATE350753T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/397,301 US6440642B1 (en) 1999-09-15 1999-09-15 Dielectric composition

Publications (1)

Publication Number Publication Date
ATE350753T1 true ATE350753T1 (de) 2007-01-15

Family

ID=23570655

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00307985T ATE350753T1 (de) 1999-09-15 2000-09-14 Dielektrische zusammensetzung

Country Status (9)

Country Link
US (1) US6440642B1 (de)
EP (1) EP1085529B1 (de)
JP (1) JP2001172510A (de)
KR (1) KR100669190B1 (de)
CN (1) CN1196139C (de)
AT (1) ATE350753T1 (de)
DE (1) DE60032696T2 (de)
SG (1) SG93890A1 (de)
TW (1) TW473743B (de)

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WO2003064495A2 (en) 2001-11-07 2003-08-07 Dow Global Technologies Inc. Planarized microelectronic substrates
US20030157574A1 (en) * 2002-02-14 2003-08-21 John Lynch Diluent, methods of manufacture and use
JP3599042B2 (ja) * 2002-05-28 2004-12-08 株式会社村田製作所 ３次元周期構造体およびその製造方法
JP2004206058A (ja) * 2002-10-31 2004-07-22 Sumitomo Chem Co Ltd ポジ型感光性組成物
US7172849B2 (en) * 2003-08-22 2007-02-06 International Business Machines Corporation Antireflective hardmask and uses thereof
JP2006072352A (ja) * 2004-08-19 2006-03-16 Rohm & Haas Electronic Materials Llc プリント回路板を形成する方法
US7121145B2 (en) * 2004-10-18 2006-10-17 Silverbrook Research Pty Ltd Capacitative pressure sensor
DE602005011393D1 (de) * 2004-12-22 2009-01-15 Rohm & Haas Elect Mat Optische Trockenfilme und Verfahren zur Herstellung optischer Vorrichtungen mit Trockenfilmen
DE602005011394D1 (de) * 2004-12-22 2009-01-15 Rohm & Haas Elect Mat Optische Trockenfilme und Verfahren zur Herstellung optischer Vorrichtungen mit Trockenfilmen
EP1674905B1 (de) * 2004-12-22 2008-10-15 Rohm and Haas Electronic Materials, L.L.C. Verfahren zur Herstellung optischer Vorrichtungen mit Polymerschichten
JP5519293B2 (ja) 2006-12-28 2014-06-11 スリーエム イノベイティブ プロパティズ カンパニー 薄膜金属層形成のための核形成層
KR100919563B1 (ko) * 2007-03-30 2009-10-01 주식회사 하이닉스반도체 반도체 소자의 형성 방법
US8198979B2 (en) * 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
CN101809691B (zh) * 2007-04-20 2012-07-18 英克-罗吉克斯有限公司 模内成型的电容式开关
JP4913663B2 (ja) * 2007-05-11 2012-04-11 株式会社ダイセル 回路基板の製造方法
US8017296B2 (en) 2007-05-22 2011-09-13 Az Electronic Materials Usa Corp. Antireflective coating composition comprising fused aromatic rings
EP2212726A1 (de) * 2007-10-30 2010-08-04 3M Innovative Properties Company Optischer mehrfach-stapel-bandpassfilm mit elektromagnetischer störungsabschirmung für optische anzeigefilter
US7989144B2 (en) * 2008-04-01 2011-08-02 Az Electronic Materials Usa Corp Antireflective coating composition
US7932018B2 (en) 2008-05-06 2011-04-26 Az Electronic Materials Usa Corp. Antireflective coating composition
US8350451B2 (en) * 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
US20100181284A1 (en) * 2009-01-19 2010-07-22 E. I. Du Pont De Nemours And Company Method of obtaining electronic circuitry features
US20100260940A1 (en) * 2009-04-08 2010-10-14 Mccown James Charles System and method for depositing metallic coatings on substrates using removable masking materials
JP5753351B2 (ja) * 2009-11-19 2015-07-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 電子デバイスを形成する方法
US8486609B2 (en) 2009-12-23 2013-07-16 Az Electronic Materials Usa Corp. Antireflective coating composition and process thereof
US8623447B2 (en) 2010-12-01 2014-01-07 Xerox Corporation Method for coating dielectric composition for fabricating thin-film transistors
US8821962B2 (en) * 2010-12-01 2014-09-02 Xerox Corporation Method of forming dielectric layer with a dielectric composition
KR20140131609A (ko) 2013-05-02 2014-11-14 삼성디스플레이 주식회사 감광성 수지 조성물, 패턴 형성 방법 및 이를 이용한 액정 표시 장치
WO2015048575A1 (en) * 2013-09-26 2015-04-02 Designer Molecules, Inc. Low dielectric constant, low dielectric dissipation factor coatings, films and adhesives
KR102163052B1 (ko) * 2015-06-30 2020-10-08 삼성전기주식회사 압력 센서 소자 및 그 제조 방법
TWI557177B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
US20180162992A1 (en) * 2016-12-14 2018-06-14 Rohm And Haas Electronic Materials Llc Polyarylene compositions and methods
CN107278031A (zh) * 2017-06-29 2017-10-20 安徽升鸿电子有限公司 采用车削离子注入电镀方式制作6.5≤Dk≤10高频FPC
TWI803738B (zh) * 2019-03-11 2023-06-01 美商羅門哈斯電子材料有限公司 製造印刷線路板的方法
EP3786211A1 (de) 2020-02-28 2021-03-03 SABIC Global Technologies B.V. Härtbare zusammensetzung und daraus hergestellte gehärtete zusammensetzung

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Also Published As

Publication number Publication date
EP1085529A3 (de) 2001-04-04
EP1085529B1 (de) 2007-01-03
TW473743B (en) 2002-01-21
DE60032696D1 (de) 2007-02-15
SG93890A1 (en) 2003-01-21
EP1085529A2 (de) 2001-03-21
US6440642B1 (en) 2002-08-27
CN1292556A (zh) 2001-04-25
JP2001172510A (ja) 2001-06-26
DE60032696T2 (de) 2007-10-04
KR100669190B1 (ko) 2007-01-17
CN1196139C (zh) 2005-04-06
KR20010030410A (ko) 2001-04-16

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties