ATE273556T1 - Thermistorchips und verfahren zu deren herstellung - Google Patents

Thermistorchips und verfahren zu deren herstellung

Info

Publication number
ATE273556T1
ATE273556T1 AT97116656T AT97116656T ATE273556T1 AT E273556 T1 ATE273556 T1 AT E273556T1 AT 97116656 T AT97116656 T AT 97116656T AT 97116656 T AT97116656 T AT 97116656T AT E273556 T1 ATE273556 T1 AT E273556T1
Authority
AT
Austria
Prior art keywords
metal layer
production
metal
metal layers
thermistor chips
Prior art date
Application number
AT97116656T
Other languages
English (en)
Inventor
Masahiko Kawase
Hidenobu Kimoto
Norimitsu Kito
Ikuya Taniguchi
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of ATE273556T1 publication Critical patent/ATE273556T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
AT97116656T 1996-10-09 1997-09-24 Thermistorchips und verfahren zu deren herstellung ATE273556T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8268396A JP3058097B2 (ja) 1996-10-09 1996-10-09 サーミスタチップ及びその製造方法

Publications (1)

Publication Number Publication Date
ATE273556T1 true ATE273556T1 (de) 2004-08-15

Family

ID=17457900

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97116656T ATE273556T1 (de) 1996-10-09 1997-09-24 Thermistorchips und verfahren zu deren herstellung

Country Status (7)

Country Link
US (1) US6081181A (de)
EP (1) EP0836198B1 (de)
JP (1) JP3058097B2 (de)
KR (1) KR100318251B1 (de)
AT (1) ATE273556T1 (de)
DE (1) DE69730186T2 (de)
TW (1) TW388888B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100340130B1 (ko) * 1999-11-09 2002-06-10 엄우식 정 온도 계수 서미스터와 배리스터 복합소자 및 그 제조방법
KR100329314B1 (ko) * 2000-01-13 2002-03-22 엄우식 정온도계수 서미스터와 배리스터 복합소자 및 그 제조 방법
US6755518B2 (en) * 2001-08-30 2004-06-29 L&P Property Management Company Method and apparatus for ink jet printing on rigid panels
US6498561B2 (en) * 2001-01-26 2002-12-24 Cornerstone Sensors, Inc. Thermistor and method of manufacture
TW540829U (en) * 2002-07-02 2003-07-01 Inpaq Technology Co Ltd Improved chip-type thick film resistor structure
JP4047760B2 (ja) * 2003-04-28 2008-02-13 ローム株式会社 チップ抵抗器およびその製造方法
JP2005223039A (ja) * 2004-02-04 2005-08-18 Murata Mfg Co Ltd チップ型サーミスタおよびその特性調整方法
JP2009218552A (ja) * 2007-12-17 2009-09-24 Rohm Co Ltd チップ抵抗器およびその製造方法
US8896410B2 (en) 2010-06-24 2014-11-25 Tdk Corporation Chip thermistor and method of manufacturing same
US8584348B2 (en) * 2011-03-05 2013-11-19 Weis Innovations Method of making a surface coated electronic ceramic component
JP6020502B2 (ja) 2014-03-31 2016-11-02 株式会社村田製作所 積層セラミック電子部品
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
CN108962516A (zh) * 2018-08-10 2018-12-07 广东风华高新科技股份有限公司 一种片式电阻器及其制造方法
JP2021027094A (ja) * 2019-08-01 2021-02-22 太陽誘電株式会社 積層セラミック電子部品

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645785A (en) * 1969-11-12 1972-02-29 Texas Instruments Inc Ohmic contact system
JPS62293707A (ja) * 1986-06-13 1987-12-21 株式会社村田製作所 キャップ付き電子部品
FR2620561B1 (fr) * 1987-09-15 1992-04-24 Europ Composants Electron Thermistance ctp pour le montage en surface
US4993142A (en) * 1989-06-19 1991-02-19 Dale Electronics, Inc. Method of making a thermistor
DE4029681A1 (de) * 1990-09-19 1992-04-02 Siemens Ag Verfahren zum herstellen von oberflaechenmontierbaren keramischen bauelementen in melf-technologie
US5294910A (en) * 1991-07-01 1994-03-15 Murata Manufacturing Co., Ltd. Platinum temperature sensor
JP2897486B2 (ja) * 1991-10-15 1999-05-31 株式会社村田製作所 正特性サーミスタ素子
US5257003A (en) * 1992-01-14 1993-10-26 Mahoney John J Thermistor and its method of manufacture
JPH05258906A (ja) * 1992-03-13 1993-10-08 Tdk Corp チップ型サーミスタ
US5339068A (en) * 1992-12-18 1994-08-16 Mitsubishi Materials Corp. Conductive chip-type ceramic element and method of manufacture thereof
JPH06231906A (ja) * 1993-01-28 1994-08-19 Mitsubishi Materials Corp サーミスタ
JPH06302404A (ja) * 1993-04-16 1994-10-28 Murata Mfg Co Ltd 積層型正特性サ−ミスタ
US5680092A (en) * 1993-11-11 1997-10-21 Matsushita Electric Industrial Co., Ltd. Chip resistor and method for producing the same
JPH08138902A (ja) * 1993-11-11 1996-05-31 Matsushita Electric Ind Co Ltd チップ抵抗器およびその製造方法
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element

Also Published As

Publication number Publication date
DE69730186D1 (de) 2004-09-16
JPH10116704A (ja) 1998-05-06
US6081181A (en) 2000-06-27
TW388888B (en) 2000-05-01
KR100318251B1 (ko) 2002-02-19
EP0836198B1 (de) 2004-08-11
KR19980032699A (ko) 1998-07-25
DE69730186T2 (de) 2005-09-01
EP0836198A2 (de) 1998-04-15
EP0836198A3 (de) 1999-01-07
JP3058097B2 (ja) 2000-07-04

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