ATE330046T1 - Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken - Google Patents

Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken

Info

Publication number
ATE330046T1
ATE330046T1 AT02781274T AT02781274T ATE330046T1 AT E330046 T1 ATE330046 T1 AT E330046T1 AT 02781274 T AT02781274 T AT 02781274T AT 02781274 T AT02781274 T AT 02781274T AT E330046 T1 ATE330046 T1 AT E330046T1
Authority
AT
Austria
Prior art keywords
counter electrodes
work pieces
various counter
electrolytically
far
Prior art date
Application number
AT02781274T
Other languages
English (en)
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE330046T1 publication Critical patent/ATE330046T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Forging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT02781274T 2001-10-27 2002-10-21 Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken ATE330046T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10153171A DE10153171B4 (de) 2001-10-27 2001-10-27 Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen

Publications (1)

Publication Number Publication Date
ATE330046T1 true ATE330046T1 (de) 2006-07-15

Family

ID=7703987

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02781274T ATE330046T1 (de) 2001-10-27 2002-10-21 Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken

Country Status (15)

Country Link
US (1) US7563352B2 (de)
EP (1) EP1438447B1 (de)
JP (1) JP4268874B2 (de)
KR (1) KR100956536B1 (de)
CN (1) CN1325699C (de)
AT (1) ATE330046T1 (de)
AU (1) AU2002348997A1 (de)
BR (1) BR0213532A (de)
CA (1) CA2454267A1 (de)
DE (2) DE10153171B4 (de)
ES (1) ES2265516T3 (de)
HK (1) HK1063341A1 (de)
MX (1) MXPA04003963A (de)
TW (1) TW574434B (de)
WO (1) WO2003038159A2 (de)

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US11476566B2 (en) 2009-03-09 2022-10-18 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
US9208942B2 (en) 2009-03-09 2015-12-08 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
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US9300046B2 (en) 2009-03-09 2016-03-29 Nucurrent, Inc. Method for manufacture of multi-layer-multi-turn high efficiency inductors
US9439287B2 (en) 2009-03-09 2016-09-06 Nucurrent, Inc. Multi-layer wire structure for high efficiency wireless communication
US9306358B2 (en) 2009-03-09 2016-04-05 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
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JP5795514B2 (ja) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
CN102560605B (zh) * 2011-12-29 2016-10-05 中国第一汽车股份有限公司 降低电泳槽液杂离子含量的工艺方法
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
CN103266334B (zh) * 2013-04-24 2015-12-02 东莞市鸿展机械设备有限公司 隔液传送装置
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
US9941743B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US10636563B2 (en) 2015-08-07 2020-04-28 Nucurrent, Inc. Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
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US11205848B2 (en) 2015-08-07 2021-12-21 Nucurrent, Inc. Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
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US10658847B2 (en) 2015-08-07 2020-05-19 Nucurrent, Inc. Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
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KR20190038587A (ko) 2016-08-26 2019-04-08 누커런트, 인코포레이티드 무선 커넥터 시스템
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US10432031B2 (en) 2016-12-09 2019-10-01 Nucurrent, Inc. Antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
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US10947636B2 (en) * 2017-03-21 2021-03-16 Rockwell Automation Technologies, Inc. Adjustable AC/DC conversion topology to regulate an isolated DC load with low AC ripple
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KR102636830B1 (ko) * 2018-12-31 2024-02-14 엘지디스플레이 주식회사 전기 도금 장치 및 이를 이용한 전기 도금 방법
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CN110965112B (zh) * 2019-12-19 2022-02-11 漳州市福美鑫新材料科技有限公司 一种用于自动电镀设备的电镀时间调节装置
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Also Published As

Publication number Publication date
EP1438447B1 (de) 2006-06-14
KR100956536B1 (ko) 2010-05-07
AU2002348997A1 (en) 2003-05-12
MXPA04003963A (es) 2004-06-18
TW574434B (en) 2004-02-01
EP1438447A2 (de) 2004-07-21
DE60212426D1 (de) 2006-07-27
US7563352B2 (en) 2009-07-21
ES2265516T3 (es) 2007-02-16
CN1325699C (zh) 2007-07-11
DE10153171B4 (de) 2004-09-16
JP2005507463A (ja) 2005-03-17
KR20050038574A (ko) 2005-04-27
JP4268874B2 (ja) 2009-05-27
HK1063341A1 (en) 2004-12-24
BR0213532A (pt) 2004-10-19
WO2003038159A3 (en) 2003-10-09
CA2454267A1 (en) 2003-05-08
DE60212426T2 (de) 2007-05-31
US20040245093A1 (en) 2004-12-09
CN1578853A (zh) 2005-02-09
WO2003038159A2 (en) 2003-05-08
DE10153171A1 (de) 2003-05-22

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