ATE330046T1 - Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken - Google Patents

Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken

Info

Publication number
ATE330046T1
ATE330046T1 AT02781274T AT02781274T ATE330046T1 AT E330046 T1 ATE330046 T1 AT E330046T1 AT 02781274 T AT02781274 T AT 02781274T AT 02781274 T AT02781274 T AT 02781274T AT E330046 T1 ATE330046 T1 AT E330046T1
Authority
AT
Austria
Prior art keywords
counter electrodes
work pieces
various counter
electrolytically
far
Prior art date
Application number
AT02781274T
Other languages
English (en)
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE330046T1 publication Critical patent/ATE330046T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Forging (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT02781274T 2001-10-27 2002-10-21 Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken ATE330046T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10153171A DE10153171B4 (de) 2001-10-27 2001-10-27 Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen

Publications (1)

Publication Number Publication Date
ATE330046T1 true ATE330046T1 (de) 2006-07-15

Family

ID=7703987

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02781274T ATE330046T1 (de) 2001-10-27 2002-10-21 Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken

Country Status (15)

Country Link
US (1) US7563352B2 (de)
EP (1) EP1438447B1 (de)
JP (1) JP4268874B2 (de)
KR (1) KR100956536B1 (de)
CN (1) CN1325699C (de)
AT (1) ATE330046T1 (de)
AU (1) AU2002348997A1 (de)
BR (1) BR0213532A (de)
CA (1) CA2454267A1 (de)
DE (2) DE10153171B4 (de)
ES (1) ES2265516T3 (de)
HK (1) HK1063341A1 (de)
MX (1) MXPA04003963A (de)
TW (1) TW574434B (de)
WO (1) WO2003038159A2 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7241366B2 (en) * 2004-11-30 2007-07-10 Metokote Corporation Continuous coating process
DE102005009024B4 (de) * 2005-02-28 2010-09-30 Advanced Micro Devices Inc., Sunnyvale Verfahren und System zum Steuern einer vertikalen Substratposition in einem elektrochemischen Prozess zur Herstellung von mikrostrukturierten integrierten Schaltungen
WO2007116667A1 (ja) 2006-03-29 2007-10-18 Toray Industries, Inc. 給電方法、ウェブの連続電解めっき装置およびめっき膜付きプラスチックフィルムの製造方法
KR101414105B1 (ko) * 2007-03-28 2014-07-01 도레이 카부시키가이샤 웹의 압접 방법, 압접 장치, 급전 방법, 급전 장치, 연속 전해 도금 장치 및 도금막 부착 웹의 제조 방법
JP5457010B2 (ja) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 連続めっき処理装置
US8313627B2 (en) * 2008-01-24 2012-11-20 GM Global Technology Operations LLC Drag through electro-deposition system
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
US9439287B2 (en) 2009-03-09 2016-09-06 Nucurrent, Inc. Multi-layer wire structure for high efficiency wireless communication
US9444213B2 (en) 2009-03-09 2016-09-13 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
US9306358B2 (en) 2009-03-09 2016-04-05 Nucurrent, Inc. Method for manufacture of multi-layer wire structure for high efficiency wireless communication
WO2010104569A1 (en) 2009-03-09 2010-09-16 Neurds Inc. System and method for wireless power transfer in implantable medical devices
US11476566B2 (en) 2009-03-09 2022-10-18 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
US9232893B2 (en) 2009-03-09 2016-01-12 Nucurrent, Inc. Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication
US9300046B2 (en) 2009-03-09 2016-03-29 Nucurrent, Inc. Method for manufacture of multi-layer-multi-turn high efficiency inductors
US9208942B2 (en) 2009-03-09 2015-12-08 Nucurrent, Inc. Multi-layer-multi-turn structure for high efficiency wireless communication
KR101149254B1 (ko) * 2010-02-26 2012-05-25 현대제철 주식회사 가공물 부식 방지 기능을 갖는 와이어 방전 가공 장치
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
US8784618B2 (en) 2010-08-19 2014-07-22 International Business Machines Corporation Working electrode design for electrochemical processing of electronic components
KR101242526B1 (ko) 2010-12-14 2013-03-12 (주)포인텍 지능형 도금용 캐리어의 제어방법
US20130068499A1 (en) * 2011-09-15 2013-03-21 Nucurrent Inc. Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication
DE102011113976A1 (de) * 2011-09-21 2013-04-25 Charlotte Schade Elektronische Formanode zur galvanischen Metallabscheidung
JP5795514B2 (ja) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
CN102560605B (zh) * 2011-12-29 2016-10-05 中国第一汽车股份有限公司 降低电泳槽液杂离子含量的工艺方法
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
CN103266334B (zh) * 2013-04-24 2015-12-02 东莞市鸿展机械设备有限公司 隔液传送装置
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
US9941729B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single layer multi mode antenna for wireless power transmission using magnetic field coupling
US10063100B2 (en) 2015-08-07 2018-08-28 Nucurrent, Inc. Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling
US11205848B2 (en) 2015-08-07 2021-12-21 Nucurrent, Inc. Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US9941743B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling
US10658847B2 (en) 2015-08-07 2020-05-19 Nucurrent, Inc. Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9960628B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling
US9960629B2 (en) 2015-08-07 2018-05-01 Nucurrent, Inc. Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US10636563B2 (en) 2015-08-07 2020-04-28 Nucurrent, Inc. Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling
US9948129B2 (en) 2015-08-07 2018-04-17 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit
US9941590B2 (en) 2015-08-07 2018-04-10 Nucurrent, Inc. Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding
US10985465B2 (en) 2015-08-19 2021-04-20 Nucurrent, Inc. Multi-mode wireless antenna configurations
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
US11011915B2 (en) 2016-08-26 2021-05-18 Nucurrent, Inc. Method of making a wireless connector transmitter module
EP3512987A1 (de) * 2016-09-14 2019-07-24 Modumetal, Inc. System zur erzeugung eines zuverlässigen, komplexen elektrischen hochdurchsatzfeldes und verfahren zur herstellung von beschichtungen daraus
US10424969B2 (en) 2016-12-09 2019-09-24 Nucurrent, Inc. Substrate configured to facilitate through-metal energy transfer via near field magnetic coupling
US11177695B2 (en) 2017-02-13 2021-11-16 Nucurrent, Inc. Transmitting base with magnetic shielding and flexible transmitting antenna
US10947636B2 (en) 2017-03-21 2021-03-16 Rockwell Automation Technologies, Inc. Adjustable AC/DC conversion topology to regulate an isolated DC load with low AC ripple
US11277028B2 (en) 2017-05-26 2022-03-15 Nucurrent, Inc. Wireless electrical energy transmission system for flexible device orientation
CN109468677A (zh) * 2018-12-05 2019-03-15 珠海杰赛科技有限公司 一种垂直连续电镀方法
KR102636830B1 (ko) * 2018-12-31 2024-02-14 엘지디스플레이 주식회사 전기 도금 장치 및 이를 이용한 전기 도금 방법
US11227712B2 (en) 2019-07-19 2022-01-18 Nucurrent, Inc. Preemptive thermal mitigation for wireless power systems
US11271430B2 (en) 2019-07-19 2022-03-08 Nucurrent, Inc. Wireless power transfer system with extended wireless charging range
CN110965112B (zh) * 2019-12-19 2022-02-11 漳州市福美鑫新材料科技有限公司 一种用于自动电镀设备的电镀时间调节装置
US11056922B1 (en) 2020-01-03 2021-07-06 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
US11283303B2 (en) 2020-07-24 2022-03-22 Nucurrent, Inc. Area-apportioned wireless power antenna for maximized charging volume
US11876386B2 (en) 2020-12-22 2024-01-16 Nucurrent, Inc. Detection of foreign objects in large charging volume applications
US11881716B2 (en) 2020-12-22 2024-01-23 Nucurrent, Inc. Ruggedized communication for wireless power systems in multi-device environments
US11695302B2 (en) 2021-02-01 2023-07-04 Nucurrent, Inc. Segmented shielding for wide area wireless power transmitter
KR102456239B1 (ko) * 2021-04-16 2022-10-20 주식회사 디에이피 도금장치의 이물제거장치
US12003116B2 (en) 2022-03-01 2024-06-04 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation
US11831174B2 (en) 2022-03-01 2023-11-28 Nucurrent, Inc. Cross talk and interference mitigation in dual wireless power transmitter
CN115058759B (zh) * 2022-07-04 2024-05-24 厦门海辰新材料科技有限公司 电镀设备及镀膜机
CN115058757B (zh) * 2022-07-04 2024-05-24 厦门海辰新材料科技有限公司 电镀设备及镀膜机
CN115058760B (zh) * 2022-07-04 2024-05-24 厦门海辰新材料科技有限公司 电镀设备及镀膜机

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347770A (en) * 1964-09-03 1967-10-17 Gen Dynamics Corp Area measurement and current density control device
US4459183A (en) * 1981-10-07 1984-07-10 Chemcut Corporation Electroplating apparatus and method
US4385967A (en) 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
DE3645319C3 (de) * 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
US5606534A (en) * 1989-09-01 1997-02-25 Quantronix, Inc. Laser-based dimensioning system
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
JPH0525699A (ja) 1991-07-22 1993-02-02 Hitachi Cable Ltd メツキ厚みの制御方法
JPH0535855U (ja) 1991-10-14 1993-05-14 兵庫日本電気株式会社 めつき装置
US6395163B1 (en) * 1992-08-01 2002-05-28 Atotech Deutschland Gmbh Process for the electrolytic processing especially of flat items and arrangement for implementing the process
JPH06228791A (ja) * 1992-12-07 1994-08-16 Ebara Yuujiraito Kk 電気めっき装置
JP2757328B2 (ja) 1993-06-11 1998-05-25 三菱電機株式会社 メッキ電流制御装置
DE4417551C2 (de) * 1994-05-19 1996-04-04 Atotech Deutschland Gmbh Elektrolytisches Verfahren zum präzisen Behandeln von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
ES2118640T3 (es) * 1994-11-15 1998-09-16 Siemens Sa Dispositivo para el tratamiento electrolitico de piezas en forma de placas, en especial placas para circuitos impresos.
JPH0971894A (ja) 1995-09-01 1997-03-18 Kawasaki Steel Corp 鋼帯の電気メッキ方法
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
AT406385B (de) * 1996-10-25 2000-04-25 Andritz Patentverwaltung Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern
DE19717510C1 (de) * 1997-04-25 1998-10-01 Atotech Deutschland Gmbh Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen
JP2000045099A (ja) 1998-07-28 2000-02-15 Canon Inc 電析槽、および電析装置
JP2000096299A (ja) 1998-09-21 2000-04-04 Nkk Corp 通電処理槽内の電極装置
JP2001123298A (ja) * 1999-10-25 2001-05-08 Sumitomo Metal Ind Ltd 電解めっき方法と多層配線基板とその作製方法

Also Published As

Publication number Publication date
EP1438447B1 (de) 2006-06-14
US20040245093A1 (en) 2004-12-09
AU2002348997A1 (en) 2003-05-12
DE60212426D1 (de) 2006-07-27
BR0213532A (pt) 2004-10-19
DE60212426T2 (de) 2007-05-31
MXPA04003963A (es) 2004-06-18
JP2005507463A (ja) 2005-03-17
HK1063341A1 (en) 2004-12-24
KR20050038574A (ko) 2005-04-27
DE10153171A1 (de) 2003-05-22
CN1578853A (zh) 2005-02-09
JP4268874B2 (ja) 2009-05-27
CN1325699C (zh) 2007-07-11
ES2265516T3 (es) 2007-02-16
DE10153171B4 (de) 2004-09-16
TW574434B (en) 2004-02-01
CA2454267A1 (en) 2003-05-08
KR100956536B1 (ko) 2010-05-07
US7563352B2 (en) 2009-07-21
WO2003038159A2 (en) 2003-05-08
WO2003038159A3 (en) 2003-10-09
EP1438447A2 (de) 2004-07-21

Similar Documents

Publication Publication Date Title
ATE330046T1 (de) Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken
ATE112539T1 (de) Verfahren und vorrichtung zur behandlung eines fluides unter verwendung eines kapazitiven effekts.
ATE350514T1 (de) Vorrichtung und verfahren zur elektrolytischen behandlung von elektrisch isolierten strukturen
RU96104583A (ru) Способ обработки поверхностей и устройство для его осуществления
ATE474946T1 (de) Elektrode für die behandlung von oberflächen mit elektrischen entladungen, verfahren zur behandlung von oberflächen mit elektrischen entladungen und vorrichtung zur behandlung von oberflächen mit elektrischen entladungen
BR0211270B1 (pt) dispositivo para tratamento eletrolìtico de peças e método de tratamento eletrolìtico de peças.
DE60220534D1 (de) Elektronenquelle für gerät zum behandeln von lebensmitteln und verfahren
EA200200055A1 (ru) Способ управления процессом электрохимической обработки
ATE233465T1 (de) Verfahren und vorrichtung zur stromversorgung eines über einen lichtbogen betriebenen schmelzaggregates
WO1999010568A3 (de) Vorrichtung und verfahren zum vergleichmässigen der dicke von metallschichten an elektrischen kontaktierstellen auf behandlungsgut
ATE172758T1 (de) Verfahren und vorrichtung zum elektrolytischen metallisieren oder ätzen von behandlungsgut
ATE249759T1 (de) Verfahren und vorrichtung zum konservieren von nahrungsmitteln in einem gepulsten elektrischen feld
ATE256769T1 (de) Einrichtung zur behandlung von werkstücken
ATE292842T1 (de) Verfahren und vorrichtung zur oberflächenbehandlung von substraten
DE59502709D1 (de) Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten
DE59802800D1 (de) Vorrichtung zum elektrolytischen behandeln von plattenförmigem behandlungsgut und verfahren zum elektrischen abschirmen von randbereichen des behandlungsgutes bei der electrolytischen behandlung
DE602005007022D1 (de) Vorrichtung und verfahren zur elektrolytischen behandlung von flachen werkstücken
ATE299537T1 (de) Elektrochemische behandlungsanlage und verfahren zur zuführung von strom zu elektrolytisch behandelndem leiterplattenmaterial
DE59909758D1 (de) Vorrichtung zum laserbearbeiten von werkstücken
KR890015811A (ko) 전해(電解) 다듬질 가공방법
RU185515U1 (ru) Устройство для электрохимической обработки металлических изделий токопроводящим кругом
ATE221924T1 (de) Verfahren und vorrichtung zur behandlung einer schmelze
ATE305529T1 (de) Verfahren und vorrichtung zur elektrochemisch materialabtragenden werkstückbearbeitung
DE502004009416D1 (de) Verfahren und vorrichtung zur elektrischen steuerung von prozessen in feststoffhaltigen matrices
DE59208649D1 (de) Verfahren zur verbesserung der beschichtung von elektrolytisch behandelten werkstücken, sowie anordnung zur durchführung des verfahrens

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1438447

Country of ref document: EP