ATE299293T1 - Waferelektronenentladungskontrolle - Google Patents

Waferelektronenentladungskontrolle

Info

Publication number
ATE299293T1
ATE299293T1 AT97952388T AT97952388T ATE299293T1 AT E299293 T1 ATE299293 T1 AT E299293T1 AT 97952388 T AT97952388 T AT 97952388T AT 97952388 T AT97952388 T AT 97952388T AT E299293 T1 ATE299293 T1 AT E299293T1
Authority
AT
Austria
Prior art keywords
substrate
engaging element
chuck
arrangement
substrate engaging
Prior art date
Application number
AT97952388T
Other languages
German (de)
English (en)
Inventor
Rajinder Dhindsa
Steven Franchuk
Carlos Manzanilla
Ken E Tokunaga
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE299293T1 publication Critical patent/ATE299293T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H10P72/50—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H10P72/72—
    • H10P72/722—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dowels (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AT97952388T 1996-12-19 1997-12-18 Waferelektronenentladungskontrolle ATE299293T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/769,433 US5904779A (en) 1996-12-19 1996-12-19 Wafer electrical discharge control by wafer lifter system
PCT/US1997/022799 WO1998027577A1 (en) 1996-12-19 1997-12-18 Wafer electrical discharge control by wafer lifter system

Publications (1)

Publication Number Publication Date
ATE299293T1 true ATE299293T1 (de) 2005-07-15

Family

ID=25085430

Family Applications (2)

Application Number Title Priority Date Filing Date
AT97952388T ATE299293T1 (de) 1996-12-19 1997-12-18 Waferelektronenentladungskontrolle
AT04006189T ATE389946T1 (de) 1996-12-19 1997-12-18 Waferelektroentladungskontrolle durch eine waferhebevorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT04006189T ATE389946T1 (de) 1996-12-19 1997-12-18 Waferelektroentladungskontrolle durch eine waferhebevorrichtung

Country Status (7)

Country Link
US (1) US5904779A (enExample)
EP (2) EP1435646B1 (enExample)
JP (1) JP4101299B2 (enExample)
KR (1) KR20000057603A (enExample)
AT (2) ATE299293T1 (enExample)
DE (2) DE69738590T2 (enExample)
WO (1) WO1998027577A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955858A (en) 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
JPH10284360A (ja) 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
US6177023B1 (en) 1997-07-11 2001-01-23 Applied Komatsu Technology, Inc. Method and apparatus for electrostatically maintaining substrate flatness
JP3374743B2 (ja) * 1998-03-05 2003-02-10 日本電気株式会社 基板熱処理装置及び同装置からの基板の分離方法
US6146504A (en) 1998-05-21 2000-11-14 Applied Materials, Inc. Substrate support and lift apparatus and method
JP4394778B2 (ja) * 1999-09-22 2010-01-06 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
KR100503897B1 (ko) * 2000-02-19 2005-07-25 엘지.필립스 엘시디 주식회사 건식식각 장치의 기판 파손방지 방법 및 건식식각 장치
JP3549188B2 (ja) * 2000-03-27 2004-08-04 日本エー・エス・エム株式会社 半導体基板への薄膜成膜方法
KR100378187B1 (ko) * 2000-11-09 2003-03-29 삼성전자주식회사 정전척을 구비한 웨이퍼 지지대 및 이를 이용한 웨이퍼 디척킹 방법
US6646857B2 (en) * 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
US6673636B2 (en) * 2001-05-18 2004-01-06 Applied Materails Inc. Method of real-time plasma charging voltage measurement on powered electrode with electrostatic chuck in plasma process chambers
US7232591B2 (en) * 2002-04-09 2007-06-19 Matsushita Electric Industrial Co., Ltd. Method of using an adhesive for temperature control during plasma processing
JP2005064284A (ja) * 2003-08-14 2005-03-10 Asm Japan Kk 半導体基板保持装置
US7129731B2 (en) * 2003-09-02 2006-10-31 Thermal Corp. Heat pipe with chilled liquid condenser system for burn-in testing
US20050067146A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Two phase cooling system method for burn-in testing
US20050067147A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Loop thermosyphon for cooling semiconductors during burn-in testing
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
KR20080107473A (ko) * 2004-11-04 2008-12-10 가부시키가이샤 알박 정전 척 장치
CN100362645C (zh) * 2005-12-07 2008-01-16 北京北方微电子基地设备工艺研究中心有限责任公司 顶针装置
US8270142B2 (en) * 2008-12-10 2012-09-18 Axcelis Technologies, Inc. De-clamping wafers from an electrostatic chuck
US8360844B2 (en) * 2010-03-13 2013-01-29 Marc B Schwartz Multiple wager, multiple potential winning outcome gaming platform
US9595464B2 (en) * 2014-07-19 2017-03-14 Applied Materials, Inc. Apparatus and method for reducing substrate sliding in process chambers
US11387135B2 (en) * 2016-01-28 2022-07-12 Applied Materials, Inc. Conductive wafer lift pin o-ring gripper with resistor
US20190088518A1 (en) * 2017-09-20 2019-03-21 Applied Materials, Inc. Substrate support with cooled and conducting pins
KR102547860B1 (ko) 2020-08-10 2023-06-23 세메스 주식회사 기판 지지 부재 및 이를 구비하는 기판 처리 장치 및 방법
WO2022180723A1 (ja) 2021-02-25 2022-09-01 株式会社日立ハイテク プラズマ処理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439000B1 (en) * 1990-01-25 1994-09-14 Applied Materials, Inc. Electrostatic clamp and method
JP3230821B2 (ja) * 1991-01-28 2001-11-19 株式会社東芝 プッシャーピン付き静電チャック
JP3182615B2 (ja) * 1991-04-15 2001-07-03 アネルバ株式会社 プラズマ処理方法および装置
JP3027781B2 (ja) * 1992-02-13 2000-04-04 東京エレクトロン株式会社 プラズマ処理方法
JPH05275517A (ja) * 1992-03-30 1993-10-22 Fujitsu Ltd 基板離脱方法
JP3264391B2 (ja) * 1993-05-17 2002-03-11 東京エレクトロン株式会社 静電吸着体の離脱装置
US5557215A (en) * 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
JPH06338463A (ja) * 1993-05-28 1994-12-06 Toshiba Corp 半導体製造装置
JPH077072A (ja) * 1993-06-17 1995-01-10 Anelva Corp 静電チャック装置における基板の脱着方法および脱着機構
JP2817585B2 (ja) * 1993-09-10 1998-10-30 住友金属工業株式会社 試料の離脱方法
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5535507A (en) * 1993-12-20 1996-07-16 International Business Machines Corporation Method of making electrostatic chuck with oxide insulator
US5459632A (en) * 1994-03-07 1995-10-17 Applied Materials, Inc. Releasing a workpiece from an electrostatic chuck
JP3608121B2 (ja) * 1994-03-18 2005-01-05 アネルバ株式会社 基板の機械的脱離機構およびその機構を用いた脱離方法
JPH08107139A (ja) * 1994-10-05 1996-04-23 Hitachi Ltd 絶縁性リング部材およびそれを用いた半導体製造装置
JPH08236601A (ja) * 1995-02-22 1996-09-13 Mitsubishi Electric Corp 静電チャック装置

Also Published As

Publication number Publication date
DE69738590T2 (de) 2009-04-23
KR20000057603A (ko) 2000-09-25
JP4101299B2 (ja) 2008-06-18
US5904779A (en) 1999-05-18
EP1435646A2 (en) 2004-07-07
EP1435646B1 (en) 2008-03-19
DE69733697D1 (de) 2005-08-11
EP0948805A1 (en) 1999-10-13
DE69738590D1 (de) 2008-04-30
JP2001506808A (ja) 2001-05-22
EP0948805B1 (en) 2005-07-06
ATE389946T1 (de) 2008-04-15
DE69733697T2 (de) 2006-05-24
EP1435646A3 (en) 2006-05-10
WO1998027577A1 (en) 1998-06-25

Similar Documents

Publication Publication Date Title
ATE299293T1 (de) Waferelektronenentladungskontrolle
JP5323317B2 (ja) 静電チャック方法
EP0360529B1 (en) Electrostatic chuck
US20150010381A1 (en) Wafer processing chamber and method for transferring wafer in the same
EP0205142A2 (en) Pin lift plasma processing
TW370701B (en) Monopolar electrostatic chuck having an electrode in contact with a workpiece
KR20180028488A (ko) 직류를 인터럽팅하기 위한 인터럽터 디바이스
US6185085B1 (en) System for transporting and electrostatically chucking a semiconductor wafer or the like
KR20110098814A (ko) 정전 척으로부터 웨이퍼들의 디-클램핑
KR102234220B1 (ko) 도전성의 정전척 리프트 핀, 이를 포함하는 정전척 및 이들을 이용한 반도체 생산방법
JP5089721B2 (ja) ウェハのチャッキング装置およびチャッキング方法
JP2002252275A (ja) ウエハの導通機構、導通方法及び電子ビーム近接露光装置
KR20050024579A (ko) 반도체 제조 설비의 정전척 및 이를 이용한 웨이퍼 척킹방법
TW201133696A (en) Platen to control charge accumulation
JP2002083863A (ja) 半導体設備の静電チャック駆動電源自動放電装置
JP2004319840A (ja) ウェハのチャキング装置およびチャキング方法
US11075106B2 (en) Transfer device
JP2003179222A (ja) 電力半導体を駆動するための方法
JPS55138927A (en) Photo-coupling semiconductor switch device
JPH06244146A (ja) プラズマ処理装置
JP3121893B2 (ja) 静電チャック
US3896410A (en) Rotary control
JPH08236601A (ja) 静電チャック装置
KR0146816B1 (ko) 아크 전압 자동 전환 시스템
JPH08153766A (ja) 静電チャックおよび静電チャックを備えたロボット装置

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties