DE60212426D1 - Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken - Google Patents
Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstückenInfo
- Publication number
- DE60212426D1 DE60212426D1 DE60212426T DE60212426T DE60212426D1 DE 60212426 D1 DE60212426 D1 DE 60212426D1 DE 60212426 T DE60212426 T DE 60212426T DE 60212426 T DE60212426 T DE 60212426T DE 60212426 D1 DE60212426 D1 DE 60212426D1
- Authority
- DE
- Germany
- Prior art keywords
- counter electrodes
- work pieces
- various counter
- electrolytically
- far
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Electrolytic Production Of Metals (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Forging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60212426T DE60212426T2 (de) | 2001-10-27 | 2002-10-21 | Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10153171 | 2001-10-27 | ||
DE10153171A DE10153171B4 (de) | 2001-10-27 | 2001-10-27 | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
PCT/EP2002/011764 WO2003038159A2 (en) | 2001-10-27 | 2002-10-21 | Method and conveyorized system for electrolytically processing work pieces |
DE60212426T DE60212426T2 (de) | 2001-10-27 | 2002-10-21 | Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60212426D1 true DE60212426D1 (de) | 2006-07-27 |
DE60212426T2 DE60212426T2 (de) | 2007-05-31 |
Family
ID=7703987
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10153171A Expired - Lifetime DE10153171B4 (de) | 2001-10-27 | 2001-10-27 | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
DE60212426T Expired - Lifetime DE60212426T2 (de) | 2001-10-27 | 2002-10-21 | Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10153171A Expired - Lifetime DE10153171B4 (de) | 2001-10-27 | 2001-10-27 | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
Country Status (15)
Country | Link |
---|---|
US (1) | US7563352B2 (de) |
EP (1) | EP1438447B1 (de) |
JP (1) | JP4268874B2 (de) |
KR (1) | KR100956536B1 (de) |
CN (1) | CN1325699C (de) |
AT (1) | ATE330046T1 (de) |
AU (1) | AU2002348997A1 (de) |
BR (1) | BR0213532A (de) |
CA (1) | CA2454267A1 (de) |
DE (2) | DE10153171B4 (de) |
ES (1) | ES2265516T3 (de) |
HK (1) | HK1063341A1 (de) |
MX (1) | MXPA04003963A (de) |
TW (1) | TW574434B (de) |
WO (1) | WO2003038159A2 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7241366B2 (en) * | 2004-11-30 | 2007-07-10 | Metokote Corporation | Continuous coating process |
DE102005009024B4 (de) * | 2005-02-28 | 2010-09-30 | Advanced Micro Devices Inc., Sunnyvale | Verfahren und System zum Steuern einer vertikalen Substratposition in einem elektrochemischen Prozess zur Herstellung von mikrostrukturierten integrierten Schaltungen |
WO2007116667A1 (ja) | 2006-03-29 | 2007-10-18 | Toray Industries, Inc. | 給電方法、ウェブの連続電解めっき装置およびめっき膜付きプラスチックフィルムの製造方法 |
US8815073B2 (en) | 2007-03-28 | 2014-08-26 | Toray Industries, Inc. | Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film |
JP5457010B2 (ja) * | 2007-11-01 | 2014-04-02 | アルメックスPe株式会社 | 連続めっき処理装置 |
US8313627B2 (en) * | 2008-01-24 | 2012-11-20 | GM Global Technology Operations LLC | Drag through electro-deposition system |
NL1035265C2 (nl) * | 2008-04-07 | 2009-10-08 | Meco Equip Eng | Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten. |
US9306358B2 (en) | 2009-03-09 | 2016-04-05 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
US9300046B2 (en) | 2009-03-09 | 2016-03-29 | Nucurrent, Inc. | Method for manufacture of multi-layer-multi-turn high efficiency inductors |
US8855786B2 (en) | 2009-03-09 | 2014-10-07 | Nucurrent, Inc. | System and method for wireless power transfer in implantable medical devices |
US9232893B2 (en) | 2009-03-09 | 2016-01-12 | Nucurrent, Inc. | Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication |
US9439287B2 (en) | 2009-03-09 | 2016-09-06 | Nucurrent, Inc. | Multi-layer wire structure for high efficiency wireless communication |
US11476566B2 (en) | 2009-03-09 | 2022-10-18 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
US9444213B2 (en) | 2009-03-09 | 2016-09-13 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
US9208942B2 (en) | 2009-03-09 | 2015-12-08 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
KR101149254B1 (ko) * | 2010-02-26 | 2012-05-25 | 현대제철 주식회사 | 가공물 부식 방지 기능을 갖는 와이어 방전 가공 장치 |
CN102337577B (zh) * | 2010-07-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
US8784618B2 (en) * | 2010-08-19 | 2014-07-22 | International Business Machines Corporation | Working electrode design for electrochemical processing of electronic components |
KR101242526B1 (ko) | 2010-12-14 | 2013-03-12 | (주)포인텍 | 지능형 도금용 캐리어의 제어방법 |
US20130068499A1 (en) * | 2011-09-15 | 2013-03-21 | Nucurrent Inc. | Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication |
DE102011113976A1 (de) * | 2011-09-21 | 2013-04-25 | Charlotte Schade | Elektronische Formanode zur galvanischen Metallabscheidung |
JP5795514B2 (ja) * | 2011-09-29 | 2015-10-14 | アルメックスPe株式会社 | 連続メッキ装置 |
CN102560605B (zh) * | 2011-12-29 | 2016-10-05 | 中国第一汽车股份有限公司 | 降低电泳槽液杂离子含量的工艺方法 |
CN103590079A (zh) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | 一种电镀方法 |
CN103266334B (zh) * | 2013-04-24 | 2015-12-02 | 东莞市鸿展机械设备有限公司 | 隔液传送装置 |
CN104862768B (zh) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
US9941743B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
US9948129B2 (en) | 2015-08-07 | 2018-04-17 | Nucurrent, Inc. | Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit |
US9941729B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single layer multi mode antenna for wireless power transmission using magnetic field coupling |
US9960628B2 (en) | 2015-08-07 | 2018-05-01 | Nucurrent, Inc. | Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling |
US9960629B2 (en) | 2015-08-07 | 2018-05-01 | Nucurrent, Inc. | Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US10658847B2 (en) | 2015-08-07 | 2020-05-19 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US10063100B2 (en) | 2015-08-07 | 2018-08-28 | Nucurrent, Inc. | Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling |
US11205848B2 (en) | 2015-08-07 | 2021-12-21 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
US9941590B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding |
US10636563B2 (en) | 2015-08-07 | 2020-04-28 | Nucurrent, Inc. | Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
US10985465B2 (en) | 2015-08-19 | 2021-04-20 | Nucurrent, Inc. | Multi-mode wireless antenna configurations |
CN105063709B (zh) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技(苏州)有限公司 | 印刷电路板用电镀装置 |
US10879704B2 (en) | 2016-08-26 | 2020-12-29 | Nucurrent, Inc. | Wireless connector receiver module |
US20190360116A1 (en) * | 2016-09-14 | 2019-11-28 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
US10432031B2 (en) | 2016-12-09 | 2019-10-01 | Nucurrent, Inc. | Antenna having a substrate configured to facilitate through-metal energy transfer via near field magnetic coupling |
US11177695B2 (en) | 2017-02-13 | 2021-11-16 | Nucurrent, Inc. | Transmitting base with magnetic shielding and flexible transmitting antenna |
US10947636B2 (en) | 2017-03-21 | 2021-03-16 | Rockwell Automation Technologies, Inc. | Adjustable AC/DC conversion topology to regulate an isolated DC load with low AC ripple |
US11152151B2 (en) | 2017-05-26 | 2021-10-19 | Nucurrent, Inc. | Crossover coil structure for wireless transmission |
CN109468677A (zh) * | 2018-12-05 | 2019-03-15 | 珠海杰赛科技有限公司 | 一种垂直连续电镀方法 |
KR102636830B1 (ko) * | 2018-12-31 | 2024-02-14 | 엘지디스플레이 주식회사 | 전기 도금 장치 및 이를 이용한 전기 도금 방법 |
US11227712B2 (en) | 2019-07-19 | 2022-01-18 | Nucurrent, Inc. | Preemptive thermal mitigation for wireless power systems |
US11271430B2 (en) | 2019-07-19 | 2022-03-08 | Nucurrent, Inc. | Wireless power transfer system with extended wireless charging range |
CN110965112B (zh) * | 2019-12-19 | 2022-02-11 | 漳州市福美鑫新材料科技有限公司 | 一种用于自动电镀设备的电镀时间调节装置 |
US11056922B1 (en) | 2020-01-03 | 2021-07-06 | Nucurrent, Inc. | Wireless power transfer system for simultaneous transfer to multiple devices |
CN113943966A (zh) * | 2020-07-16 | 2022-01-18 | 南通深南电路有限公司 | 一种电路板的电镀装置和电镀方法 |
US11283303B2 (en) | 2020-07-24 | 2022-03-22 | Nucurrent, Inc. | Area-apportioned wireless power antenna for maximized charging volume |
US11876386B2 (en) | 2020-12-22 | 2024-01-16 | Nucurrent, Inc. | Detection of foreign objects in large charging volume applications |
US11881716B2 (en) | 2020-12-22 | 2024-01-23 | Nucurrent, Inc. | Ruggedized communication for wireless power systems in multi-device environments |
US11695302B2 (en) | 2021-02-01 | 2023-07-04 | Nucurrent, Inc. | Segmented shielding for wide area wireless power transmitter |
KR102456239B1 (ko) * | 2021-04-16 | 2022-10-20 | 주식회사 디에이피 | 도금장치의 이물제거장치 |
US11831174B2 (en) | 2022-03-01 | 2023-11-28 | Nucurrent, Inc. | Cross talk and interference mitigation in dual wireless power transmitter |
US12003116B2 (en) | 2022-03-01 | 2024-06-04 | Nucurrent, Inc. | Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation |
CN115058760B (zh) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | 电镀设备及镀膜机 |
CN115058759B (zh) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | 电镀设备及镀膜机 |
CN115058757B (zh) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | 电镀设备及镀膜机 |
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US3347770A (en) * | 1964-09-03 | 1967-10-17 | Gen Dynamics Corp | Area measurement and current density control device |
US4385967A (en) | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
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DE3645319C3 (de) * | 1986-07-19 | 2000-07-27 | Atotech Deutschland Gmbh | Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen |
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DE3939681A1 (de) * | 1989-12-01 | 1991-06-06 | Schering Ag | Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung |
JPH0525699A (ja) | 1991-07-22 | 1993-02-02 | Hitachi Cable Ltd | メツキ厚みの制御方法 |
JPH0535855U (ja) | 1991-10-14 | 1993-05-14 | 兵庫日本電気株式会社 | めつき装置 |
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JPH06228791A (ja) * | 1992-12-07 | 1994-08-16 | Ebara Yuujiraito Kk | 電気めっき装置 |
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DE4417551C2 (de) * | 1994-05-19 | 1996-04-04 | Atotech Deutschland Gmbh | Elektrolytisches Verfahren zum präzisen Behandeln von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
DK0792391T3 (da) * | 1994-11-15 | 1999-04-12 | Siemens Sa | Apparat til elektrolytisk behandling af pladeformede materialeemner, især printplader |
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DE19612555C2 (de) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
AT406385B (de) * | 1996-10-25 | 2000-04-25 | Andritz Patentverwaltung | Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern |
DE19717510C1 (de) | 1997-04-25 | 1998-10-01 | Atotech Deutschland Gmbh | Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen |
JP2000045099A (ja) | 1998-07-28 | 2000-02-15 | Canon Inc | 電析槽、および電析装置 |
JP2000096299A (ja) | 1998-09-21 | 2000-04-04 | Nkk Corp | 通電処理槽内の電極装置 |
JP2001123298A (ja) * | 1999-10-25 | 2001-05-08 | Sumitomo Metal Ind Ltd | 電解めっき方法と多層配線基板とその作製方法 |
-
2001
- 2001-10-27 DE DE10153171A patent/DE10153171B4/de not_active Expired - Lifetime
-
2002
- 2002-10-21 MX MXPA04003963A patent/MXPA04003963A/es active IP Right Grant
- 2002-10-21 KR KR1020047002449A patent/KR100956536B1/ko active IP Right Grant
- 2002-10-21 EP EP02781274A patent/EP1438447B1/de not_active Expired - Lifetime
- 2002-10-21 WO PCT/EP2002/011764 patent/WO2003038159A2/en active IP Right Grant
- 2002-10-21 AU AU2002348997A patent/AU2002348997A1/en not_active Abandoned
- 2002-10-21 US US10/488,352 patent/US7563352B2/en not_active Expired - Lifetime
- 2002-10-21 ES ES02781274T patent/ES2265516T3/es not_active Expired - Lifetime
- 2002-10-21 CN CNB028214315A patent/CN1325699C/zh not_active Expired - Lifetime
- 2002-10-21 AT AT02781274T patent/ATE330046T1/de active
- 2002-10-21 DE DE60212426T patent/DE60212426T2/de not_active Expired - Lifetime
- 2002-10-21 BR BR0213532-9A patent/BR0213532A/pt not_active IP Right Cessation
- 2002-10-21 JP JP2003540418A patent/JP4268874B2/ja not_active Expired - Lifetime
- 2002-10-21 CA CA002454267A patent/CA2454267A1/en not_active Abandoned
- 2002-10-25 TW TW91125044A patent/TW574434B/zh not_active IP Right Cessation
-
2004
- 2004-08-11 HK HK04106024A patent/HK1063341A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60212426T2 (de) | 2007-05-31 |
HK1063341A1 (en) | 2004-12-24 |
ES2265516T3 (es) | 2007-02-16 |
KR100956536B1 (ko) | 2010-05-07 |
EP1438447A2 (de) | 2004-07-21 |
MXPA04003963A (es) | 2004-06-18 |
CN1578853A (zh) | 2005-02-09 |
US7563352B2 (en) | 2009-07-21 |
KR20050038574A (ko) | 2005-04-27 |
EP1438447B1 (de) | 2006-06-14 |
TW574434B (en) | 2004-02-01 |
WO2003038159A2 (en) | 2003-05-08 |
BR0213532A (pt) | 2004-10-19 |
DE10153171B4 (de) | 2004-09-16 |
US20040245093A1 (en) | 2004-12-09 |
JP4268874B2 (ja) | 2009-05-27 |
ATE330046T1 (de) | 2006-07-15 |
DE10153171A1 (de) | 2003-05-22 |
AU2002348997A1 (en) | 2003-05-12 |
CN1325699C (zh) | 2007-07-11 |
WO2003038159A3 (en) | 2003-10-09 |
JP2005507463A (ja) | 2005-03-17 |
CA2454267A1 (en) | 2003-05-08 |
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